LCMXO2-2000ZE-1BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 284 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000ZE-1BG256I – MachXO2 FPGA, 2,112 logic elements, 256-LFBGA
The LCMXO2-2000ZE-1BG256I is an industrial-grade MachXO2 field programmable gate array (FPGA) in a 256-ball LFBGA package. The device combines 2,112 logic elements with on-chip embedded memory and a rich, programmable I/O set to address control, glue-logic and system-integration needs in industrial and embedded applications.
Designed for low-power operation on an advanced 65 nm process, this MachXO2 device delivers instant-on non-volatile reconfigurability, flexible I/O support and a compact 14 mm × 14 mm package for space-constrained boards that require reliable logic integration over a wide operating temperature range.
Key Features
- Core Logic — 2,112 logic elements providing the programmable fabric and 264 logic blocks for implementing glue logic, state machines and control functions.
- Embedded Memory — Approximately 75,776 bits of on-chip RAM for distributed storage and buffering.
- I/O Density & Flexibility — 206 user I/Os in the 256-LFBGA package to support wide connectivity options and board-level interfacing.
- Low-Voltage Operation — Single-supply operation between 1.14 V and 1.26 V for compatibility with low-voltage system rails.
- Industrial Temperature Range — Specified operation from −40 °C to 100 °C for industrial environments.
- Non-volatile, Reconfigurable Architecture — Family features include on-chip user flash memory and instant-on configuration with support for in-field reconfiguration methods.
- Advanced I/O Standards (family) — Programmable sysIO buffer support for a broad range of interfaces and on-chip differential termination options as described in the MachXO2 family datasheet.
- Package — 256-ball caBGA (14 × 14 mm) surface-mount package optimized for compact system designs; supplier device package listed as 256-CABGA (14×14).
- RoHS Compliant — Meets RoHS requirements for lead-free assembly.
Typical Applications
- Industrial Control — Deterministic control logic, protocol bridging and housekeeping functions across a wide temperature range for factory and process automation.
- Board-Level Glue Logic — Consolidation of discrete logic, bus interfacing and timing adaptation using the device’s programmable fabric and abundant I/Os.
- Display & Interface Control — Drive and manage display or human-machine interface (HMI) subsystems leveraging the device’s I/O density and DDR/source-synchronous I/O family capabilities.
- Memory and Peripheral Interface — Implement dedicated steering, buffering or custom peripheral interfaces using embedded RAM and programmable I/O features.
Unique Advantages
- Compact, High-I/O Package: 206 I/Os in a 256-ball 14×14 mm package enable dense board integration without sacrificing connectivity.
- Industrial-Grade Reliability: Rated for −40 °C to 100 °C operation, suitable for industrial deployments that require wide temperature tolerance.
- Low-Voltage, Low-Power Operation: Narrow supply range (1.14 V–1.26 V) and family-level low standby power characteristics support power-sensitive designs.
- On-Board Memory Resources: Approximately 75,776 bits of embedded RAM provide local buffering and FIFO capability for interface and timing tasks.
- Non-volatile Configuration: Instant-on and reconfigurable flash-based architecture (MachXO2 family) simplifies deployment and in-field updates.
- RoHS Compliance: Facilitates lead-free manufacturing and compliance with environmental requirements.
Why Choose LCMXO2-2000ZE-1BG256I?
The LCMXO2-2000ZE-1BG256I positions itself as a compact, industrial-grade FPGA well suited to system glue logic, interface control and embedded control tasks where a combination of moderate logic density, significant I/O count and reliable operation across temperature are required. Its low-voltage operation and embedded RAM make it a practical choice for power-sensitive, space-constrained designs.
By leveraging MachXO2 family features such as non-volatile configuration, flexible I/O standards and reconfiguration support, designers gain a scalable, field-updatable logic element that reduces board-level component count and simplifies system implementation and maintenance.
Request a quote or submit a purchase inquiry to receive pricing, availability and lead-time information for LCMXO2-2000ZE-1BG256I. Our team can provide volume pricing and delivery details to support your project planning.