LCMXO2-2000UHC-5FG484C

The LCMXO2-2000UHC-5FG484C is a MachXO2 family FPGA delivering a balanced mix of programmable logic, on-chip memory, and high-density I/O for embedded and system-level control applications. This surface-mount device provides 2,112 logic elements, 278 I/Os and 94,208 bits of on-chip RAM to support interface bridging, glue logic, and control functions in commercial-grade products.

Built for low-power, instant-on systems, the device supports flexible I/O standards and multiple configuration interfaces while operating from a single supply between 2.375 V and 3.465 V and across a 0 °C to 85 °C commercial temperature range.

Key Features

• Programmable Logic  2,112 logic elements provide the core programmable resources for implementing combinational and sequential logic, state machines, and custom interfaces.
• On-chip Memory and Flash  Approximately 94,208 bits of total RAM on-chip for buffering and state; family supports on-chip user flash memory (series capability up to 256 kbits) for non-volatile configuration and data storage.
• High-density I/O  278 general-purpose I/Os in a 484-ball BGA package enable extensive peripheral and bus connectivity for complex multi-interface designs.
• Flexible I/O Standards and Source-Synchronous Support  Programmable I/O buffer options and pre-engineered source-synchronous I/O with DDR support and display gearing provide options for high-speed interface implementations.
• Low Power and Power Management  Designed in an advanced low-power process with standby modes; family-level standby power as low as 22 μW helps minimize system power draw.
• Clocking and PLLs  On-chip clocking resources with up to two analog PLLs per device (series capability) enable frequency synthesis and flexible timing architectures.
• Configuration and Reconfiguration  Non-volatile, instant-on architecture with support for JTAG, SPI and I2C programming, background programming and in-field reconfiguration (TransFR) for firmware updates while in-system.
• Package, Supply and Environmental  484-BBGA (23×23 mm) surface-mount package; single-supply operation from 2.375 V to 3.465 V; commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded Control  Implement glue logic, protocol conversion, and system control tasks where flexible logic and on-chip RAM reduce external component count.
• Interface and I/O Expansion  High I/O density supports bridging between multiple buses and peripherals in communication and consumer equipment.
• Display and Video Front-Ends  Source-synchronous I/O and display gearing options are suited for driving or preprocessing display interfaces and timing-sensitive signals.
• Always-on and Low-power Systems  Low standby power and instant-on configuration make the device suitable for systems that require minimal idle power and fast wake-up.

Unique Advantages

• High I/O Count in a Compact BGA  278 I/Os in a 484-ball BGA provide a high pin-count option without a large PCB footprint, simplifying board-level routing for dense designs.
• Integrated Non-Volatile Configuration  On-chip flash capability and instant-on behavior remove the need for external configuration PROM in many designs, reducing BOM and boot complexity.
• Broad I/O Flexibility  Programmable I/O buffer options and source-synchronous support help accommodate a wide range of interface standards and voltage domains from a single device.
• Low-power Operation  Designed for low standby power, the device supports energy-conscious applications and helps lower overall system power consumption.
• Commercial Temperature and RoHS Compliance  Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support mainstream product deployments and regulatory requirements.

Why Choose LCMXO2-2000UHC-5FG484C?

This MachXO2 FPGA part offers a balanced, compact platform for designers needing moderate logic capacity, substantial I/O, and on-chip memory in a commercial-grade package. Its combination of 2,112 logic elements, approximately 94 kb of on-chip RAM, flexible I/O, and non-volatile configuration makes it well suited to system glue, interface control, and low-power embedded applications.

Choose this device when you need a reconfigurable, low-power solution that reduces external components while providing the I/O density and configuration flexibility required for mid-range embedded systems and interface-heavy designs.

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