LCMXO2-2000UHC-6FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

Quantity 210 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-2000UHC-6FG484I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 2112 484-BBGA

The LCMXO2-2000UHC-6FG484I is a MachXO2 family FPGA from Lattice Semiconductor designed for industrial applications that require flexible glue-logic, interface bridging and system control. It combines mid-range logic capacity with a high I/O count and embedded memory to support complex control, interface and timing functions in compact, surface-mount packages.

Built for system-level integration, this device offers a balance of programmable logic, embedded RAM and configurable I/O with an extended operating temperature range and a wide input voltage window for robust operation in industrial environments.

Key Features

  • Logic Capacity — 2112 logic elements with 264 CLBs to implement glue logic, protocol handling and control functions.
  • Embedded Memory — Total on-chip RAM of 94,208 bits (approximately 94 kbits) for FIFOs, buffers and small data stores.
  • High I/O Count — 278 I/Os to support multiple parallel interfaces, board-level interconnects and mixed-signal peripheral connections.
  • On-chip Non-volatile Configuration — MachXO2 family devices support on-chip user flash for instant-on, non-volatile configuration and in-field updates.
  • Flexible Power — Single supply operation over a wide range: 2.375 V to 3.465 V to match various system rails.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in factory and industrial environments.
  • Package and Mounting — 484-ball BGA (484-BBGA, 23 × 23 mm) surface-mount package for dense board designs.
  • System-level Features — Family-level capabilities include programmable I/O buffer standards, DDR and source-synchronous I/O support, on-chip oscillator and optional PLLs (as described in the MachXO2 family documentation).
  • RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Industrial Control — Implement glue logic, protocol bridging and control functions in factory automation and process-control equipment using the device’s industrial grade temperature rating and wide voltage range.
  • Interface and Connectivity — High I/O count supports parallel interfaces, sensor arrays and board-level interconnects in instrumentation and communications equipment.
  • Memory and Timing Support — Use embedded RAM and family DDR/DDR2/LPDDR support for buffering and memory interface control in systems that require data staging and synchronized transfers.
  • Display and Human-Machine Interfaces — Pre-engineered display gearing and source-synchronous I/O capabilities (MachXO2 family features) enable timing-sensitive display and UI glue logic.

Unique Advantages

  • Balanced Mid-range Logic: 2112 logic elements with 264 CLBs provide sufficient density for complex glue logic without the cost and power of larger FPGAs.
  • High Pin Count for Versatility: 278 I/Os enable integration of multiple peripherals and buses directly on-chip, reducing external glue components.
  • Embedded Memory for Data Handling: Approximately 94 kbits of on-chip RAM supports FIFOs, small buffers and state storage to simplify board-level memory requirements.
  • Wide Supply and Temperature Range: 2.375–3.465 V supply range and −40 °C to 100 °C operation make the device adaptable to a variety of industrial power domains and environments.
  • Compact, Surface-mount Packaging: 484-BBGA (23 × 23 mm) enables higher-density PCB designs while maintaining robust I/O and thermal characteristics.
  • Non-volatile, Instant-on Configuration: MachXO2 family on-chip configuration supports secure, single-chip instant-on operation and in-field reconfiguration workflows.

Why Choose LCMXO2-2000UHC-6FG484I?

This MachXO2 device is positioned for designers who need a mid-density, industrial-grade FPGA that blends a solid logic element count with a very high I/O capacity and on-chip RAM. Its single-supply operation, RoHS compliance and BGA packaging make it a practical choice for compact, rugged systems where board space, interface density and reliable operation across temperature are priorities.

For teams implementing interface bridging, display timing, memory buffering or control logic in industrial applications, the LCMXO2-2000UHC-6FG484I delivers configurable system-level features from the MachXO2 family with the integration and deployment options needed for scalable designs.

Request a quote or submit an inquiry today to get pricing and availability for LCMXO2-2000UHC-6FG484I.

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