LCMXO2280E-4TN144I

The LCMXO2280E-4TN144I is a MachXO family FPGA delivering 2,280 logic elements and approximately 28.3 Kbits (28,262 bits) of on-chip RAM in a 144-LQFP surface-mount package. Designed for control and glue-logic roles, this non-volatile device offers instant-on capability and single-chip configuration that removes the need for external configuration memory.

Targeted at industrial applications, the device provides up to 113 I/Os, a broad operating temperature range from −40 °C to 100 °C, and a core supply range of 1.14 V to 1.26 V, making it suitable for robust embedded designs that require compact, reconfigurable logic and high I/O density.

Key Features

• Core Logic — 2,280 logic elements for implementing glue logic, control paths, and low- to mid-density FPGA functions.
• On-Chip Memory — Approximately 28.3 Kbits (28,262 bits) of total RAM for embedded and distributed storage needs; suitable for small FIFOs and state storage.
• I/O Density — 113 general-purpose I/Os in the 144-LQFP package, providing flexible pinout options for signal interfacing.
• Non-Volatile Instant-On — Single-chip, non-volatile configuration enables microsecond power-up and eliminates external configuration memory.
• Reconfiguration & Background Programming — Supports in-field reconfiguration and background programming of non-volatile memory for updates while in service.
• Power Options & Low-Power Mode — Core supply specified at 1.14 V to 1.26 V and a Sleep Mode to reduce static current by up to 100×, supporting power-sensitive designs.
• Analog Clocking — Family-level support for up to two analog PLLs per device for clock multiply/divide and phase shifting (per MachXO family datasheet).
• Package & Mounting — 144-LQFP (20 × 20 mm TQFP package footprint) in a surface-mount form factor for standard PCB assembly processes.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environments.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic and System Integration — Replace discrete glue logic with dense, reprogrammable logic to simplify boards and reduce component count.
• Bus Bridging and Interfacing — Implement protocol translation and bus interfacing between different voltage domains or legacy peripherals using abundant I/O and embedded memory.
• Power-Up and Control Logic — Instant-on, single-chip configuration is well suited for power sequencing, reset control, and system supervision tasks.
• Embedded Control — Use local RAM and logic elements for deterministic control tasks, state machines, and small data buffering in industrial systems.

Unique Advantages

• Instant-On, Single-Chip Configuration: Eliminates external configuration memory and enables rapid power-up for time-sensitive systems.
• High I/O-to-Logic Density: 113 I/Os paired with 2,280 logic elements provide flexible interfacing without sacrificing logic capacity.
• In-Field Reprogrammability: Background programming and TransFR reconfiguration support in-service updates and iterative development.
• Low-Power Operation: Sleep Mode capability reduces static current substantially, aiding energy-conscious designs.
• Industrial Reliability: Specified operation across −40 °C to 100 °C and RoHS-compliant packaging meet common industrial deployment requirements.
• Compact Surface-Mount Package: 144-LQFP surface-mount package enables straightforward PCB integration in space-constrained designs.

Why Choose LCMXO2280E-4TN144I?

The LCMXO2280E-4TN144I positions itself as a compact, non-volatile FPGA solution for designs that require immediate availability of logic at power-up, ample I/O, and the ability to update functionality in the field. With 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM, and industrial temperature operation, it fits control, interfacing, and glue-logic roles in embedded and industrial systems.

Supported by the MachXO family architecture and the associated design toolflow, this device is appropriate for engineers looking to reduce BOM complexity, enable fast boot behavior, and maintain flexibility for future updates without adding external configuration components.

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