LCMXO2-2000UHC-4FG484C

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

Quantity 910 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O278Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-2000UHC-4FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

The LCMXO2-2000UHC-4FG484C is a MachXO2 family FPGA in a 484-ball BGA package designed for mid-density logic integration and high I/O count applications. It combines approximately 2,112 logic elements and roughly 94,208 bits of on-chip RAM with up to 278 user I/O to address complex glue-logic, interface bridging, and control tasks in commercial-temperature systems.

This surface-mount, RoHS-compliant device supports a single-supply voltage range from 2.375 V to 3.465 V and operates across a commercial temperature range of 0 °C to 85 °C, making it suitable for compact, board-level deployments where integration and I/O density are priorities.

Key Features

  • Core Capacity — Approximately 2,112 logic elements, providing mid-range programmable logic resources for glue logic, protocol conversion, and custom sequencing.
  • Logic Array Blocks — 264 logic array blocks supporting the device's programmable fabric and routing.
  • On-chip Memory — Approximately 94,208 bits of embedded RAM for small FIFOs, buffers, and temporary storage directly on the FPGA.
  • High I/O Count — 278 user I/Os to support dense peripheral interfacing, multi-channel I/O aggregation, and complex board interconnects.
  • Power and Voltage — Single-supply operation across 2.375 V to 3.465 V, enabling flexibility in mixed-voltage system designs.
  • Package and Mounting — 484-ball BGA (supplier device package: 484-FBGA, 23 mm × 23 mm) in a surface-mount form factor for compact PCB integration.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Interface Bridging and Protocol Conversion — Use the high I/O count and programmable logic to translate between parallel and serial buses, or to aggregate multiple peripheral interfaces.
  • Embedded System Glue Logic — Implement custom control logic, reset sequences, or timing glue between processors, memory, and peripherals using the device's logic elements and on-chip RAM.
  • Display and Panel Control — Drive display interfaces and manage front-panel I/O leveraging numerous I/Os and on-chip buffering for intermediate data handling.
  • Communications and Networking Modules — Integrate protocol handling, signal conditioning, and multi-channel I/O required in communications add-on modules and network appliances.

Unique Advantages

  • High I/O Density: 278 user I/Os enable integration of many peripherals and interfaces without external multiplexing or additional glue chips.
  • Balanced Logic and Memory: Approximately 2,112 logic elements with ~94 kbits of embedded RAM support moderate logic functions and local buffering on a single device.
  • Compact BGA Package: The 484-ball BGA (23 mm × 23 mm) offers a high-pin-count solution in a compact footprint for space-constrained designs.
  • Flexible Power Range: Single-supply operation from 2.375 V to 3.465 V makes the device adaptable to a variety of system power rails.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for mainstream electronic and consumer deployments.
  • RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing and assembly.

Why Choose LCMXO2-2000UHC-4FG484C?

The LCMXO2-2000UHC-4FG484C positions itself as a mid-density, high-I/O FPGA optimized for designs that require substantial peripheral interfacing and moderate programmable logic capacity in a single, compact package. Its combination of approximately 2,112 logic elements, roughly 94 kbits of embedded RAM, and 278 user I/Os allows designers to consolidate board-level functions and reduce component count.

Targeted at commercial-grade applications, this MachXO2 device is suitable for customers building consumer electronics, communication modules, display controllers, and embedded systems that benefit from a high-pin-count, surface-mount FPGA with a flexible supply range and RoHS compliance.

If you would like pricing, availability, or a formal quote for LCMXO2-2000UHC-4FG484C, request a quote or contact sales to submit your requirements and receive assistance.

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