LCMXO2-2000HE-6TG100I

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP

Quantity 362 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HE-6TG100I – MachXO2 FPGA, 2112 logic elements, 100‑pin LQFP

The LCMXO2-2000HE-6TG100I is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides 2,112 logic elements with on-chip memory and flexible I/O in a 100‑pin surface-mount LQFP package, targeting industrial embedded designs that require reconfigurable logic, integrated memory, and configurable interfaces.

This device combines instant-on nonvolatile configuration, programmable I/O, and low-voltage operation to support system glue logic, interface bridging, and control functions in space-constrained, industrial environments.

Key Features

  • Logic Capacity — 2,112 logic elements (logic cells) for implementing glue logic, control functions, and custom logic blocks.
  • Embedded Memory — 75,776 bits of on-chip RAM for distributed and block memory needs; family-level user flash memory options are available for nonvolatile storage.
  • I/O Resources — 79 I/O pins with programmable buffer support for a wide range of signaling requirements.
  • Power and Supply — Single-core supply operation in the range of 1.14 V to 1.26 V for logic power.
  • Package and Mounting — 100‑pin LQFP package (supplier device package indicated as 100‑TQFP, 14 × 14 mm) optimized for surface-mount PCB assembly.
  • Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for industrial applications.
  • Nonvolatile and Reconfigurable — Instant-on, single-chip nonvolatile configuration with in-field reconfiguration capability (family-level feature).
  • On-chip Peripherals (Family Features) — Hardened functions such as SPI, I²C and timer/counter are part of the MachXO2 family architecture.
  • Low Power Options (Family Features) — Advanced low-power process and standby modes with family-level standby power reported as low as 22 μW.

Typical Applications

  • Industrial Control — Implement control logic, protocol translation, and system glue in industrial automation equipment using the device’s industrial temperature rating and flexible I/O.
  • Interface Bridging — Bridge disparate interfaces and perform signal conditioning or buffering with the device’s programmable I/O and abundant I/O count.
  • Embedded System Glue — Provide peripheral aggregation, timing control, and custom logic for embedded controllers and system management functions.
  • Memory and Bus Support — Use on-chip RAM and family-level DDR/gear logic features for buffering, FIFOs, and source-synchronous interfaces where needed.

Unique Advantages

  • Reconfigurable, Instant‑On Nonvolatile Logic: Single-chip, instant-on configuration eliminates the need for external volatile configuration memory while enabling field updates.
  • Balanced Logic and Memory: 2,112 logic elements combined with 75,776 bits of on-chip RAM provides a balanced resource set for control and buffering tasks without external SRAM.
  • Flexible I/O and Interfaces: Programmable I/O supports multiple signaling standards and 79 available I/Os, simplifying interface integration and reducing external components.
  • Industrial Performance Envelope: Specified for −40 °C to 100 °C operation, meeting thermal requirements for many industrial environments.
  • Compact Surface‑Mount Package: 100‑pin LQFP (14 × 14 mm) package offers a compact footprint for space-constrained PCB designs.
  • Low‑Voltage Operation: Narrow core supply range (1.14 V to 1.26 V) suitable for designs targeting low-voltage FPGA cores and optimized power budgets.

Why Choose LCMXO2-2000HE-6TG100I?

The LCMXO2-2000HE-6TG100I positions itself as a practical, industrial-grade programmable logic device for embedded designers who need a mid-density FPGA with on-chip memory, flexible I/O, and nonvolatile configuration. Its combination of 2,112 logic elements, 75,776 bits of embedded RAM, and 79 I/Os in a compact 100‑pin package makes it well suited to system glue logic, interface bridging, and control applications where board space and reliability are important.

Because it is part of the MachXO2 family, the device benefits from family-level features such as hardened peripheral functions, low-power standby modes, and in-field reconfiguration capabilities—providing scalable, maintainable value across development and product lifecycles.

Request a quote or submit a pricing inquiry to evaluate the LCMXO2-2000HE-6TG100I for your next embedded or industrial design project.

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