LCMXO2-2000ZE-1MG132I

IC FPGA 104 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA

Quantity 1,670 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O104Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-1MG132I – MachXO2 Field Programmable Gate Array (FPGA), 132‑LFBGA

The LCMXO2-2000ZE-1MG132I is a MachXO2 family FPGA in a 132‑LFBGA (132‑CSPBGA 8×8) surface‑mount package designed for industrial applications. It provides a compact, non‑volatile programmable logic solution with 2,112 logic elements, 264 CLBs, and 104 general‑purpose I/Os for control, interfacing, and system glue logic.

With on‑chip memory, flexible I/O capabilities and a single low-voltage supply, this device targets embedded control and interface functions where integration, low standby power and industrial temperature operation are required.

Key Features

  • Core Logic 2,112 logic elements implemented across 264 CLBs to support mid‑density programmable logic and glue functions.
  • Embedded Memory 75,776 total RAM bits (approximately 75 kbits) of on‑chip RAM for FIFOs, small buffers and state storage.
  • I/O and Interface Flexibility 104 I/Os with programmable sysIO™ buffer support for a wide range of standards including multiple single‑ended and differential interfaces, enabling versatile signal interfacing and hot‑socketing where required.
  • Power and Supply Single low‑voltage supply range of 1.14 V to 1.26 V and family‑level low‑power design options (family data shows ultra‑low standby power modes) for energy‑sensitive applications.
  • Non‑volatile Configuration and Reconfiguration MachXO2 family supports on‑chip user flash memory, instant‑on behavior and TransFR™ in‑field reconfiguration for background updates and field flexibility.
  • Clocking and Timing Family features include multiple primary clocks and analog PLLs for flexible clock synthesis and support for source‑synchronous I/O and DDR interfaces.
  • Embedded System Functions Family‑level hardened functions such as SPI, I²C and timer/counter primitives provide basic system services without external logic.
  • Package, Mounting and Temperature 132‑LFBGA (132‑CSPBGA, 8×8) surface‑mount package; industrial grade with operating temperature range −40 °C to 100 °C.
  • Compliance RoHS‑compliant manufacturing.

Typical Applications

  • Industrial Control and Automation Implement control logic, interface bridging and I/O aggregation in industrial equipment using the device’s industrial temperature rating and flexible I/O.
  • Interface Bridging / Glue Logic Replace discrete glue components by implementing protocol adaptation, level translation and timing alignment using abundant I/Os and programmable logic.
  • Embedded System Management Use on‑chip memory, SPI/I²C support and timers for system configuration, monitoring and management functions.
  • Memory and Display Interfaces Support source‑synchronous and DDR‑style interfaces and display gearing available in the MachXO2 family to drive memory or display timing logic.

Unique Advantages

  • Compact, mid‑density integration: 2,112 logic elements and 104 I/Os in a 132‑LFBGA package reduce board area and external component count.
  • Non‑volatile instant‑on capability: On‑chip configuration memory and family‑level instant‑on behavior simplify boot sequences and eliminate external configuration flash in many designs.
  • Flexible I/O standards: Programmable sysIO buffer support for a broad set of interface standards enables reuse across multiple board designs.
  • Industrial robustness: Industrial operating range (−40 °C to 100 °C) and surface‑mount packaging support deployment in temperature‑challenging environments.
  • Field updateability: TransFR™ in‑field reconfiguration (family feature) allows logic updates while the system remains in operation, reducing maintenance downtime.
  • Integrated system primitives: On‑chip SPI, I²C and timer/counter blocks reduce BOM and simplify software/hardware integration.

Why Choose LCMXO2-2000ZE-1MG132I?

This MachXO2 device balances mid‑range logic capacity with practical system integration—combining 2,112 logic elements, roughly 75 kbits of on‑chip RAM and 104 I/Os in a small 132‑LFBGA footprint. Its industrial temperature rating and single low‑voltage supply make it suitable for embedded control, interface bridging and other applications that require compact, non‑volatile programmable logic.

Designers benefit from family‑level features such as flexible I/O standards, on‑chip configuration memory and field reconfiguration capabilities, enabling scalable, maintainable designs with reduced external components and streamlined deployment.

Request a quote or submit an RFQ to receive pricing and availability for the LCMXO2-2000ZE-1MG132I.

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