LCMXO2-4000HC-5BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 1,070 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-5BG332I – MachXO2 Field Programmable Gate Array, 4320 logic elements, 274 I/Os
The LCMXO2-4000HC-5BG332I is a MachXO2 family FPGA offering 4320 logic elements and a high I/O count in a 332-ball FBGA package. It combines reconfigurable logic, embedded memory and on-chip non-volatile Flash to address industrial and embedded applications that require flexible interfacing, in-field updates, and extended temperature operation.
Designed for systems that need high integration and deterministic I/O capability, this device targets use cases such as protocol bridging, display and memory interface support, and general-purpose system glue logic where reliability and reconfigurability are important.
Key Features
- Core Logic Provides 4320 logic elements for implementing custom combinational and sequential logic functions.
- Embedded and Distributed Memory Includes a total of 94,208 bits of on-chip RAM (approximately 94 kbits) for FIFOs, buffering, and small data storage.
- High I/O Count Supports 274 I/Os, enabling complex interfacing and multi-channel connectivity in a single device.
- On-Chip Non-Volatile Memory MachXO2 family on-chip user Flash supports in-field reconfiguration and background programming for persistent designs.
- Flexible I/O Buffering Family-level I/O features include programmable buffer standards and differential I/O support suitable for a wide range of interfaces.
- Clocking and PLLs Family architecture provides flexible on-chip clocking with up to two analog PLLs for fractional-n frequency synthesis and multiple primary clocks.
- Low Power Options MachXO2 family devices support low-power modes with standby power as low as 22 μW (family value) and programmable power saving options.
- Package and Mounting 332-ball FBGA package (332-FBGA) in a 332-CABGA (17×17) footprint; surface-mount mounting type for compact board integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
- Supply Voltage Range Operates across a single supply range of 2.375 V to 3.465 V for flexible system power designs.
- Standards & Programming MachXO2 family supports instant-on, JTAG/SPI/I²C programming and TransFR™ reconfiguration for in-field logic updates (family-level capabilities).
- RoHS Compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- Protocol Bridging and System Glue Use the device’s abundant I/Os and reconfigurable logic to consolidate interface translation and glue logic between subsystems.
- Display & Video Interfaces Leverage family support for source-synchronous I/O and gearing features to implement display timing, serialization or parallel-to-serial conversions.
- Memory Interface Control On-chip DDR/DDRx and dedicated FIFO control logic in the family enable buffering and memory interface management tasks.
- Embedded Control & HMI Implement SPI, I²C and timer/counter functions alongside custom control logic for human-machine interfaces and embedded controllers.
Unique Advantages
- High integration in a single device: Combines 4320 logic elements, approximately 94 kbits of on-chip RAM and 274 I/Os to reduce external components and simplify BOM.
- Industrial-ready operation: Rated from −40 °C to 100 °C to support industrial environments and extended-temperature systems.
- Flexible power and supply options: Wide supply range (2.375 V to 3.465 V) and family-level low-power modes help adapt the device to diverse power architectures.
- Reconfigurable, non-volatile logic: On-chip user Flash and TransFR™ family capabilities allow secure, in-field updates and instant-on operation.
- Extensive system-level support: Hardened SPI, I²C and timer/counter functions (family features) simplify common peripheral control and reduce design effort.
- Scalable package density: 332-ball FBGA footprint offers a compact, high-density option compatible with MachXO2 family migration paths.
Why Choose LCMXO2-4000HC-5BG332I?
The LCMXO2-4000HC-5BG332I positions MachXO2 family capabilities—reconfigurable logic, on-chip Flash, significant embedded RAM and a high I/O count—in an industrial-grade, compact FBGA package. It is suited for designers who need a flexible, reprogrammable device for complex interfacing, protocol conversion, display or memory control and system glue functions.
Its combination of logic density, memory, and family-level system features provides a scalable, maintainable platform for mid-density FPGA applications where long-term field reconfiguration and robust operation across temperature and supply conditions are required.
Request a quote or submit an inquiry to purchase the LCMXO2-4000HC-5BG332I and evaluate how its combination of logic, memory and I/O capacity can simplify your next design.