LCMXO2-2000UHE-4FG484I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA |
|---|---|
| Quantity | 397 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-2000UHE-4FG484I – MachXO2 FPGA, 2112 logic elements, 278 I/Os, 484-BBGA
The LCMXO2-2000UHE-4FG484I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 484-ball fine-pitch BGA package. It provides a mid-density, non-volatile FPGA fabric with 2,112 logic elements, approximately 94 kbits of embedded RAM, and 278 dedicated I/O pins in a surface-mount 484-BBGA (23 mm × 23 mm) package.
Designed for industrial-grade applications, this device combines instant-on non-volatile configuration, low standby power and flexible I/O support to address system control, interface bridging and in-field updatable logic functions where temperature range, integration and reconfigurability are required.
Key Features
- Core Logic 2,112 logic elements (cells) for implementing mid-density combinational and sequential logic.
- Embedded Memory Approximately 94,208 bits of on-chip RAM to support buffering, small FIFOs and state storage.
- I/O Capacity & Flexibility 278 I/Os with programmable sysIO buffer support for multiple interface standards, enabling broad signal compatibility.
- Low Voltage Operation Single supply operation between 1.14 V and 1.26 V.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for industrial applications.
- Package & Mounting Surface-mount 484-ball ftBGA package (23 mm × 23 mm) designed for high-density board integration.
- Non-Volatile Instant-On MachXO2 family features non-volatile configuration for instant-on behavior and background programming options.
- TransFR™ In-Field Reconfiguration Supports in-field logic updates while the system operates (TransFR reconfiguration).
- System-Level Functions On-chip support for SPI, I2C and timer/counter functions, plus an on-chip oscillator and unique TraceID for system tracking.
- Low-Power Operation MachXO2 family devices include ultra low power options and standby modes (family documentation cites very low standby power).
Typical Applications
- System Glue Logic Implement board-level interface bridging and control logic where a compact, reconfigurable solution and many I/Os are required.
- Interface & Protocol Conversion Use the programmable I/O buffer support to adapt signals between different logic standards and manage complex I/O requirements.
- Display and Memory Interfaces Leverage the MachXO2 family’s source-synchronous I/O and DDR-friendly features for display and memory interface control.
- In-Field Upgradable Systems Maintain and update logic functions in deployed systems using TransFR in-field reconfiguration and background programming.
Unique Advantages
- Highly integrated mid-density FPGA: Combines 2,112 logic elements with embedded RAM and a large I/O count to reduce external glue and simplify PCB design.
- Instant-on, non-volatile configuration: Powers up ready with stored configuration and supports background programming for flexible field updates.
- Extensive I/O flexibility: 278 I/Os and programmable buffer options enable support for a wide range of signaling standards without external level translators.
- Industrial robustness: Rated for −40 °C to 100 °C and supplied in a high-density 484-BBGA surface-mount package suited to industrial electronics.
- In-field reconfiguration capability: TransFR technology enables live updates to logic while the system remains operational, reducing downtime for updates.
- System-level integration: On-chip SPI, I2C and timer/counter functions lower BOM count and centralize control functions within the FPGA device.
Why Choose LCMXO2-2000UHE-4FG484I?
This MachXO2 FPGA offers a balanced combination of logic capacity, substantial I/O count and embedded memory for mid-density designs that require non-volatile configuration and in-field update capability. Its industrial temperature rating and compact 484-BBGA footprint make it suitable for space-constrained, ruggedized systems needing flexible interface support and low-power standby operation.
Engineers designing control, interface or system integration functions will benefit from the device’s integration of system-level peripherals, instant-on behavior and reconfiguration capabilities, enabling simplified BOM, easier design migration within the MachXO2 family and long-term maintainability.
If you would like pricing, availability or a formal quote for LCMXO2-2000UHE-4FG484I, please request a quote or submit an inquiry to our sales team.