LCMXO2-2000UHE-6FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

Quantity 107 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-2000UHE-6FG484I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

The LCMXO2-2000UHE-6FG484I is a MachXO2 family FPGA offering configurable logic and extensive I/O in a compact 484-ball BGA package. It combines 2,112 logic elements with on-chip memory and flexible I/O to address interface bridging, system control, and display/memory I/O tasks where low standby power and non-volatile reconfiguration are required.

Designed for industrial applications, this device provides instant-on, non-volatile programmability and a range of on-chip system functions to simplify board-level integration and reduce external components.

Key Features

  • Logic Capacity — 2,112 logic elements and 264 CLBs provide the configurable fabric for glue logic, control functions, and custom peripherals.
  • Embedded Memory — Approximately 94,208 bits of on-chip RAM for FIFOs, buffers, and small data structures.
  • High-Density I/O — 278 I/Os available in a 484-BBGA (23 × 23 mm) package to support diverse interface requirements.
  • Flexible I/O Standards — Programmable sysIO™ buffer options and support for differential and low-swing interfaces enable a wide range of signaling choices, including DDR and display gearing modes described for the MachXO2 family.
  • On-Chip Non-Volatile Memory — Family-level support for on-chip user flash memory and background programming; family datasheet documents up to 256 kbits UFM and 100,000 write cycles for user flash.
  • Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and support for analog PLLs as documented for the MachXO2 family for frequency synthesis and high-speed I/O timing.
  • Low-Power Process — Built on the MachXO2 family’s advanced low-power process with standby and power-saving modes described in the family datasheet.
  • Industrial Temperature Range — Qualified for operation from −40°C to 100°C.
  • Supply Voltage — Operates from 1.14 V to 1.26 V.
  • Packaging & Mounting — 484-ball BGA (surface mount) package, RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Use the device’s configurable logic and extensive I/O to implement protocol conversion and board-level interfacing without external discrete components.
  • Display and Memory Interfaces — Pre-engineered source-synchronous I/O, DDR gearing and dedicated memory interface features in the MachXO2 family support display and memory timing requirements.
  • System Control and Peripheral Management — On-chip SPI, I2C and timer/counter functions enable integrated peripheral control and system housekeeping tasks.
  • Low-Power Standby and Security — Non-volatile instant-on behavior and low standby power characteristics allow use in systems that require quick resume and persistent configuration.

Unique Advantages

  • Highly Configurable Logic: 2,112 logic elements and 264 CLBs provide flexible resources for custom digital functions and state machines.
  • Extensive I/O Count: 278 I/Os in a 484-BBGA package simplify board routing and reduce the need for external translators or multiplexers.
  • Non-Volatile, Instant-On: MachXO2 family non-volatile configuration enables immediate operation at power-up and supports in-field reconfiguration.
  • On-Chip System Functions: Integrated SPI, I2C, timer/counter and on-chip oscillator reduce BOM and free up logic for application-specific features.
  • Industrial Qualification: Rated for −40°C to 100°C operation, making it suitable for demanding environments where temperature range matters.
  • Compact, RoHS-Compliant Packaging: 484-ball FBGA (23 × 23 mm) surface-mount package provides high I/O density while meeting environmental compliance requirements.

Why Choose LCMXO2-2000UHE-6FG484I?

This MachXO2 device strikes a balance between logic capacity, I/O density, and system integration for industrial embedded designs. With 2,112 logic elements, substantial on-chip RAM, and family-proven features such as on-chip user flash and flexible I/O, it is suited for designs that require reliable, non-volatile configurable logic and a broad set of interface options.

Engineers building control, interface, or display subsystems will benefit from the device’s instant-on capability, integrated system peripherals, and industrial temperature rating—providing a scalable, long-term platform with reduced external component count.

Request a quote or submit an RFQ to discuss pricing, lead times, and availability for the LCMXO2-2000UHE-6FG484I.

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