LCMXO2-2000HE-5FTG256I

The LCMXO2-2000HE-5FTG256I is a MachXO2 family FPGA offering a flexible logic architecture with 2,112 logic elements and 206 user I/O pins in a 256-ball ftBGA package. It integrates embedded memory and on-chip non-volatile resources to support in-field updates and instant-on operation.

Designed for industrial applications, this surface-mount device operates from a 1.14 V to 1.26 V supply and across an extended temperature range of −40 °C to 100 °C. Its combination of I/O density, embedded RAM (75,776 total bits), and on-chip flash make it well suited to I/O-intensive glue logic, interface bridging, and embedded control functions.

Key Features

• Core Logic  2,112 logic elements provide flexible programmable logic capacity for control, glue logic, and protocol adaptation.
• Embedded Memory  Approximately 75.8 kbits (75,776 bits) of on-chip RAM for FIFOs, buffering, and small data storage needs.
• On-Chip Flash  Non-volatile user flash memory (family supports UFM) enabling single-chip, infinitely reconfigurable designs and background programming; family datasheet documents up to 100,000 write cycles for user flash.
• High I/O Density  206 I/O pins available in the 256‑LBGA package to support dense external connectivity and multiple interface standards.
• Flexible I/O Buffering  Programmable I/O buffer options and dedicated DDR registers in I/O cells support source-synchronous and differential interfaces (family-level features include LVDS, LVCMOS, and other common I/O standards).
• Clocking and PLLs  Multiple primary clocks and on-chip PLL capability (family supports analog PLLs and fractional-n synthesis) to support varied timing domains and high-speed I/O.
• Power and Packaging  Low-voltage single-supply operation (1.14 V–1.26 V), surface-mount 256‑ftBGA (17×17) package, and RoHS-compliant construction suitable for industrial-grade deployments.
• Extended Temperature Range  Rated for −40 °C to 100 °C operation for industrial environments.
• In-System Configuration and Reconfiguration  Supports multiple configuration interfaces and in-field reconfiguration capability (TransFR), enabling firmware updates while the system is operating (family feature).

Typical Applications

• Interface Bridging and Glue Logic  Use the 2,112 logic elements and 206 I/Os to implement protocol translation, bus bridging, and board-level glue logic in complex systems.
• Display and Video I/O  Programmable I/O buffering and source-synchronous I/O features (family-level display gearing and DDR support) enable display interface implementation and signal conditioning.
• Memory Interface and Buffering  On-chip RAM and dedicated FIFO control logic support buffering and local data handling for external memory interfaces and data paths.
• Embedded Control and System Glue  On-chip flash and instant-on capability simplify deployment of control logic, board initialization, and field updates without external configuration memory.

Unique Advantages

• High I/O Count in a Compact Package: 206 I/Os in a 256‑LBGA footprint enable dense connectivity without increasing board area.
• Non-Volatile, Reconfigurable Logic: On-chip user flash supports in-field updates and single-chip configuration, reducing system complexity and external memory dependencies.
• Embedded RAM for Local Data Handling: Approximately 75.8 kbits of on-chip RAM and FIFO control logic simplify buffering and real-time data processing.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Low-Voltage Operation: Single-supply operation from 1.14 V to 1.26 V supports low-power board designs and modern power domains.
• In-Field Reconfiguration: TransFR capability (family feature) allows logic updates while the system is active, enabling easier maintenance and feature upgrades.

Why Choose LCMXO2-2000HE-5FTG256I?

The LCMXO2-2000HE-5FTG256I combines a balanced logic capacity (2,112 logic elements), significant I/O resources (206 pins), and embedded non-volatile and SRAM resources (75,776 bits) in a compact 256‑LBGA package. Its industrial temperature rating and surface-mount format make it suitable for deployed control, interface, and bridging applications that require reliable, reconfigurable logic.

With on-chip flash for persistent configuration and family-level support for DDR and source-synchronous I/O, this MachXO2 device is designed to reduce external components, support in-field updates, and simplify system integration for engineering and procurement teams targeting industrial-grade programmable logic solutions.

Request a quote or submit a procurement inquiry for the LCMXO2-2000HE-5FTG256I through your preferred distributor or sourcing channel to evaluate it for your next design.