LCMXO2-4000HC-5FTG256I

The LCMXO2-4000HC-5FTG256I is a MachXO2 family FPGA from Lattice Semiconductor designed for I/O‑rich, low‑power system functions. It provides a flexible logic architecture with integrated memory and configurable I/O to serve as glue logic, interface bridge, or control fabric in industrial embedded systems.

With 4,320 logic elements, approximately 94 kbits of on‑chip RAM, and 206 user I/Os in a 256‑ball LBGA package, this device balances integration and configurability for designs that need broad I/O support, nonvolatile configuration and a compact surface‑mount footprint.

Key Features

• Flexible Logic Architecture MachXO2 family architecture enabling adaptable logic implementation; this part provides 4,320 logic elements for implementing custom control and glue logic.
• Embedded Memory Total on‑chip RAM of 94,208 bits (approximately 94 kbits) for distributed memory and small data buffers.
• On‑Chip User Flash Family support for on‑chip user flash memory (up to 256 kbits) for nonvolatile configuration and in‑field updates.
• High I/O Count 206 user I/Os with programmable buffer options to support a wide range of interfaces and signaling styles.
• Programmable I/O Standards Family sysIO buffer support for multiple interfaces (including LVCMOS and differential standards) and programmable pull modes and termination.
• Clocking and PLLs Family features include up to two analog PLLs and multiple primary clocks for flexible timing and clocking architectures.
• Low Power Options MachXO2 family includes ultra low power modes and standby options to reduce system power consumption.
• Package and Mounting 256‑LBGA package (supplier package: 256‑FTBGA, 17 × 17 mm) with surface‑mount mounting for compact board designs.
• Wide Voltage and Temperature Range Operates from 2.375 V to 3.465 V and specified for industrial temperatures from −40 °C to 100 °C.
• Standards and Manufacturing RoHS‑compliant manufacturing and industry‑grade specification.

Typical Applications

• Industrial Control — Use as programmable control logic and interface glue in industrial systems where extended temperature range and robust I/O are required.
• Interface Bridging — Implement protocol translation, bus bridging or custom I/O mapping using the device's 206 configurable I/Os and programmable buffer support.
• Consumer and Embedded Systems — Integrate system control, peripheral management and configuration storage using on‑chip user flash and embedded RAM.
• Display and Memory Interfaces — Leverage family I/O gearing and DDR/DDR2/LPDDR support for source‑synchronous or display I/O applications where timing and dedicated I/O features are valuable.

Unique Advantages

• Highly Configurable I/O: 206 programmable I/Os and sysIO buffer options simplify integration with a wide range of peripherals and signaling standards.
• Nonvolatile, Reconfigurable Operation: On‑chip user flash enables single‑chip, secure instant‑on configurations and in‑field updates without external configuration memory.
• Compact, Surface‑Mount Package: 256‑LBGA (256‑FTBGA, 17×17) delivers high I/O density in a board‑friendly surface‑mount form factor.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Single Supply Flexibility: Broad supply range (2.375–3.465 V) allows integration into diverse power architectures.

Why Choose LCMXO2-4000HC-5FTG256I?

The LCMXO2-4000HC-5FTG256I combines a flexible MachXO2 family architecture with a high I/O count, built‑in nonvolatile configuration memory and embedded RAM—offering a compact, reconfigurable solution for designs that need dependable I/O interfacing and in‑field update capability. Its industrial temperature rating and surface‑mount 256‑LBGA package make it suitable for space‑constrained, ruggedized applications.

Designers who require integrated configuration, extensive I/O options and moderate logic capacity will find this device appropriate for glue logic, interface adaptation, and system control roles. The combination of family features—programmable I/O standards, on‑chip flash, and flexible clocking—provides a scalable platform for evolving designs.

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