LCMXO2-2000ZE-1FTG256I

The LCMXO2-2000ZE-1FTG256I is a MachXO2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a flexible logic architecture with on-chip memory and extensive I/O to support system glue logic, interface bridging and in-field reconfiguration in industrial environments.

Key device attributes include 2,112 logic elements, 206 I/Os, 75,776 bits of on-chip RAM, a 256-pin LBGA package, an industrial temperature grade of −40 °C to 100 °C, and a single-supply voltage range of 1.14 V to 1.26 V.

Key Features

• Core Logic — 2,112 logic elements and 264 LABs provide programmable combinational and sequential resources for control, glue logic and custom peripherals.
• Embedded Memory — 75,776 bits of on-chip RAM (approximately 74 kbits) for FIFOs, buffering and small data stores; the MachXO2 family also supports on-chip user Flash options at the family level.
• Rich I/O Count — 206 I/Os available in the 256-LBGA package enable wide external connectivity for parallel and serial interfaces.
• Flexible Packaging & Mounting — Surface-mount 256-LBGA (supplier package: 256-FTBGA, 17×17) for compact board designs with high I/O density.
• Power and Supply — Single supply operation with specified voltage range from 1.14 V to 1.26 V to match system power rails.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for reliable performance in industrial applications.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s abundant I/Os and programmable logic to implement protocol converters, bus adapters and board-level interfacing.
• Peripheral and Display Control — High I/O count and family-level source-synchronous I/O support suit display, camera and peripheral interface timing requirements.
• Industrial Control and Monitoring — Industrial temperature rating and on-chip resources enable motor control interfaces, sensor aggregation and deterministic control tasks.
• Configuration and System Management — On-chip non-volatile configuration and family features such as instant-on and in-field reconfiguration support system-level firmware management and updates.

Unique Advantages

• High I/O Density: 206 general-purpose I/Os in a 256-LBGA package simplify board-level routing while supporting multiple external interfaces.
• Integrated Memory Resources: 75,776 bits of on-chip RAM reduce the need for external SRAM for small buffers and FIFOs, lowering BOM and simplifying layout.
• Industrial Operating Range: Specified for −40 °C to 100 °C, providing robustness for factory and industrial edge applications.
• Compact, Surface-Mount Package: 256-FTBGA (17×17) provides a compact footprint with high I/O count suitable for space-constrained designs.
• Single-Supply Operation: Narrow supply range (1.14 V–1.26 V) enables straightforward power design in systems using low-voltage rails.

Why Choose LCMXO2-2000ZE-1FTG256I?

The LCMXO2-2000ZE-1FTG256I positions itself as a practical, highly configurable component for designers who need moderate logic density, substantial I/O and on-chip memory in an industrial-grade FPGA. Its combination of 2,112 logic elements, ~75.8 kbits of embedded RAM and 206 I/Os in a compact 256-LBGA package makes it well suited for interface-heavy designs, system glue logic and industrial control applications.

Choosing this MachXO2 device gives design teams a balance of integration, reconfigurability and environmental robustness, backed by family-level features such as non-volatile configuration and support for in-field updates.

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