LCMXO2-2000UHE-4FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

Quantity 397 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-2000UHE-4FG484I – MachXO2 FPGA, 2112 logic elements, 278 I/Os, 484-BBGA

The LCMXO2-2000UHE-4FG484I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 484-ball fine-pitch BGA package. It provides a mid-density, non-volatile FPGA fabric with 2,112 logic elements, approximately 94 kbits of embedded RAM, and 278 dedicated I/O pins in a surface-mount 484-BBGA (23 mm × 23 mm) package.

Designed for industrial-grade applications, this device combines instant-on non-volatile configuration, low standby power and flexible I/O support to address system control, interface bridging and in-field updatable logic functions where temperature range, integration and reconfigurability are required.

Key Features

  • Core Logic  2,112 logic elements (cells) for implementing mid-density combinational and sequential logic.
  • Embedded Memory  Approximately 94,208 bits of on-chip RAM to support buffering, small FIFOs and state storage.
  • I/O Capacity & Flexibility  278 I/Os with programmable sysIO buffer support for multiple interface standards, enabling broad signal compatibility.
  • Low Voltage Operation  Single supply operation between 1.14 V and 1.26 V.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for industrial applications.
  • Package & Mounting  Surface-mount 484-ball ftBGA package (23 mm × 23 mm) designed for high-density board integration.
  • Non-Volatile Instant-On  MachXO2 family features non-volatile configuration for instant-on behavior and background programming options.
  • TransFR™ In-Field Reconfiguration  Supports in-field logic updates while the system operates (TransFR reconfiguration).
  • System-Level Functions  On-chip support for SPI, I2C and timer/counter functions, plus an on-chip oscillator and unique TraceID for system tracking.
  • Low-Power Operation  MachXO2 family devices include ultra low power options and standby modes (family documentation cites very low standby power).

Typical Applications

  • System Glue Logic  Implement board-level interface bridging and control logic where a compact, reconfigurable solution and many I/Os are required.
  • Interface & Protocol Conversion  Use the programmable I/O buffer support to adapt signals between different logic standards and manage complex I/O requirements.
  • Display and Memory Interfaces  Leverage the MachXO2 family’s source-synchronous I/O and DDR-friendly features for display and memory interface control.
  • In-Field Upgradable Systems  Maintain and update logic functions in deployed systems using TransFR in-field reconfiguration and background programming.

Unique Advantages

  • Highly integrated mid-density FPGA: Combines 2,112 logic elements with embedded RAM and a large I/O count to reduce external glue and simplify PCB design.
  • Instant-on, non-volatile configuration: Powers up ready with stored configuration and supports background programming for flexible field updates.
  • Extensive I/O flexibility: 278 I/Os and programmable buffer options enable support for a wide range of signaling standards without external level translators.
  • Industrial robustness: Rated for −40 °C to 100 °C and supplied in a high-density 484-BBGA surface-mount package suited to industrial electronics.
  • In-field reconfiguration capability: TransFR technology enables live updates to logic while the system remains operational, reducing downtime for updates.
  • System-level integration: On-chip SPI, I2C and timer/counter functions lower BOM count and centralize control functions within the FPGA device.

Why Choose LCMXO2-2000UHE-4FG484I?

This MachXO2 FPGA offers a balanced combination of logic capacity, substantial I/O count and embedded memory for mid-density designs that require non-volatile configuration and in-field update capability. Its industrial temperature rating and compact 484-BBGA footprint make it suitable for space-constrained, ruggedized systems needing flexible interface support and low-power standby operation.

Engineers designing control, interface or system integration functions will benefit from the device’s integration of system-level peripherals, instant-on behavior and reconfiguration capabilities, enabling simplified BOM, easier design migration within the MachXO2 family and long-term maintainability.

If you would like pricing, availability or a formal quote for LCMXO2-2000UHE-4FG484I, please request a quote or submit an inquiry to our sales team.

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