LCMXO2-4000HC-5BG332I

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 1,070 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case332-FBGANumber of I/O274Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HC-5BG332I – MachXO2 Field Programmable Gate Array, 4320 logic elements, 274 I/Os

The LCMXO2-4000HC-5BG332I is a MachXO2 family FPGA offering 4320 logic elements and a high I/O count in a 332-ball FBGA package. It combines reconfigurable logic, embedded memory and on-chip non-volatile Flash to address industrial and embedded applications that require flexible interfacing, in-field updates, and extended temperature operation.

Designed for systems that need high integration and deterministic I/O capability, this device targets use cases such as protocol bridging, display and memory interface support, and general-purpose system glue logic where reliability and reconfigurability are important.

Key Features

  • Core Logic  Provides 4320 logic elements for implementing custom combinational and sequential logic functions.
  • Embedded and Distributed Memory  Includes a total of 94,208 bits of on-chip RAM (approximately 94 kbits) for FIFOs, buffering, and small data storage.
  • High I/O Count  Supports 274 I/Os, enabling complex interfacing and multi-channel connectivity in a single device.
  • On-Chip Non-Volatile Memory  MachXO2 family on-chip user Flash supports in-field reconfiguration and background programming for persistent designs.
  • Flexible I/O Buffering  Family-level I/O features include programmable buffer standards and differential I/O support suitable for a wide range of interfaces.
  • Clocking and PLLs  Family architecture provides flexible on-chip clocking with up to two analog PLLs for fractional-n frequency synthesis and multiple primary clocks.
  • Low Power Options  MachXO2 family devices support low-power modes with standby power as low as 22 μW (family value) and programmable power saving options.
  • Package and Mounting  332-ball FBGA package (332-FBGA) in a 332-CABGA (17×17) footprint; surface-mount mounting type for compact board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
  • Supply Voltage Range  Operates across a single supply range of 2.375 V to 3.465 V for flexible system power designs.
  • Standards & Programming  MachXO2 family supports instant-on, JTAG/SPI/I²C programming and TransFR™ reconfiguration for in-field logic updates (family-level capabilities).
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Protocol Bridging and System Glue  Use the device’s abundant I/Os and reconfigurable logic to consolidate interface translation and glue logic between subsystems.
  • Display & Video Interfaces  Leverage family support for source-synchronous I/O and gearing features to implement display timing, serialization or parallel-to-serial conversions.
  • Memory Interface Control  On-chip DDR/DDRx and dedicated FIFO control logic in the family enable buffering and memory interface management tasks.
  • Embedded Control & HMI  Implement SPI, I²C and timer/counter functions alongside custom control logic for human-machine interfaces and embedded controllers.

Unique Advantages

  • High integration in a single device: Combines 4320 logic elements, approximately 94 kbits of on-chip RAM and 274 I/Os to reduce external components and simplify BOM.
  • Industrial-ready operation: Rated from −40 °C to 100 °C to support industrial environments and extended-temperature systems.
  • Flexible power and supply options: Wide supply range (2.375 V to 3.465 V) and family-level low-power modes help adapt the device to diverse power architectures.
  • Reconfigurable, non-volatile logic: On-chip user Flash and TransFR™ family capabilities allow secure, in-field updates and instant-on operation.
  • Extensive system-level support: Hardened SPI, I²C and timer/counter functions (family features) simplify common peripheral control and reduce design effort.
  • Scalable package density: 332-ball FBGA footprint offers a compact, high-density option compatible with MachXO2 family migration paths.

Why Choose LCMXO2-4000HC-5BG332I?

The LCMXO2-4000HC-5BG332I positions MachXO2 family capabilities—reconfigurable logic, on-chip Flash, significant embedded RAM and a high I/O count—in an industrial-grade, compact FBGA package. It is suited for designers who need a flexible, reprogrammable device for complex interfacing, protocol conversion, display or memory control and system glue functions.

Its combination of logic density, memory, and family-level system features provides a scalable, maintainable platform for mid-density FPGA applications where long-term field reconfiguration and robust operation across temperature and supply conditions are required.

Request a quote or submit an inquiry to purchase the LCMXO2-4000HC-5BG332I and evaluate how its combination of logic, memory and I/O capacity can simplify your next design.

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