LCMXO2-2000UHC-5FG484I

The LCMXO2-2000UHC-5FG484I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 484-ball BGA package intended for industrial applications. It provides a compact, high I/O-count programmable fabric with 2,112 logic elements and approximately 94 kbits of on-chip RAM, suited for control, interface bridging and system glue logic where high pin density and reconfigurability are required.

Key Features

• Core Logic — 2,112 logic elements and 264 LABs/CLBs provide a flexible logic resource for custom glue logic, protocol adaptation, and peripheral integration.
• On-chip Memory — Approximately 94 kbits of embedded RAM (94,208 bits) for small buffers, FIFOs and temporary storage.
• I/O Density & Flexibility — 278 I/O pins in a 484-BBGA footprint enable interface-heavy designs and high pin-count signal routing.
• Package & Mounting — 484-BBGA (supplier package 484-FBGA, 23 × 23 mm) in a surface-mount package for compact board-level integration.
• Power Supply Range — Supports 2.375 V to 3.465 V supply operation to match a variety of system power rails.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Non-volatile, Reconfigurable Family Features — As part of the MachXO2 family, the device benefits from non-volatile instant-on architecture, on-chip user flash memory (family feature), and in-field reconfiguration capabilities described in the MachXO2 family data sheet.
• RoHS Compliance — RoHS-compliant device suitable for modern manufacturing requirements.

Typical Applications

• Industrial Control — High I/O count and industrial temperature rating make the device well suited for control and monitoring modules that require dense signal interfacing and reconfigurable logic.
• Interface Bridging and Protocol Conversion — Use the FPGA fabric and abundant I/Os to bridge between disparate peripherals, implement protocol adapters, or consolidate glue logic.
• User Interfaces and Display Control — The combination of programmable logic and high I/O pin count supports display and user-interface drivers where customizable timing and signal routing are needed.
• System Glue and Platform Management — Small embedded RAM and non-volatile reconfiguration enable glue logic, configuration management, and system control functions on space-constrained PCBs.

Unique Advantages

• High I/O Density: 278 I/Os in a 23 × 23 mm 484-BBGA package reduce external multiplexing and simplify board-level routing for interface-heavy applications.
• Compact, Reconfigurable Logic: 2,112 logic elements and 264 LABs/CLBs allow designers to implement complex glue logic and custom peripheral handling without additional discrete components.
• Industrial-ready Temperature Range: Rated −40 °C to 100 °C to support deployments in industrial environments with extended thermal requirements.
• Flexible Power Integration: Wide supply range (2.375 V to 3.465 V) enables compatibility with common system rails and simplifies power architecture choices.
• RoHS Compliant: Conforms to RoHS requirements for modern manufacturing and environmental standards.
• Surface-Mount, High-Pin-Count Packaging: 484-BBGA surface-mount package offers a balance of high pin count and compact board footprint for dense designs.

Why Choose LCMXO2-2000UHC-5FG484I?

The LCMXO2-2000UHC-5FG484I positions itself as a compact, high-I/O MachXO2 family device targeted at designs that require flexible, reconfigurable logic with a large number of external interfaces. Its combination of 2,112 logic elements, substantial I/O capability, surface-mount 484-BBGA packaging, and industrial temperature rating make it suitable for system glue logic, protocol adaptation, and dense interface applications.

Designed for engineers seeking a balance of integration and configurability, this device leverages MachXO2 family features such as non-volatile reconfiguration and embedded memory to simplify board-level BOM and provide long-term design flexibility.

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