LCMXO2-256ZE-3SG32I

The LCMXO2-256ZE-3SG32I is a MachXO2 family Field Programmable Gate Array (FPGA) in a compact 32‑UFQFN exposed‑pad package. It provides a flexible, low‑power programmable logic option with approximately 256 logic elements and 21 general‑purpose I/Os for industrial applications.

Designed for space‑constrained boards and industrial operating conditions, this surface‑mount device is targeted at system control, interface bridging and I/O expansion where small footprint, low power and reliable operation across −40 °C to 100 °C are required.

Key Features

• Logic Capacity  Approximately 256 logic elements suitable for glue logic, control sequencing and small to medium‑complexity state machines.
• I/O  21 user I/Os provide flexible interfacing for peripherals, sensors and external devices.
• Power Supply  Operates from a 1.14 V to 1.26 V core supply range, enabling integration with 1.2 V system rails.
• Package & Mounting  32‑UFQFN exposed pad (supplier package described as 32‑QFN, 5 × 5 mm) in a surface‑mount form factor for compact PCB layouts and thermal anchoring.
• Industrial Grade Temperature  Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• On‑Chip Memory (Family)  MachXO2 family devices include embedded and distributed memory options; consult family datasheet for device‑specific memory offerings.
• Low Power (Family)  MachXO2 family offers ultra low power design choices and standby modes; refer to the MachXO2 family documentation for details on power saving options.
• Standards & Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• Industrial Control  Use for control logic, state machines and signal conditioning in automation equipment that requires industrial temperature range and robust I/O.
• Interface Bridging  Act as a protocol or voltage‑level translator and glue logic between peripherals and host controllers using its flexible I/O resources.
• Embedded System Glue Logic  Integrate reset control, clock distribution assistants and custom peripheral control in compact system designs.
• Sensor and Peripheral Aggregation  Centralize simple sensor handling, debouncing, and peripheral aggregation where low logic capacity and small package footprint are preferred.

Unique Advantages

• Compact, thermally capable package: The 32‑UFQFN exposed pad delivers a small PCB footprint with improved thermal dissipation for dense board designs.
• Industrial temperature rating: Guaranteed operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Low‑voltage core operation: The 1.14 V–1.26 V supply range enables direct compatibility with 1.2 V system rails common in modern embedded platforms.
• Right‑sized logic and I/O: Approximately 256 logic elements and 21 I/Os provide a balanced solution for control, interface and glue logic without excess cost or board area.
• RoHS compliant: Meets environmental compliance needs for contemporary product builds.
• Family ecosystem: MachXO2 family features (configurable I/O buffering, low‑power modes and on‑chip configuration options) provide migration and scalability paths—see MachXO2 family documentation for details.

Why Choose LCMXO2-256ZE-3SG32I?

The LCMXO2-256ZE-3SG32I combines a compact QFN exposed‑pad package, industrial temperature capability and a practical complement of logic and I/Os for board‑level control and interface tasks. Its low‑voltage operation and surface‑mount package make it well suited to space‑constrained embedded systems that require reliable performance in industrial environments.

Engineers seeking a small, cost‑effective programmable logic device with straightforward interfacing and industrial robustness will find this MachXO2 device a strong fit. The broader MachXO2 family support provides options for designers who may scale capacity or access additional family‑level features as designs evolve.

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