LCMXO2-256ZE-3TG100C

The LCMXO2-256ZE-3TG100C is a MachXO2 family FPGA IC from Lattice Semiconductor Corporation. It provides 256 logic elements in a compact 100‑pin LQFP surface‑mount package with 55 general‑purpose I/Os, targeting commercial electronic designs that require flexible glue logic, interface control and system integration.

This device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant and offered in a 100‑pin (14 mm × 14 mm) LQFP/TQFP package for board‑level deployment.

Key Features

• Logic Capacity — 256 logic elements that support small to medium complexity glue-logic and control tasks.
• General-Purpose I/O — 55 user I/Os provided in a 100‑pin package for flexible interfacing to peripherals and external logic.
• Voltage and Temperature — Single-supply operation from 1.14 V to 1.26 V; commercial operating range from 0 °C to 85 °C.
• Memory and Configuration — Device specification lists no embedded RAM bits; MachXO2 family documentation describes on-chip user flash memory options across the family (family-level capability).
• Low-Power Family Technologies — MachXO2 family data highlights an advanced 65 nm low‑power process and standby power optimization (family-level information).
• System Integration — Family-level features include on-chip support for SPI, I²C and timers/counters, enabling tighter system-level integration and reduced external components.
• Package and Mounting — 100‑pin LQFP (supplier lists 100‑TQFP 14×14) surface‑mount package for standard PCB assembly.
• Compliance — RoHS compliant, suited to commercial product supply chains.

Typical Applications

• Interface and Glue Logic — Use for protocol bridging, bus adaptation and custom control logic where a compact FPGA with 55 I/Os simplifies board design.
• Control and Sequencing — Implement finite state machines, control state sequencers and peripheral management in commercial electronic products.
• User Interface Control — Drive and manage button scanning, LED control, and basic display interfaces using the device’s I/O resources and family-level support functions.
• Prototyping and Functional Replacement — Replace discrete glue components or prototype digital functions on a single reprogrammable device.

Unique Advantages

• Compact, Ready-to-Place Package — 100‑pin LQFP/TQFP package enables high-density board layouts while keeping assembly straightforward.
• Low Supply Voltage — 1.14 V to 1.26 V operation supports modern low-voltage system domains and power-optimized designs.
• Flexible I/O Count — 55 I/Os provide broad connectivity for peripherals, sensors and external logic without needing additional interface chips.
• Family-Level System Functions — Access to MachXO2 family features such as SPI, I²C, timers and on-chip oscillator can reduce external component count and simplify firmware/partitioning.
• Commercial Temperature Rating — Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic product requirements.
• Regulatory-Friendly — RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose LCMXO2-256ZE-3TG100C?

This MachXO2 device delivers a practical combination of reprogrammable logic (256 logic elements), a sizable set of general-purpose I/Os (55 pins) and a compact 100‑pin surface‑mount package for commercial electronic designs. Its low-voltage operation and family-level system integration features make it well suited for designers looking to consolidate glue logic, implement control functions, or add flexible interfacing without large BOM increases.

Engineers designing commercial products that require reliable, reprogrammable logic with straightforward I/O capacity and standard package choices will find the LCMXO2-256ZE-3TG100C a suitable option that aligns with system-level integration and supply-chain requirements.

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