LCMXO2-2000HE-6MG132C

The LCMXO2-2000HE-6MG132C is a MachXO2 family field programmable gate array (FPGA) in a 132‑LFBGA (CSPBGA) surface-mount package. It provides 2,112 logic elements, 104 general-purpose I/Os and 75,776 bits of on-chip RAM for compact, reconfigurable logic and control tasks.

Targeted for commercial applications, this device combines a small-footprint BGA package with a low-voltage core supply (1.14 V to 1.26 V) and an operating temperature range of 0 °C to 85 °C, offering integration and flexibility for system control, interface bridging and logic consolidation.

Key Features

• Core Logic: 2,112 logic elements (cells) suitable for implementing medium-density FPGA functions and custom glue logic.
• On-chip Memory: 75,776 total RAM bits that provide distributed and embedded memory resources for buffering, LUT storage and small data structures.
• I/O Count & Packaging: 104 I/O pins in a 132‑LFBGA (132‑CSPBGA, 8×8) surface-mount package for dense, board-level connectivity.
• Power Supply: Single-core voltage range of 1.14 V to 1.26 V to match low-voltage system domains.
• Temperature & Grade: Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free manufacturing.
• MachXO2 Family Capabilities: Family-level features include non-volatile on-chip user flash memory, low-power standby options, programmable I/O buffers supporting a wide range of interfaces, and flexible clocking and PLL resources.

Typical Applications

• System Control Logic: Consolidate discrete glue logic and control functions into a single reconfigurable device for compact designs.
• Interface Bridging: Implement protocol adaptation and signal conditioning using the device’s rich I/O and configurable logic resources.
• Display and Memory Interfaces: Leverage family-level source-synchronous and DDR I/O support for display or memory interface front-ends.
• Embedded Feature Integration: Use on-chip memory and logic to add timers, SPI/I²C interfaces or other control functions without external components.

Unique Advantages

• Compact, High‑Density Package: 132‑ball CSPBGA package enables a small PCB footprint while providing 104 I/Os for mid-density designs.
• Reconfigurable On‑Board Logic: 2,112 logic elements allow designers to implement custom logic, state machines and interface glue in a single device.
• Significant On‑Chip Memory: 75,776 bits of embedded RAM reduce the need for external memory for buffering and small data storage.
• Low‑Voltage Operation: 1.14 V to 1.26 V core supply supports integration into modern low-voltage systems.
• Commercial‑Grade Availability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics applications.
• Family Ecosystem: Access to MachXO2 family features such as non-volatile configuration and configurable I/O standards for design portability within the series.

Why Choose LCMXO2-2000HE-6MG132C?

The LCMXO2-2000HE-6MG132C offers a balanced combination of logic capacity, embedded memory and I/O density in a compact 132‑LFBGA package, making it well suited for commercial designs that require reconfigurable control, interface bridging or feature consolidation. Its low-voltage core and RoHS compliance align with modern PCB power and manufacturing practices.

Designers seeking medium-density FPGA functionality with on-chip RAM and flexible I/O options will find this MachXO2 device a practical choice for reducing BOM complexity and enabling scalable implementations across the MachXO2 family.

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