LCMXO2-2000HE-4FTG256C

The LCMXO2-2000HE-4FTG256C from Lattice Semiconductor Corporation is a MachXO2 family FPGA in a 256-ball ftBGA (17×17 mm) surface-mount package. It delivers 2,112 logic elements across 264 logic array blocks, approximately 75 kbits of on-chip RAM, and 206 user I/Os—making it suitable for control, glue logic, and interface tasks in commercial embedded systems. The device operates from a 1.14 V to 1.26 V supply and supports commercial temperature ranges (0 °C to 85 °C).

Key Features

• Core Logic  2,112 logic elements across 264 logic blocks to implement control, combinational and sequential logic functions.
• Embedded Memory  Approximately 75 kbits of on-chip RAM for FIFOs, state storage and small buffering needs.
• I/O Capacity and Flexibility  206 user I/Os in a 256-LBGA footprint for broad peripheral and bus interfacing; supports hot socketing and programmable pull modes (family-level feature).
• Power  Operates from a single supply rail (1.14 V–1.26 V) with family-level low-power options including microamp standby modes.
• Non‑volatile Configuration  MachXO2 family supports on-chip user flash and instant-on configuration options, enabling single-chip, reconfigurable solutions and in-field updates.
• Clocking and Timing  Family-level flexible clock resources and on-chip PLLs support a range of synchronous and source-synchronous interfaces.
• Package & Mounting  256-FTBGA (17×17 mm) surface-mount package, RoHS compliant for standard commercial electronics production.
• Operating Range  Commercial-grade temperature range 0 °C to 85 °C for typical embedded applications.

Typical Applications

• Peripheral Bridging and Protocol Conversion  Use programmable logic and on-chip user flash to implement SPI/I²C bridges, custom bus adapters and interface translators.
• User Interface and Display Control  Leverage the abundant I/Os and configurable I/O standards for control of displays, keypads and front-panel logic.
• System Control and Glue Logic  Implement board-level sequencing, reset controllers, and custom state machines using the device’s logic elements and embedded RAM.
• Memory and I/O Timing Management  Use integrated clocking and source-synchronous I/O features (family-level) to manage timing between processors, memory and peripherals.

Unique Advantages

• Highly integrated I/O and logic: 206 I/Os combined with 2,112 logic elements reduce external components and simplify board-level interface designs.
• On-chip memory for efficient buffering: Approximately 75 kbits of embedded RAM supports FIFOs and small data buffers without external SRAM.
• Single-supply low-voltage operation: 1.14 V–1.26 V supply simplifies power-rail planning in modern low-voltage systems.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream embedded and industrial-lite applications.
• Compact ftBGA packaging: 256-ball ftBGA (17×17 mm) allows high I/O density in a compact form factor for space-constrained designs.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and global manufacturing compliance.

Why Choose LCMXO2-2000HE-4FTG256C?

The LCMXO2-2000HE-4FTG256C positions itself as a versatile, compact FPGA option for commercial embedded designs that require a balance of logic capacity, plentiful I/O, and on-chip memory. Its MachXO2 family capabilities—such as programmable I/O standards, on-chip non‑volatile configuration options, and family-level low-power modes—make it a practical choice for control logic, protocol bridging, and interface management tasks.

Design teams needing a single-chip, reconfigurable solution with a compact ftBGA footprint will find this device well suited for board-level integration, enabling BOM reduction and simplified system designs while relying on Lattice’s MachXO2 ecosystem.

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