LCMXO2-2000HE-5BG256C

The LCMXO2-2000HE-5BG256C is a MachXO2 family FPGA from Lattice Semiconductor, delivered in a 256-ball package and intended for surface-mount assembly. This device integrates 2,112 logic elements, approximately 75,776 bits of embedded RAM, and 206 I/Os to address control, interface and glue-logic tasks in commercial applications.

Designed for low-power, instant-on operation and flexible I/O support, the device targets uses such as embedded system control, interface bridging, user-interface and display control, and communications equipment where compact footprint, reconfigurability and high I/O density are required. Operating voltage is specified between 1.14 V and 1.26 V with an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic – 2,112 logic elements provide configurable LUT-based logic capacity suitable for glue logic, control functions and modest programmable acceleration.
• Embedded Memory – Total on-chip RAM of 75,776 bits supports FIFOs, small buffers and distributed memory structures for system buffering and control tasks.
• I/O Density and Flexibility – 206 programmable I/Os delivered in a 256-ball package enable extensive external interface connectivity in a compact footprint.
• Power and Voltage – Single supply operation from 1.14 V to 1.26 V per device specifications; family-level architecture emphasizes low standby and operational power.
• Non-volatile Configuration and Reconfiguration – MachXO2 family features include on-chip user flash memory and instant-on, single-chip non-volatile configuration for secure, fast startup and in-field updates.
• Package and Mounting – Supplied in a 256-LFBGA package and listed supplier package 256-CABGA (14×14 mm); designed for surface-mount assembly in space-constrained systems.
• Commercial Grade Temperature – Specified for 0 °C to 85 °C operation, suitable for commercial electronics applications.
• RoHS Compliant – Device meets RoHS environmental requirements.

Typical Applications

• Consumer Electronics – Implement display controllers, user-interface logic and protocol bridging while keeping a small board footprint and flexible I/O mapping.
• Communications Equipment – Handle interface glue logic, protocol translation and low-latency control functions with a high I/O count and embedded memory for buffering.
• Embedded Control – Manage timers, state machines and peripheral control tasks using on-chip RAM and reconfigurable logic to simplify BOM and speed development.
• Prototyping and System Integration – Rapidly iterate system logic and implement in-field updates using the MachXO2 family’s non-volatile configuration and reconfiguration capabilities.

Unique Advantages

• High I/O Count in a Compact Package: 206 I/Os in a 256-ball package enable dense external connectivity without large PCB area.
• Integrated Memory for System Tasks: Approximately 75,776 bits of on-chip RAM provide storage for FIFOs, buffers and small data structures, reducing the need for external SRAM in many designs.
• Instant-On, Non-volatile Configuration: Family-level non-volatile configuration enables microsecond startup and simplifies system initialization.
• Low-power Family Architecture: MachXO2 family emphasis on low standby and operational power helps reduce overall system power consumption for battery or energy-sensitive applications.
• Surface-Mount, Industry-Ready Packaging: 256-ball package and surface-mount mounting streamline assembly for commercial production while maintaining high pin-count capability.
• Commercial Temperature Range: Specified operation from 0 °C to 85 °C ensures predictability for mainstream commercial products.

Why Choose LCMXO2-2000HE-5BG256C?

The LCMXO2-2000HE-5BG256C positions itself as a compact, reconfigurable solution for designers who need a balance of logic capacity, on-chip memory and high I/O density in a commercial-grade FPGA. Its MachXO2 family capabilities—non-volatile instant-on configuration, flexible I/O and low-power operation—make it suitable for control, interface and system-integration roles where fast boot and in-field updates matter.

This device is well suited to engineering teams seeking scalable FPGA functionality without large board area or complex power rails, offering a robust platform for designs that require flexible interfacing, embedded buffering and reprogrammable logic under a commercial operating temperature range.

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