LCMXO2-2000ZE-1FTG256C

The LCMXO2-2000ZE-1FTG256C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball low-profile BGA package. It combines reconfigurable logic, embedded memory and flexible I/O to deliver a compact, low-power platform for control, interface and glue-logic tasks.

Built on Lattice’s MachXO2 architecture, the device targets designs that require instant-on non-volatile configuration, extensive I/O, and on-chip embedded memory while operating from a 1.14 V to 1.26 V supply range within commercial temperature limits.

Key Features

• Core Capacity  Approximately 2,112 logic elements (cells) to implement glue logic, state machines and custom control functions.
• Embedded Memory  75,776 total on-chip RAM bits, suitable for small FIFOs, buffering and register storage within the FPGA fabric.
• Flexible I/O  206 I/O pins with programmable buffer options and support for low-swing differential interfaces and hot-socketing (family-level feature set).
• Low-Power Process  MachXO2 family uses an advanced 65 nm low-power process with family-level standby power as low as 22 μW and multiple power-saving modes.
• Non-Volatile Reconfiguration  Instant-on, single-chip non-volatile configuration with support for programming via JTAG, SPI and I²C and in-field TransFR reconfiguration (family capability).
• Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis (family-level feature).
• On-Chip Peripherals  Hardened functions available in the family such as SPI, I²C and timer/counter primitives that simplify system-level integration.
• Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm) surface-mount package for compact board integration.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Interface and Glue Logic  Implement protocol bridging, level translation and custom timing without adding discrete controllers.
• Peripheral and Sensor Interfacing  Aggregate and preprocess signals from sensors and peripherals using flexible I/O and on-chip RAM for buffering.
• Display and Memory I/O  Support for source-synchronous and geared display interfaces and dedicated DDR I/O features at the family level make it suitable for display and memory interface tasks.
• Control and System Management  Use on-chip timers, SPI and I²C to centralize system control and monitoring functions in a single device.

Unique Advantages

• High I/O Density: 206 I/Os reduce the need for external multiplexers or I/O expanders, simplifying board-level design.
• Compact, Low-Profile Package: 256-ball ftBGA (17 × 17 mm) keeps PCB footprint small while supporting high pin count.
• Non-Volatile, Instant-On Configuration: Built-in non-volatile configuration enables immediate operation after power-up and secure single-chip deployment.
• On-Chip Memory Resources: Approximately 75,776 bits of embedded RAM provide local storage for FIFOs, state and buffering without external memory.
• Multiple Programming Interfaces: Support for JTAG, SPI and I²C provides flexibility for manufacturing, in-field updates and system integration (family-level support).
• Commercial Temperature and RoHS Compliance: Designed for commercial applications with 0 °C to 85 °C operation and RoHS-compliant construction.

Why Choose LCMXO2-2000ZE-1FTG256C?

This MachXO2 FPGA balances reconfigurable logic capacity, dense I/O and embedded memory in a compact surface-mount 256-LBGA package. Its low-voltage operation and family-level low-power options make it a practical choice for designs that need instant-on non-volatile configuration, flexible interfacing and modest on-chip RAM.

The device is well suited for teams seeking to consolidate control, interface and buffering functions into a single programmable device, benefitting from MachXO2 family features such as hardened SPI/I²C, fractional PLLs and in-field reconfiguration to simplify system architecture and reduce BOM complexity.

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