LCMXO2-2000HE-6FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA |
|---|---|
| Quantity | 646 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HE-6FTG256I – MachXO2 FPGA, Industrial, 256-LBGA
The LCMXO2-2000HE-6FTG256I is an industrial-grade MachXO2 field programmable gate array packaged in a 256-LBGA (256-FTBGA, 17×17) surface-mount package. It integrates 206 I/Os, 264 logic blocks (totaling 2,112 logic elements), and approximately 75,776 bits of on-chip RAM, making it suitable for control, interface, and glue-logic roles in embedded systems.
With a nominal supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require non-volatile, reconfigurable logic with robust I/O density and industrial temperature performance.
Key Features
- Logic Capacity — 264 logic blocks totaling 2,112 logic elements to implement glue logic, finite-state machines, and small to medium FPGA functions.
- On-chip Memory — Approximately 75,776 bits of total RAM for distributed and embedded memory needs within user logic.
- I/O Density — 206 user I/Os available in a compact 256-LBGA package to support multiple interfaces and signal domains.
- Power and Supply — Operates from a single supply range of 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- Package & Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) surface-mount package for compact board-level integration.
- RoHS Compliance — Device is RoHS compliant, supporting environmental and regulatory requirements.
- MachXO2 Family Capabilities — Family features include non-volatile instant-on reconfiguration, on-chip user flash memory, programmable I/O buffer support for multiple standards, embedded block RAM and distributed RAM, and on-chip peripherals such as SPI and I²C (as described in the MachXO2 family documentation).
Typical Applications
- Interface Bridging and Protocol Conversion — Use the device’s high I/O count and flexible I/O buffering to implement parallel-to-serial bridges, protocol adapters, or custom interface logic.
- System Control and Glue Logic — Implement control state machines, reset control, and supervisory glue logic between processors and peripherals using available logic elements and on-chip RAM.
- Display and Memory Interface Support — Leverage MachXO2 family I/O features for display gating and source-synchronous memory interfaces in embedded display or buffering applications.
- Embedded System Peripherals — Integrate small peripheral functions (timers, SPI/I²C interfaces) and offload tasks from the host processor to improve system determinism and reduce BOM complexity.
Unique Advantages
- Compact, High-Pin-Count Package: 206 I/Os in a 256-LBGA footprint enable dense signal integration without a large board area penalty.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or outdoor industrial environments.
- Non-volatile FPGA Architecture: MachXO2 family instant-on and flash-based reconfiguration support secure, single-chip solutions that power up configured without external memory.
- Flexible I/O Support: Broad programmable I/O options from the MachXO2 family allow multiple signaling standards and hot-socketing capabilities for diverse interface requirements.
- Reduced BOM and Integration: On-chip memory, peripheral functions, and configurable logic reduce the need for discrete glue components and help simplify system design.
Why Choose LCMXO2-2000HE-6FTG256I?
This MachXO2 device balances moderate logic capacity with high I/O density and industrial temperature capability, making it a strong choice for embedded designs that require reconfigurable logic, interface consolidation, and reliable operation across a wide temperature range. Its low-voltage supply and surface-mount 256-LBGA package simplify integration into modern low-power systems while preserving flexible on-chip resources.
Designers targeting control, interface, or peripheral offload applications will find the LCMXO2-2000HE-6FTG256I appropriate for reducing system BOM, accelerating time-to-market, and maintaining long-term configurability through flash-based reprogramming and MachXO2 family features.
Request a quote or submit a purchasing inquiry to evaluate the LCMXO2-2000HE-6FTG256I for your next embedded or industrial design.

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