LCMXO2280E-5BN256C

The LCMXO2280E-5BN256C is a MachXO family FPGA optimized for glue logic, bus bridging, interfacing and general control applications. It combines non-volatile instant-on behavior with an FPGA-style architecture to deliver a single-chip, reconfigurable solution for commercial embedded designs.

Built around approximately 2,280 logic elements and on-chip memory, this surface-mount device targets designs that require high I/O density, fast startup and in-field reconfiguration while minimizing external configuration components.

Key Features

• Logic Capacity — Approximately 2,280 logic elements (LUT4 architecture) suitable for glue logic and control functions.
• On-Chip Memory — Total on-chip RAM of 28,262 bits providing embedded and distributed memory for small FIFOs, state machines and buffering.
• I/O Density — 211 I/Os to support extensive peripheral, bus and interface connectivity in a compact package.
• Non-Volatile Instant-On — Single-chip, non-volatile architecture provides instant-on operation and removes the need for external configuration memory.
• In-Field Reconfiguration — Supports background and in-system reprogramming through JTAG and TransFR™ reconfiguration for field updates.
• Power and Sleep — Core supply specified at 1.14 V to 1.26 V, with family-level sleep mode capability to dramatically reduce static current.
• Clocking — Family supports up to two analog PLLs for clock multiply, divide and phase shifting (family-level feature).
• Package & Mounting — 256-ball LFBGA/CSPBGA package (supplier package: 256-CABGA, 14×14 mm) in a surface-mount form factor.
• Commercial Grade & Thermal — Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Lead-free, RoHS-compliant packaging.

Typical Applications

• Glue Logic and System Control — Implement reset sequencing, address decoding and control state machines using the device’s logic elements and on-chip memory.
• Bus Bridging and Interfacing — Bridge disparate buses or implement custom interface translations leveraging the high I/O count.
• Power-Up and Sequencing Control — Use instant-on, single-chip non-volatile configuration to manage power-up sequencing and fast system availability.
• Field-Upgradeable Control Logic — Apply background programming and TransFR reconfiguration to update system logic in the field without removing the device.

Unique Advantages

• Single-Chip Non-Volatile Design: Eliminates external configuration memory and enables microsecond-scale power-up with secure bitstream handling.
• High I/O-to-Logic Ratio: 211 I/Os paired with ~2,280 logic elements supports dense interfacing without needing larger FPGA families.
• Field Reprogrammability: JTAG-based programming and background updates enable in-system maintenance and iterative feature deployment.
• Compact Surface-Mount Package: 256-ball CABGA (14×14 mm) package provides a small PCB footprint for space-constrained designs.
• Commercial Temperature Fit: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded products.

Why Choose LCMXO2280E-5BN256C?

The LCMXO2280E-5BN256C positions itself as an integrated, non-volatile FPGA option for designers needing instant-on responsiveness, high I/O count and in-field reconfiguration. With approximately 2,280 logic elements, 28,262 bits of on-chip RAM, and support for background programming, it is well suited to simplify BOMs for control, interface and sequencing functions in commercial products.

Choose this MachXO device when you need a compact, reconfigurable solution that balances logic capacity and I/O density while providing single-chip configuration and field-update capabilities backed by MachXO family features.

Request a quote or submit a pricing inquiry to evaluate the LCMXO2280E-5BN256C for your next embedded design.