LCMXO2-2000UHC-4FG484I

The LCMXO2-2000UHC-4FG484I is a MachXO2 family FPGA from Lattice Semiconductor designed for industrial-grade embedded applications. It provides a flexible LUT4-based logic fabric with 2,112 logic elements and a high pin count of 278 I/Os in a 484-ball BGA package (23 mm × 23 mm), enabling dense interface and glue logic implementations.

This device targets system control, interface bridging, and user I/O-centric designs where non-volatile, low-power logic and substantial I/O capacity are required. Its extended supply and temperature ranges support deployment in a wide range of industrial environments.

Key Features

• Logic Capacity 2,112 logic elements for implementing glue logic, state machines, and control functions within a compact FPGA architecture.
• On-chip Memory Approximately 94 kbits of total embedded RAM (94,208 bits) for distributed and block memory needs in control and buffering applications.
• High I/O Density 278 I/Os to support multiple interfaces, parallel buses, and high-pin-count peripherals without external multiplexing.
• Package & Mounting 484-ball fine-pitch BGA (23 × 23 mm) in a surface-mount footprint for space-efficient board integration.
• Voltage Range Operates from 2.375 V to 3.465 V, accommodating common 2.5 V and 3.3 V system rails.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Low Power Options (Family) MachXO2 family includes ultra low-power design techniques with standby modes and sub-milliwatt standby operation characteristics.
• Non-volatile, Instant-On (Family) Family-level support for non-volatile, instantly configurable logic for systems that require immediate availability after power-up.
• RoHS Compliant Meets RoHS requirements for reduced hazardous substance content in electronic assemblies.

Typical Applications

• Industrial Control Implement machine control logic, I/O aggregation, and real-time interfacing in industrial automation systems leveraging the device's industrial temperature rating and wide supply range.
• Interface Bridging Act as protocol or bus glue logic between peripherals and processors, using the high I/O count to reduce external components.
• Embedded System Control Integrate startup configuration, control state machines, and peripheral timers where non-volatile, instant-on behavior is valuable.
• Display and User Interfaces Drive and manage multiple user I/Os, buttons, and indicators while hosting small buffers and control logic on-chip.

Unique Advantages

• High I/O Capacity: 278 I/Os simplify board-level routing and reduce the need for external multiplexers or expanders.
• Balanced Logic and Memory: 2,112 logic elements combined with approximately 94 kbits of on-chip RAM allow compact implementation of control and buffering functions on a single device.
• Industrial Robustness: Extended operating temperature from −40 °C to 100 °C and surface-mount BGA packaging support reliable operation in demanding environments.
• Flexible Power Supply: Support for 2.375 V to 3.465 V rails enables compatibility with common system voltages and simplifies power architecture.
• Non-volatile Instant-On (Family Feature): MachXO2 family capability for immediate device availability after power-up reduces system boot time and can simplify system initialization.
• RoHS Compliance: Helps meet industry environmental requirements and aids in regulatory compliance for assembled products.

Why Choose LCMXO2-2000UHC-4FG484I?

The LCMXO2-2000UHC-4FG484I combines a mid-range logic capacity with high I/O density and on-chip memory in a compact 484-BBGA package, making it well suited for industrial and embedded applications that require dense interfacing and reliable operation across a wide temperature and supply range. Its family-level features—such as low-power standby modes and non-volatile instant-on configuration—add system-level flexibility for design reuse and rapid startup.

This device is a strong choice for engineers building control, interface, and user I/O subsystems where integration, dependable thermal performance, and a generous I/O count reduce board complexity and BOM cost.

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