LCMXO2280E-5FT324C

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 370 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O271Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-5FT324C – MachXO FPGA, 2280 logic elements, 271 I/Os, 324-LBGA

The LCMXO2280E-5FT324C is a MachXO family field-programmable gate array (FPGA) offering 2,280 logic elements in a 324-ball low-profile BGA (324-FTBGA, 19×19) surface-mount package. Designed for glue-logic, bus bridging/interfacing, power-up control and general control logic, this commercial-grade device combines non-volatile, instant-on operation with flexible SRAM-based reconfiguration options.

This device targets applications that require high I/O count (271 I/Os) and compact packaging while operating within a low-voltage supply range. It delivers on-board reconfiguration features and system-level interfaces that simplify integration into embedded designs.

Key Features

  • Core Logic 2,280 logic elements provide the primary programmable resources for implementing glue logic, control paths and small to medium FPGA functions.
  • Non-Volatile Instant-On Single-chip non-volatile architecture with instant-on behavior (powers up in microseconds) and no external configuration memory required.
  • Reconfiguration and Programming Supports in-field reconfiguration (TransFR) and background programming of non-volatile memory; SRAM-based logic can be reconfigured in milliseconds and is programmable via JTAG.
  • On-Chip Memory Approximately 28,262 bits of on-chip RAM for embedded and distributed storage to support FIFOs, small buffers and state storage.
  • I/O and Package 271 user I/Os in a 324-LBGA (324-FTBGA, 19×19) surface-mount package—high pin-to-logic ratio for dense system interfaces.
  • Clocking and System Interfaces Family architecture includes support for up to two analog PLLs, IEEE 1149.1 boundary-scan and onboard oscillator options for flexible clocking and testability.
  • Power and Voltage Designed to operate from a low-voltage supply range of 1.14 V to 1.26 V and includes a Sleep Mode capability to reduce static current by up to 100×.
  • Commercial Grade and Environmental Commercial temperature range (0 °C to 85 °C) and RoHS-compliant packaging.

Typical Applications

  • Glue Logic and System Control Implement interconnect, startup sequencing and control-state machines that require compact, reconfigurable logic resources.
  • Bus Bridging and Interfacing Bridge and translate between multiple buses or I/O standards using the device’s high I/O count and programmable I/O buffers.
  • Power-Up and Reset Management Handle power sequencing, supervision and deterministic start-up behavior using non-volatile instant-on and on-chip control logic.
  • Field Upgrades and In-System Reconfiguration Enable in-field logic updates and background memory programming without removing the device from the system.

Unique Advantages

  • Instant-On Non-Volatile Operation: Eliminates external configuration memory and enables deterministic, microsecond-scale power-up behavior.
  • High I/O-to-Logic Density: 271 I/Os paired with 2,280 logic elements facilitate complex interfacing in a single compact package.
  • Flexible In-Field Updates: TransFR reconfiguration and JTAG-programmable non-volatile memory simplify firmware updates and iterative development.
  • Low-Voltage, Low-Power Modes: 1.14–1.26 V operation and a Sleep Mode for significant static current reduction support power-conscious designs.
  • System-Level Support: Boundary-scan (IEEE 1149.1), IEEE 1532 in-system programming support, and onboard clock options streamline board-level validation and manufacturing.
  • RoHS-Compliant Commercial Solution: Commercial temperature rating and lead-free packaging suitable for a wide range of embedded applications.

Why Choose LCMXO2280E-5FT324C?

The LCMXO2280E-5FT324C offers a balanced combination of non-volatile instant-on behavior, reconfigurable SRAM logic, and abundant I/O in a compact 324-ball BGA. It is well suited for embedded system designers seeking a single-chip solution for glue logic, bus interfacing, power-up control and in-field updates without adding external configuration components.

With its low-voltage operation, sleep mode for static current reduction, and family-level system features such as PLLs and boundary-scan, this MachXO device supports both rapid prototyping and stable production deployments where deterministic startup and field reconfigurability are priorities.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and lead times for the LCMXO2280E-5FT324C.

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