LCMXO2-4000HC-5BG332C

The LCMXO2-4000HC-5BG332C is a MachXO2 family FPGA in a 332-ball FBGA package (supplier package: 332-CABGA, 17×17). It provides a mid-density, non-volatile FPGA fabric with 4,320 logic elements and 274 I/O pins for system glue logic, interface bridging, and custom peripheral control.

Designed for commercial-temperature applications, the device supports a supply range of 2.375 V to 3.465 V, is RoHS compliant, and is offered in a surface-mount 332-FBGA package. The MachXO2 family delivers low-power operation, on-chip configuration and system-level functions that simplify integration into embedded designs.

Key Features

• Core Logic — 4,320 logic elements (cells) providing flexible LUT-based logic for glue, control and state-machine implementations.
• On-chip Memory — Total on-chip RAM of 94,208 bits for distributed and block memory use within designs.
• I/O Density — 274 general-purpose I/Os in a 332-ball FBGA footprint to support wide bus widths and multiple peripheral interfaces.
• Supply & Temperature — Single-supply operation from 2.375 V to 3.465 V and commercial operating range of 0 °C to 85 °C.
• Packaging & Mounting — Surface-mount 332-FBGA package (supplier package: 332-CABGA, 17×17) for compact board-level integration.
• Family-Level System Features — MachXO2 family capabilities include ultra-low power standby options, on-chip user flash memory, dedicated FIFO control logic, programmable sysIO buffers, and hardened interfaces such as SPI and I2C.
• Compliance — RoHS-compliant device suitable for environmentally conscious design and manufacturing.

Typical Applications

• Display and Video I/O — Implements source-synchronous and geared display interfaces using the MachXO2 family’s pre‑engineered display gearing and DDR-capable I/O registers.
• Memory Interface and Buffering — Acts as a memory interface bridge or FIFO controller leveraging on-chip RAM and dedicated FIFO control logic.
• Peripheral Bridging and System Glue Logic — Consolidates multiple buses and protocols with 274 I/Os and on-chip hardened functions such as SPI and I2C for sensor and peripheral integration.
• Secure Configuration and Boot Management — Uses non-volatile configuration and background programming features for instant-on operation and flexible boot options at system-level.

Unique Advantages

• High I/O Count: 274 I/Os enable broad peripheral connectivity and wide parallel interfaces without external IO expanders.
• Integrated Logic and Memory: 4,320 logic elements paired with 94,208 bits of on-chip RAM reduces external component count and simplifies board design.
• Compact, Surface-Mount Package: 332-FBGA (17×17 CABGA) packaging delivers high density in a compact footprint for space-constrained products.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, appropriate for a wide range of commercial embedded applications.
• Single-Supply Flexibility: Operates across a broad supply range (2.375 V to 3.465 V) to accommodate different system voltage domains.
• Family-Level Low Power and System Support: MachXO2 family features such as ultra-low standby power, on-chip flash, and hardened interfaces reduce BOM and accelerate time-to-market.

Why Choose LCMXO2-4000HC-5BG332C?

The LCMXO2-4000HC-5BG332C is positioned as a flexible, mid-density non-volatile FPGA solution for designs that require substantial I/O, integrated on-chip memory, and reliable configuration options. Its combination of 4,320 logic elements, 94,208 bits of RAM and 274 I/Os in a compact 332-FBGA package makes it well-suited for system glue, interface bridging, display I/O and embedded control tasks within commercial-temperature products.

Choosing this MachXO2 device brings the long-term value of an FPGA family that emphasizes low-power modes, on-chip configuration and system-level primitives (SPI, I2C, timers) to simplify integration, reduce external components and accelerate development cycles.

Request a quote or submit an inquiry to evaluate the LCMXO2-4000HC-5BG332C for your next embedded design.