LCMXO2280E-4T144I

The LCMXO2280E-4T144I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging, power‑up control and general control logic. It combines non-volatile configuration with an FPGA-style architecture to deliver instant-on operation, in-field reconfiguration, and a high ratio of I/O to logic capacity.

Key device attributes include 2,280 logic elements, approximately 28.3kbits of on-chip RAM (total RAM bits reported as 28,262), 113 I/Os in a 144-pin LQFP/TQFP package, industrial operating range, and RoHS-compliant surface-mount packaging.

Key Features

• Core – Logic Elements 2,280 logic elements (LUT4-based) suitable for glue logic, bridging and control functions.
• Memory Total RAM bits reported as 28,262; MachXO family devices support sysMEM embedded block RAM (up to 27.6 Kbits in this family) and distributed RAM for buffered data and FIFOs.
• I/O and Package 113 programmable I/Os in a 144-LQFP (144-TQFP, 20×20 mm) surface-mount package; flexible sysIO buffer options are provided across the MachXO family.
• Non-volatile, Instant-on Configuration Single-chip, non-volatile architecture provides instant-on operation without external configuration memory and supports secure configuration storage.
• In-field Reconfiguration TransFR™ reconfiguration allows background or in-field logic updates while the system continues to operate; non-volatile and SRAM-based logic can be reprogrammed through the JTAG port.
• Low-power and Power Management Sleep mode capability enables significant static current reduction for power-sensitive designs.
• Clocking Up to two analog PLLs per device (family capability) for clock multiply/divide and phase shifting.
• System-level Support IEEE 1149.1 boundary-scan, IEEE 1532 in-system programming, onboard oscillator, and JTAG programmability are supported by the family.
• Voltage and Temperature Voltage supply: 1.14 V to 1.26 V. Operating temperature: −40 °C to 100 °C. Grade: Industrial.
• Compliance RoHS-compliant packaging.

Typical Applications

• Glue Logic and Board-level Control Implement glue logic, reset and power sequencing, and simple control state machines using the device’s immediate-availability configuration and logic resources.
• Bus Bridging and Interface Conversion Use the high I/O count and flexible sysIO buffering to implement bus bridging, protocol adaptation, and interface translation at the board level.
• Power-up and System Management Leverage instant-on non-volatile configuration and sleep mode for reliable power-up control and low-power standby management.
• Field-updatable Control Logic Apply TransFR reconfiguration for in-field logic updates and iterative feature deployment without full system downtime.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and reduces boot time by using non‑volatile on-chip storage.
• Reconfigurable in the field: TransFR and JTAG-based programming enable background updates and flexible maintenance models for deployed products.
• High I/O-to-logic ratio: 113 I/Os paired with 2,280 logic elements make the device well suited to I/O-heavy glue logic and interface tasks.
• Industrial temperature range: Rated for −40 °C to 100 °C, supporting a wide range of industrial applications.
• Power management options: Sleep mode allows substantial static current reduction for low-power designs.
• System integration features: Boundary-scan, in-system programming, and onboard oscillator simplify development, test and deployment.

Why Choose LCMXO2280E-4T144I?

The LCMXO2280E-4T144I positions itself as a compact, non-volatile FPGA choice for designers who need immediate availability at power-up, flexible in-field updates, and a strong balance of I/O and logic capacity. Its industrial temperature rating, surface-mount 144-LQFP package, and family-level features such as embedded block RAM and PLLs make it suitable for board-level control, interface bridging, and system management tasks.

For teams targeting reliable, configurable control logic with low BOM impact, this MachXO device offers a proven design flow and on-chip features that reduce external components while supporting field programmability and robust system-level integration.

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