LCMXO2-2000ZE-1TG144C

IC FPGA 111 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 111 75776 2112 144-LQFP

Quantity 292 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O111Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-1TG144C – MachXO2 Field Programmable Gate Array (FPGA) IC 111 75776 2112 144-LQFP

The LCMXO2-2000ZE-1TG144C is a MachXO2-series FPGA IC that provides 2,112 logic elements, 111 I/Os and 75,776 bits of on-chip RAM in a 144-pin LQFP package. Designed for commercial applications, it pairs flexible programmable logic with a compact surface-mount package and low-voltage operation to address embedded control, interface bridging and low-power system functions.

Key Features

  • Programmable Logic Core 2,112 logic elements for implementing glue logic, control functions and custom digital interfaces.
  • On-chip Memory Total RAM of 75,776 bits available for distributed memory and buffering requirements.
  • I/O Density and Flexibility 111 I/O pins in the 144-LQFP package, supporting a wide mix of signals for peripheral and interface connectivity.
  • Low-Voltage Power Operates from a 1.14 V to 1.26 V supply, enabling integration into low-voltage system rails.
  • Commercial Temperature and Mounting Rated for 0 °C to 85 °C operating temperature and supplied in a surface-mount 144-LQFP (20 × 20 mm) package.
  • RoHS Compliant Meets RoHS requirements for lead-free manufacturing.
  • MachXO2 Family Capabilities As part of the MachXO2 family, the device benefits from family-level features such as low-power architecture, on-chip non-volatile options and flexible I/O and clocking capabilities as described in the MachXO2 family documentation.

Typical Applications

  • Consumer Electronics Implement user-interface control, peripheral glue logic and custom timing/handshaking in compact consumer systems.
  • Communications and Networking Provide protocol bridging and I/O expansion for network appliances and edge devices requiring moderate logic density.
  • Embedded Control Replace discrete glue logic for embedded controllers, enabling centralized programmable control and future in-field updates.
  • Display and Interface Management Manage display I/Os, input panels and board-level interface adaptation where flexible I/O and moderate memory are required.

Unique Advantages

  • High integration in a compact package: 2,112 logic elements and 111 I/Os in a 144-LQFP (20 × 20 mm) package reduce board area and component count.
  • Low-voltage operation: 1.14 V to 1.26 V supply compatibility supports modern low-voltage system architectures.
  • Ample on-chip RAM: 75,776 bits of on-chip RAM for distributed memory and buffering without external SRAM for many applications.
  • Commercial-grade suitability: Specified for 0 °C to 85 °C operation and surface-mount assembly for mainstream electronic products.
  • Family-level ecosystem: Access to MachXO2 family features—such as low-power design options, flexible I/O standards and on-chip non-volatile options—simplifies migration and design reuse.
  • Compliance and manufacturability: RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose LCMXO2-2000ZE-1TG144C?

The LCMXO2-2000ZE-1TG144C combines a practical logic density and substantial I/O count with on-chip RAM and low-voltage operation, making it well suited for compact commercial designs that require programmable control, interface adaptation or glue logic consolidation. Its 144-LQFP surface-mount package and RoHS compliance simplify integration into production assemblies.

Choosing this MachXO2 device gives designers access to family-level capabilities for low-power operation, flexible I/O and in-field reconfiguration options, supporting design scalability and reuse across product iterations.

Request a quote or submit an inquiry for pricing and availability to move your design from prototype to production.

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