LCMXO2-2000HE-6FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA

Quantity 646 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HE-6FTG256I – MachXO2 FPGA, Industrial, 256-LBGA

The LCMXO2-2000HE-6FTG256I is an industrial-grade MachXO2 field programmable gate array packaged in a 256-LBGA (256-FTBGA, 17×17) surface-mount package. It integrates 206 I/Os, 264 logic blocks (totaling 2,112 logic elements), and approximately 75,776 bits of on-chip RAM, making it suitable for control, interface, and glue-logic roles in embedded systems.

With a nominal supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require non-volatile, reconfigurable logic with robust I/O density and industrial temperature performance.

Key Features

  • Logic Capacity — 264 logic blocks totaling 2,112 logic elements to implement glue logic, finite-state machines, and small to medium FPGA functions.
  • On-chip Memory — Approximately 75,776 bits of total RAM for distributed and embedded memory needs within user logic.
  • I/O Density — 206 user I/Os available in a compact 256-LBGA package to support multiple interfaces and signal domains.
  • Power and Supply — Operates from a single supply range of 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
  • Package & Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) surface-mount package for compact board-level integration.
  • RoHS Compliance — Device is RoHS compliant, supporting environmental and regulatory requirements.
  • MachXO2 Family Capabilities — Family features include non-volatile instant-on reconfiguration, on-chip user flash memory, programmable I/O buffer support for multiple standards, embedded block RAM and distributed RAM, and on-chip peripherals such as SPI and I²C (as described in the MachXO2 family documentation).

Typical Applications

  • Interface Bridging and Protocol Conversion — Use the device’s high I/O count and flexible I/O buffering to implement parallel-to-serial bridges, protocol adapters, or custom interface logic.
  • System Control and Glue Logic — Implement control state machines, reset control, and supervisory glue logic between processors and peripherals using available logic elements and on-chip RAM.
  • Display and Memory Interface Support — Leverage MachXO2 family I/O features for display gating and source-synchronous memory interfaces in embedded display or buffering applications.
  • Embedded System Peripherals — Integrate small peripheral functions (timers, SPI/I²C interfaces) and offload tasks from the host processor to improve system determinism and reduce BOM complexity.

Unique Advantages

  • Compact, High-Pin-Count Package: 206 I/Os in a 256-LBGA footprint enable dense signal integration without a large board area penalty.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or outdoor industrial environments.
  • Non-volatile FPGA Architecture: MachXO2 family instant-on and flash-based reconfiguration support secure, single-chip solutions that power up configured without external memory.
  • Flexible I/O Support: Broad programmable I/O options from the MachXO2 family allow multiple signaling standards and hot-socketing capabilities for diverse interface requirements.
  • Reduced BOM and Integration: On-chip memory, peripheral functions, and configurable logic reduce the need for discrete glue components and help simplify system design.

Why Choose LCMXO2-2000HE-6FTG256I?

This MachXO2 device balances moderate logic capacity with high I/O density and industrial temperature capability, making it a strong choice for embedded designs that require reconfigurable logic, interface consolidation, and reliable operation across a wide temperature range. Its low-voltage supply and surface-mount 256-LBGA package simplify integration into modern low-power systems while preserving flexible on-chip resources.

Designers targeting control, interface, or peripheral offload applications will find the LCMXO2-2000HE-6FTG256I appropriate for reducing system BOM, accelerating time-to-market, and maintaining long-term configurability through flash-based reprogramming and MachXO2 family features.

Request a quote or submit a purchasing inquiry to evaluate the LCMXO2-2000HE-6FTG256I for your next embedded or industrial design.

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