LCMXO2-4000HC-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 68 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HC-5BG256I – MachXO2 Field Programmable Gate Array (FPGA)

The LCMXO2-4000HC-5BG256I is a MachXO2 series FPGA from Lattice Semiconductor, delivering flexible on-chip logic and I/O resources in a 256-ball LFBGA package. Designed for industrial-grade applications, the device integrates thousands of logic elements, embedded memory, and a broad range of programmable I/O options to address glue logic, interface bridging, and system control tasks.

This device supports a single power supply range of 2.375 V to 3.465 V and operates across an industrial temperature range of -40 °C to 100 °C, making it suitable for long-life embedded systems that require non-volatile, reconfigurable logic and diverse I/O capabilities.

Key Features

  • Core Logic Approximately 4,320 logic elements provide the configurable logic fabric needed for glue logic, state machines, and custom peripheral functions.
  • Embedded Memory Approximately 94 kbits of on-chip RAM (94,208 bits total) for distributed storage and buffering within user logic.
  • I/O Density & Flexibility 206 I/Os available in the 256-ball package with programmable sysIO buffer support across multiple signaling standards, enabling diverse interface implementations.
  • On-Chip Non-Volatile Storage Family-level on-chip user flash memory (series supports up to 256 kbits) for instant-on configuration and field updates via supported interfaces.
  • Clocking and PLLs Family devices offer multiple primary clocks and up to two analog PLLs for flexible clock management and fractional-n frequency synthesis.
  • High-Speed I/O Support Pre-engineered source-synchronous I/O with DDR registers in I/O cells and gearing support for display and memory interfaces (family features include DDR/DDR2/LPDDR-related support).
  • Power and Reliability Single-supply operation across 2.375 V–3.465 V and industrial temperature rating (-40 °C to 100 °C); RoHS compliant.
  • Package 256-ball caBGA / LFBGA footprint (14 mm × 14 mm) for compact board integration while providing high I/O count.

Typical Applications

  • Interface Bridging and Glue Logic Use the FPGA to consolidate multiple peripherals, perform protocol translation, and implement custom control logic between subsystems.
  • Display and Video I/O Gearing and DDR I/O support from the family enable signal conditioning and timing adaptation for display interfaces and related workflows.
  • Memory Interface Control Dedicated DDR/DDR2/LPDDR memory support and on-chip FIFO logic make the device suitable for buffering and timing-critical memory interfaces.
  • Embedded System Control Implement timers, counters, SPI/I²C masters/slaves, and glue functions for industrial controllers and instrumentation.

Unique Advantages

  • High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA provide strong interface density without a large PCB footprint.
  • Non-Volatile, Instant-On Capability: Family on-chip user flash allows single-chip, secure configuration with fast power-up behavior for systems that require immediate operation.
  • Flexible Clocking and PLLs: Multiple primary clocks and up to two PLLs enable precise timing control and support for diverse high-speed interfaces.
  • Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Low-Voltage Single-Supply Operation: Wide supply range (2.375 V–3.465 V) simplifies power design across different system architectures.
  • On-Chip Memory for Deterministic Buffering: Approximately 94 kbits of embedded RAM supports localized data storage and FIFO implementations.

Why Choose LCMXO2-4000HC-5BG256I?

The LCMXO2-4000HC-5BG256I positions itself as a practical, industrial-grade FPGA choice for designs that need mid-density logic, substantial I/O, and embedded memory in a compact caBGA/LFBGA footprint. Its combination of configurable logic (approximately 4,320 logic elements), on-chip RAM, and family-level non-volatile configuration memory supports reconfigurable system designs and in-field updates.

Engineers looking to consolidate glue logic, implement complex I/O handling, or add flexible control functions will find this MachXO2 device useful for scalable, robust embedded designs where supply-range flexibility and industrial temperature operation are required.

Request a quote or submit a purchase inquiry to get pricing, availability, and lead-time information for the LCMXO2-4000HC-5BG256I.

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