LCMXO2-2000ZE-1MG132C

The LCMXO2-2000ZE-1MG132C is a MachXO2 family field programmable gate array (FPGA) in a 132-ball CSPBGA / LFBGA package. It delivers 2,112 logic elements, approximately 75 kbits of embedded RAM, and 104 I/O pins in a low-power, single-chip, non-volatile FPGA architecture.

Designed for system control, I/O-intensive interface logic and memory/display interfacing, this device emphasizes flexible I/O, on-chip non-volatile configuration and low standby power for compact commercial applications.

Key Features

• Logic Capacity — 2,112 logic element cells (LUT4-based architecture) suitable for moderate-density glue logic, control and interface functions.
• Embedded Memory — Total on-chip RAM of 75,776 bits (approximately 75 kbits) for distributed and block RAM needs; UFM (user flash memory) capacity provided by the MachXO2 family.
• I/O Count and Flexibility — 104 programmable I/Os with sysIO buffer support and on-chip options for differential termination, pull-up/pull-down modes and hot-socketing.
• Low-Voltage Operation — Core supply range of 1.14 V to 1.26 V for operation in low-voltage system environments.
• Package and Mounting — 132-ball LFBGA / CSPBGA (8×8) surface-mount package for compact board-level integration.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation.
• Low-Power and Instant-On — MachXO2 family features include ultra-low standby power and non-volatile instant-on configuration.
• On-Chip Peripherals and Configuration — Family-level features include on-chip user flash, programmable interfaces (JTAG, SPI, I2C) and background programming capability.
• Advanced I/O Protocol Support — Series-level sysIO supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL and multiple differential and memory interface standards.

Typical Applications

• System Glue Logic — Implement control, protocol translation and board-level interfacing where moderate logic density and flexible I/O are required.
• Display and Imaging Interfaces — Use pre-engineered source-synchronous I/O and gearing features for display timing and related signal conditioning.
• Memory and DDR Interfaces — Support for source-synchronous DDR-style I/O and dedicated gearing logic for interfacing with memory subsystems.
• Peripheral and Sensor Bridging — Aggregate and reformat signals between sensors, peripherals and host processors using the device's programmable I/O and embedded memory.

Unique Advantages

• Non-volatile, Instant-On Operation: The MachXO2 architecture provides single-chip non-volatile configuration for rapid power-up without external configuration memory.
• Low Standby Power: Family-level low-power process and standby modes reduce idle power consumption for energy-conscious designs.
• Flexible, High-Function I/O: 104 I/Os with programmable sysIO buffers and on-chip differential support simplifies mixed-signal and mixed-voltage interface designs.
• On-Chip Memory and Flash: Approximately 75 kbits of embedded RAM plus on-chip user flash enable compact implementations of buffering, state storage and firmware storage.
• Compact Package: 132-ball CSPBGA/LFBGA package provides a small board footprint for space-constrained commercial applications.
• Standard Configuration Interfaces: Support for industry-standard configuration and debug interfaces (JTAG, SPI, I2C) eases integration and in-field updates.

Why Choose LCMXO2-2000ZE-1MG132C?

LCMXO2-2000ZE-1MG132C combines moderate logic density, a generous I/O count and on-chip non-volatile configuration in a compact 132-ball CSPBGA package. With approximately 75 kbits of embedded RAM and family-level user flash, it supports a wide range of control and interface tasks while operating from a low core voltage of 1.14–1.26 V.

This device is well-suited for commercial embedded designs that require reliable instant-on behavior, flexible I/O protocols and a small board footprint. Its feature set supports streamlined designs where integration, low idle power and configurable I/O capability reduce overall BOM and simplify system architecture.

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