LCMXO2-2000HE-6TG100C

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP

Quantity 717 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HE-6TG100C – MachXO2 Field Programmable Gate Array (FPGA) IC, 79 I/O, 75,776 bits RAM, 2,112 logic elements, 100-LQFP

The LCMXO2-2000HE-6TG100C is a MachXO2 family FPGA offering 2,112 logic elements and approximately 75,776 bits of on-chip RAM in a 100-pin LQFP package. Designed as a low-power, non-volatile FPGA, it provides a flexible logic architecture and a broad set of on-chip peripherals suitable for control, interface bridging and system integration in commercial applications.

This device combines a compact surface-mount package with 79 general I/O pins, a single-chip non-volatile configuration approach and low standby power characteristics, enabling designers to implement glue logic, memory interfaces and display or I/O-intensive functions while minimizing external components.

Key Features

  • Core Logic – 2,112 logic elements providing a flexible LUT-based architecture suitable for implementing combinatorial and sequential logic functions.
  • Embedded Memory – Approximately 75,776 bits of total on-chip RAM to support FIFOs, small buffers and soft-state storage.
  • I/O Capacity and Flexibility – 79 I/O pins available in the 100-pin package; programmable I/O buffer options and programmable pull modes support varied interface needs.
  • On-Chip Non-volatile Memory – Family-level support for on-chip user Flash memory and background programming capabilities, enabling instant-on operation and secure single-chip configuration.
  • Low Power – Implements an advanced low-power process with family-level standby power as low as 22 μW and multiple power-saving modes.
  • Clocking and PLLs – Flexible on-chip clocking resources including primary clocks and PLL options for fractional-n frequency synthesis and a wide input frequency range.
  • Embedded Peripherals – Hardened system functions on the family level such as SPI, I2C and timer/counter blocks for common control tasks.
  • Package and Mounting – Surface-mount 100-LQFP package; supplier device package listed as 100-TQFP (14 × 14).
  • Electrical and Environmental – Supply voltage range listed as 1.14 V to 1.26 V and operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Display and Video Interfaces – Use the MachXO2 family’s source-synchronous I/O and gearing features to manage display timing and parallel/DDR interfaces.
  • Memory Interface Control – Implement dedicated DDR/DDR2/LPDDR style memory logic and FIFO buffering using the device’s embedded RAM and dedicated FIFO control logic.
  • System Glue Logic – Replace discrete logic with a compact FPGA for protocol translation, bus bridging and I/O aggregation using the 79 available I/Os.
  • Configuration and Control – Leverage on-chip Flash and hardened SPI/I2C blocks to store configuration or act as a light-weight control subsystem.

Unique Advantages

  • Non-volatile, instant-on operation: On-chip user Flash enables single-chip configuration and rapid power-up without external configuration memory.
  • Compact integration: 2,112 logic elements and 79 I/Os in a 100-pin surface-mount package reduce BOM and PCB real estate compared with multi-chip solutions.
  • Low standby power: Family-level low-power design supports micro-watt standby modes to minimize idle energy consumption.
  • Versatile I/O standards support: Programmable I/O buffer features and on-chip termination options provide interface flexibility for mixed-signal systems.
  • Embedded peripherals: Built-in SPI, I2C and timer/counter blocks reduce the need for additional controller ICs for common system functions.
  • Commercial-grade robustness: Specified for commercial operation with a 0 °C to 85 °C ambient temperature range and RoHS compliance.

Why Choose LCMXO2-2000HE-6TG100C?

The LCMXO2-2000HE-6TG100C positions itself as a compact, low-power, non-volatile FPGA option for commercial designs that require flexible logic, embedded memory and a range of on-chip peripherals. With 2,112 logic elements, approximately 75,776 bits of RAM and 79 I/Os in a 100-pin surface-mount package, it is well suited for designers seeking to consolidate glue logic, memory interface control and display or I/O handling into a single device.

Its family-level features—on-chip Flash, low standby power, programmable I/O behavior and hardened SPI/I2C/timer functions—provide a scalable platform for long-term designs that benefit from reduced component count, simplified configuration and a broad set of integration options.

Request a quote or submit a product inquiry to obtain pricing, availability and lead-time details for the LCMXO2-2000HE-6TG100C.

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