LCMXO2-4000HC-5MG132I

The LCMXO2-4000HC-5MG132I is a MachXO2 family FPGA in a 132‑LFBGA (8×8) package, offering 4320 logic elements and 104 general-purpose I/Os. Designed for industrial-grade embedded systems, this device combines non-volatile instant-on configuration, flexible I/O support and on-chip memory to address interface bridging, glue logic and control functions in space-constrained designs.

Key Features

• Core Logic — 4320 logic elements providing a flexible logic architecture suitable for mid-density FPGA tasks.
• On-chip Memory — Total RAM of 94,208 bits (approximately 94 kbits) of embedded and distributed memory for temporary data storage and FIFOs.
• Non-volatile User Flash — Family support for on-chip user flash memory and background programming enables single-chip, infinitely reconfigurable designs and instant-on operation.
• I/O Capability — 104 I/Os with programmable sysIO buffer support for a wide range of interfaces and on-chip differential termination options.
• Power and Supply — Single power supply operating across 2.375 V to 3.465 V to support a range of system voltages.
• Clocking and PLLs — Family-level support for up to two analog PLLs with fractional-n synthesis and a wide input frequency range (7 MHz to 400 MHz) for flexible clocking architectures.
• System Functions — Hardened peripherals in the family include SPI, I2C and timer/counter, plus on-chip oscillator and IEEE 1149.1 boundary scan support.
• Reconfiguration and Security — TransFR in-field logic update capability, optional dual-boot with external SPI memory and One Time Programmable (OTP) mode for system tracking and secure boot strategies.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial-grade deployments.
• Package — 132‑ball csBGA / CSPBGA (8×8) package for compact board integration in space‑constrained applications.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s flexible I/O buffering and programmable I/O standards to consolidate and manage protocol translation and board-level glue logic.
• Embedded Control and Industrial Automation — Hardened I2C/SPI and timer/counter functions with industrial temperature rating make it suitable for control logic and automation subsystems.
• Memory and Display Interfaces — Pre-engineered source-synchronous I/O, DDR support and dedicated gearing for display I/Os enable display controllers and memory interface glue.
• Secure Configuration and Field Updates — On-chip user flash, TransFR reconfiguration and OTP options support secure firmware storage and in-field updates.

Unique Advantages

• Instant-on, Non-volatile Operation: On-chip user flash provides immediate configuration at power-up, simplifying system startup and reducing external component count.
• Flexible I/O and Protocol Support: Programmable sysIO buffers and on-chip differential termination allow diverse interface standards without extensive external circuitry.
• Compact Industrial Packaging: The 132‑LFBGA (8×8) CSPBGA package delivers a small footprint solution compliant with industrial temperature requirements, enabling dense board designs.
• Field Upgradability: TransFR reconfiguration enables in-field logic updates while the system remains operational, reducing maintenance windows and improving product longevity.
• Integrated System Functions: Hardened SPI, I2C, timer/counter and on-chip oscillator reduce BOM and simplify common system tasks.

Why Choose LCMXO2-4000HC-5MG132I?

The LCMXO2-4000HC-5MG132I positions itself as a versatile, industrial-grade FPGA choice for mid-density logic and interface applications. With 4320 logic elements, approximately 94 kbits of on-chip RAM, 104 I/Os and family-level features such as on-chip user flash, TransFR reconfiguration and hardened peripherals, it delivers a compact, single-chip solution for designs that require instant-on configuration, flexible I/O and field update capability.

This part is well suited to designers seeking a balance of integration, configurability and industrial temperature operation, enabling reduced BOM, simplified board-level design and sustained product support across deployment lifecycles.

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