LCMXO2-256ZE-3SG32C

The LCMXO2-256ZE-3SG32C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 32‑pin UFQFN exposed pad surface-mount package. This commercial‑grade device provides a compact, low‑voltage programmable logic solution with 256 logic elements and 21 general-purpose I/Os for space‑constrained embedded designs.

Designed for commercial embedded systems, the device combines a small footprint and low supply-voltage operation to address glue-logic, interface control and other on-board programmable logic tasks where a compact, reprogrammable solution is required.

Key Features

• Core Logic — 256 logic elements (cells) providing programmable combinational and sequential logic capacity for control and glue‑logic functions.
• Logic Blocks — 32 logic blocks documented for this device, enabling structured allocation of logic resources.
• I/O Count — 21 general-purpose I/Os in the 32‑UFQFN package for signal interfacing and GPIO requirements.
• Memory — No embedded RAM on this device (Total RAM Bits: 0), suitable for designs that use external memory or implement state in logic elements.
• Power and Supply — Operates from a low supply-voltage range of 1.14 V to 1.26 V, enabling compatibility with low‑voltage system rails.
• Package — 32‑UFQFN exposed pad (5 mm × 5 mm) surface-mount package for compact PCB layouts and thermal conduction through exposed pad.
• Operating Range — Commercial operating temperature range of 0 °C to 85 °C, aligned with typical commercial embedded applications.
• Compliance — RoHS compliant, meeting standard lead‑free and material requirements for commercial electronics.

Typical Applications

• Board-level glue logic — Replace discrete logic for address decoding, bus interfacing and control sequencing in compact boards using the device's 256 logic elements.
• Interface bridging — Implement custom signal routing and protocol bridging using the 21 I/Os in a small QFN footprint.
• Control and timing functions — Use the programmable logic to handle device control, timing, and simple state machines in commercial embedded products.
• Prototype and evaluation — Small, reprogrammable FPGA ideal for rapid development and iteration in commercial product design cycles.

Unique Advantages

• Compact, surface-mount package: The 32‑UFQFN (5×5) exposed pad package minimizes PCB area while providing good thermal conduction for board-level designs.
• Low-voltage operation: 1.14 V to 1.26 V supply requirement enables integration into modern low-voltage systems and simplifies power rail planning.
• Right-sized logic capacity: 256 logic elements deliver sufficient programmable resources for glue logic, interface adaptation and control tasks without overprovisioning.
• Commercial temperature suitability: Rated 0 °C to 85 °C for typical commercial electronic products and environments.
• RoHS compliant: Aligns with lead‑free manufacturing requirements for commercial electronics production.

Why Choose LCMXO2-256ZE-3SG32C?

The LCMXO2-256ZE-3SG32C positions itself as a practical, compact FPGA option for commercial embedded designers who need a small-footprint, low-voltage programmable device. With 256 logic elements and 21 I/Os in a 32‑pin UFQFN exposed pad package, it is well suited to replace discrete logic, implement custom interfaces, and accelerate prototyping without consuming significant board area.

Choosing this MachXO2 device provides designers a reprogrammable solution that fits low-power, space-constrained designs and leverages the MachXO2 family architecture documented in the device datasheet for straightforward density and package migration within the family.

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