LCMXO2-2000HE-6BG256I

The LCMXO2-2000HE-6BG256I is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor. It delivers a flexible logic architecture with 2,112 logic elements and a broad set of system-level features to address interface bridging, glue logic and system control tasks.

Designed for industrial applications, this surface-mount device combines a high I/O count and on-chip RAM with low-voltage operation and extended temperature capability to support robust embedded designs and mixed-signal interfacing.

Key Features

• Core Logic — 2,112 logic elements providing the programmable fabric for glue logic, state machines and custom peripherals.
• Logic Blocks — 264 logic blocks to structure the device’s logic resources for modular design implementation.
• On‑Chip RAM — Approximately 75,776 bits of total on-chip RAM for FIFOs, small buffers and state storage.
• High I/O Density — 206 general-purpose I/O pins to support wide connectivity and multiple parallel interfaces.
• Low‑Voltage Operation — Single supply range of 1.14 V to 1.26 V for core power delivery.
• Industrial‑Grade Temperature — Specified for operation from −40 °C to 100 °C for deployment in demanding environments.
• Package & Mounting — 256‑LFBGA package (supplier package 256‑CABGA, 14×14 mm) in a surface‑mount form factor for compact board layouts.
• System Features (MachXO2 Family) — Family-level capabilities include flexible I/O standards, non-volatile configuration options and on-chip peripherals for system integration.
• RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control — Industrial-temperature rating and robust logic/I/O count make this part suitable for sensor interfacing, motor-control logic and machine control glue functions.
• Interface Bridging — High I/O density and flexible on-chip logic enable protocol translation, bus bridging and system glue between heterogeneous subsystems.
• Embedded System Glue — On-chip RAM and logic capacity support small FIFOs, state machines and peripheral control in embedded controllers.
• Low‑Power Designs — Low-voltage core operation supports power-sensitive applications that require standby or reduced-power modes.

Unique Advantages

• Balanced Logic and I/O — 2,112 logic elements with 206 I/Os provide a practical mix of programmable logic and connectivity for mid-density integration without external glue chips.
• Compact, Surface‑Mount Package — 256‑LFBGA (14×14 mm) enables a small board footprint while preserving a high I/O count.
• Industrial Reliability — Specified for −40 °C to 100 °C and designated as industrial grade for deployment in harsher operating environments.
• On‑Chip Memory for System Functions — Approximately 75.8 kbits of RAM supports buffering, FIFOs and small data structures directly inside the FPGA.
• Low‑Voltage Core — Narrow core supply range (1.14–1.26 V) that aligns with modern low-voltage system rails.
• Regulatory Compliance — RoHS compliance helps meet environmental requirements for manufactured products.

Why Choose LCMXO2-2000HE-6BG256I?

The LCMXO2-2000HE-6BG256I positions itself as a versatile mid-density FPGA that balances logic capacity, a high I/O count and on-chip RAM in a compact 256‑LFBGA package. Its industrial temperature rating and surface-mount form factor make it well suited for embedded and industrial designs that require reliable interface logic and in-field configurability.

Engineers looking to reduce BOM complexity, consolidate discrete glue logic, or implement flexible interface functions will find the device’s combination of logic elements, I/Os and system-level features valuable for both prototype and production deployments.

Request a quote or submit a quote today to evaluate the LCMXO2-2000HE-6BG256I for your next embedded or industrial design.