LCMXO2-2000UHC-6FG484C

The LCMXO2-2000UHC-6FG484C is a MachXO2 family field programmable gate array from Lattice Semiconductor designed for mid-density, high-I/O system designs. It delivers 2,112 logic elements, approximately 94 kbits of on-chip embedded memory, and a large 278-pin I/O count in a 484-ball BGA surface-mount package.

Targeted at applications that require flexible I/O, low-power operation, and non-volatile, instant-on configurability, this commercial-grade device supports a wide supply range (2.375 V to 3.465 V) and standard commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  Provides 2,112 logic elements suitable for mid-density glue logic, control and interface functions.
• Embedded Memory  Approximately 94 kbits of on-chip RAM for FIFOs, buffering and small data stores.
• High I/O Count  278 I/Os enable extensive peripheral and bus interfacing from a single device.
• Flexible I/O Standards  MachXO2 family sysIO buffers support a wide range of interfaces (LVCMOS, LVTTL, LVDS and other programmable standards) and programmable on-chip termination and pull modes.
• Low Power Options  Family-level low-power design with standby modes; MachXO2 devices can reach ultra-low standby currents (series data cites standby as low as 22 μW).
• Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and wide input frequency support.
• Non-volatile Configuration  MachXO2 family supports single-chip, non-volatile instant-on configuration with background programming and options for SPI/I²C/JTAG programming.
• System-Level Peripherals  On-chip hardened functions include SPI, I²C and timer/counter blocks plus an on-chip oscillator for system timing needs.
• Package and Mounting  484-ball FBGA (23 mm × 23 mm) surface-mount package, RoHS compliant.
• Electrical and Environmental  Single supply operation across 2.375 V to 3.465 V and commercial operating temperature range from 0 °C to 85 °C.

Typical Applications

• Interface Bridging and Glue Logic  High I/O count and flexible I/O standards make the device well suited to consolidate protocol bridges and board-level glue logic.
• Memory and Display Interfaces  Series-level pre-engineered source-synchronous I/O and DDR/DDR2/LPDDR support enable use in memory interfaces and display timing logic.
• System Control and Peripheral Management  Embedded RAM and hardened SPI/I²C/timer functions support control tasks, device supervision and peripheral aggregation.
• Low-Power Standby Functions  On-chip power-saving modes and low standby current characteristics are useful for battery-aware and energy-conscious designs.

Unique Advantages

• High I/O Density:  278 available I/Os allow consolidation of multiple interfaces into a single device, reducing board complexity and BOM count.
• Mid-Density Logic with Embedded Memory:  2,112 logic elements paired with approximately 94 kbits of RAM provide balanced capacity for control, buffering and small data structures.
• Non-Volatile Instant-On:  Single-chip configuration enables immediate operation at power-up without external configuration memory.
• Flexible Power and Clocking:  Wide supply range and multiple on-chip clock/PLL options support diverse system timing and power architectures.
• Hardened Peripherals:  Integrated SPI, I²C and timers simplify common system functions and reduce the need for external support ICs.
• Compact Surface-Mount Package:  484-ball FBGA (23×23 mm) offers a small footprint for high-I/O count solutions while maintaining surface-mount assembly compatibility.

Why Choose LCMXO2-2000UHC-6FG484C?

The LCMXO2-2000UHC-6FG484C positions itself as a flexible, low-power mid-density FPGA option for designs that demand high I/O count, non-volatile instant-on configuration, and integrated peripheral support. With 2,112 logic elements, approximately 94 kbits of embedded memory and 278 I/Os in a compact 484-ball FBGA package, it is suitable for system control, interface consolidation, memory/display interfacing and other mid-complexity FPGA roles.

Its commercial-grade operating range, RoHS compliance, and support for a broad set of I/O standards and on-chip peripherals offer a scalable solution that can simplify board design, reduce BOM, and speed time-to-market for embedded and consumer applications.

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