LCMXO2-2000HE-5TG100C

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP

Quantity 1,845 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HE-5TG100C – MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP

The LCMXO2-2000HE-5TG100C is a MachXO2 family FPGA from Lattice Semiconductor, supplied in a 100-pin LQFP surface-mount package. It integrates 2,112 logic elements, approximately 75,776 bits of on-chip RAM and 79 general-purpose I/Os, making it suitable for mid-density control, glue-logic and I/O-centric applications.

Designed for commercial electronics, the device operates from a core supply range of 1.14 V to 1.26 V and across an operating temperature range of 0 °C to 85 °C. Family-level capabilities include low-power standby modes, on-chip non-volatile flash and flexible I/O and clocking resources that help simplify system integration.

Key Features

  • Core and Logic — 2,112 logic elements provide mid-density programmable logic for control, glue logic and custom peripheral implementation; internal architecture supports family-level flexible logic resources.
  • Embedded Memory — Approximately 75,776 bits of total on-chip RAM for distributed and block memory needs; family documentation also describes embedded block RAM options.
  • I/O Density & Flexibility — 79 I/Os in the 100-LQFP package; family features include programmable sysIO buffer support for a wide range of interfaces and on-chip differential termination.
  • Power — Core supply range of 1.14 V to 1.26 V; family-level low power features include very low standby power options for reduced system idle consumption.
  • Non-volatile Configuration — Family-level on-chip user flash memory and instant-on, single-chip reconfiguration enable secure, non-volatile operation and in-field updates.
  • Clocking and Timing — Family-level support for multiple primary clocks and up to two analog PLLs for flexible clock generation and synchronization.
  • Package & Mounting — 100-LQFP (14 mm × 14 mm) surface-mount package; commercial grade.
  • Environmental — RoHS compliant.

Typical Applications

  • System Glue Logic — Replace discrete glue components and CPLDs with programmable logic to consolidate control paths and reduce BOM in embedded systems.
  • I/O Expansion and Interface Bridging — Use the 79 I/Os and flexible sysIO buffering to implement protocol bridging, bus translation and custom peripheral interfaces.
  • Display and Memory Interfaces — Family-level source-synchronous I/O and dedicated DDR gearing features support display controllers and memory interface logic.
  • In-field Programmability and Updates — On-chip flash and TransFR reconfiguration enable safe field updates and system feature upgrades without hardware replacement.

Unique Advantages

  • Compact Mid-Density Integration: 2,112 logic elements and ~75,776 bits of RAM consolidate control and interface functions into a single 100-LQFP device.
  • Flexible I/O Support: Family-level programmable sysIO buffers and on-chip differential termination simplify multi-voltage and differential interface designs.
  • Non-volatile, Instant-On Configuration: On-chip user flash and single-chip configuration deliver fast start-up and in-field reprogramming capabilities.
  • Low-Power Options: Family documentation highlights ultra low standby power modes to minimize idle energy consumption.
  • Commercial-Grade, Surface-Mount Package: 100-LQFP surface-mount packaging balances board-level accessibility and routing density for mid-volume production.

Why Choose LCMXO2-2000HE-5TG100C?

The LCMXO2-2000HE-5TG100C positions itself as a versatile mid-density FPGA for designers needing a compact, reprogrammable solution with substantial I/O count and embedded memory. Its combination of 2,112 logic elements, approximately 75,776 bits of RAM and family-level features—non-volatile configuration, flexible I/O and clocking—makes it well suited for control logic, interface bridging and display/memory front-end tasks in commercial products.

With RoHS compliance, a 100-LQFP surface-mount package and an operating range of 0 °C to 85 °C, this device offers a practical balance of integration and manufacturability for a wide range of embedded applications.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LCMXO2-2000HE-5TG100C.

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