LCMXO2280E-5FTN256C

The LCMXO2280E-5FTN256C is a MachXO family field programmable gate array (FPGA) optimized for control, glue logic and bus-interfacing applications. It combines non-volatile configuration, on-chip SRAM resources and a dense logic fabric to deliver instant-on, reconfigurable logic in a single, surface-mount package.

This commercial-grade device provides 2,280 logic elements, 28,262 bits of on-chip RAM and 211 I/O pins in a 256-ball LBGA package (supplier package: 256-FTBGA, 17×17). It is designed for applications requiring single-chip configuration, background programming and flexible I/O options while operating within a commercial temperature range.

Key Features

• Logic Capacity — 2,280 logic elements for implementing glue logic, control functions and low-capacity FPGA designs.
• On-Chip Memory — Total RAM: 28,262 bits of embedded memory for distributed and block RAM needs.
• I/O and Package — 211 user I/Os in a 256-ball LBGA package (supplier: 256-FTBGA, 17×17) with surface-mount mounting for compact board layouts.
• Non-Volatile, Instant-On — MachXO family capability for single-chip, non-volatile configuration enabling instant-on behavior without external configuration memory.
• Reconfiguration and Programming — Supports in-field reconfiguration and background programming; SRAM and non-volatile memory are programmable through the JTAG interface.
• Low-Power Modes — Sleep mode support for significant static current reduction during low-power states.
• Power Supply — Core voltage supply specified at 1.14 V to 1.26 V for this part; family devices support a range of system voltages as documented in the MachXO datasheet.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Glue Logic and System Control — Implements board-level glue logic and power-up sequencing where single-chip, non-volatile configuration and instant-on behavior simplify system design.
• Bus Bridging and Interfacing — Acts as a bridge between bus standards or manages protocol translation leveraging flexible I/O counts and on-chip RAM for buffering.
• Power-Up and Control Logic — Provides dedicated control logic and power sequencing functions with reconfigurable firmware for field updates.
• Peripheral and I/O Management — Handles user interface glue, sensor interfacing and peripheral control with 211 available I/Os in a compact LBGA package.

Unique Advantages

• Single-Chip, Non-Volatile Configuration: Eliminates the need for external configuration memory, enabling instant-on system behavior and improved design security.
• Reconfigurable In-Field: Background programming and TransFR reconfiguration support allow updates to logic while the system remains operational.
• High Pin-to-Logic Density: 211 I/Os matched to 2,280 logic elements provide an effective balance for control and interface-centric designs.
• Compact, Surface-Mount Package: 256-ball LBGA (256-FTBGA, 17×17) enables high-density PCB implementations without sacrificing I/O count.
• Toolchain and Ecosystem Support: MachXO family devices are supported by Lattice design tools that enable synthesis, placement and timing verification for efficient development.

Why Choose LCMXO2280E-5FTN256C?

The LCMXO2280E-5FTN256C is positioned for designers who need a compact, reconfigurable, non-volatile FPGA for control, interfacing and power-up roles in commercial systems. With 2,280 logic elements, 28,262 bits of on-chip RAM and 211 I/Os in a 256-ball LBGA, it provides a practical combination of logic density and I/O capability for glue logic, bus bridging and system control tasks.

Backed by MachXO family features such as instant-on configuration, in-field reprogramming and support from established FPGA design tools, this part is suited to teams seeking a single-chip solution that simplifies BOM, accelerates boot behavior and supports field updates without external configuration components.

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