LCMXO2280E-5FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 1,930 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-5FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA
The LCMXO2280E-5FT256C is a MachXO family FPGA device designed for glue logic, bus interfacing, control logic and power-up control applications. It combines a non-volatile, instant-on architecture with reconfigurable FPGA-style logic to deliver single-chip system integration without external configuration memory.
This device provides 2,280 logic elements, 28,262 bits of on-chip RAM, and 211 I/O pins in a 256-ball BGA package, making it suitable for compact commercial designs that require fast start-up, flexible I/O, and background reconfiguration capability.
Key Features
- Logic Capacity — 2,280 logic elements (LUT-based architecture) for implementing glue logic, bus bridges and control functions.
- On-chip Memory — Total RAM of 28,262 bits (approximately 27.6 Kbits) including embedded and distributed memory resources for state storage and FIFOs.
- I/O Density — 211 user I/O pins to support a wide range of interfaces and board-level connectivity in the 256-ball package.
- Non-volatile, Instant-on — Single-chip non-volatile architecture provides microsecond power-up and eliminates the need for external configuration memory.
- Background Reconfiguration and TFR — Supports in-field reconfiguration and background programming of non-volatile memory; TransFR™ Reconfiguration enables updates while the system operates.
- Low-power Modes — Sleep mode supports substantial static current reduction to minimize standby power.
- Programmable Clocking — MachXO family devices include up to two PLLs for clock multiply/divide and phase control (family-level feature applicable to this device).
- Package & Mounting — 256-ball LBGA (supplier package 256-FTBGA, 17×17 mm); surface-mount mounting for compact PCB integration.
- Power & Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
- Compliance — RoHS-compliant packaging.
Typical Applications
- Glue Logic and Board-Level Control — Replace discrete logic with reconfigurable on-chip logic for address decoding, control state machines and timing management.
- Bus Bridging and Interfacing — Implement protocol adaptation and signal routing where multiple I/O standards and dense pin counts are required.
- Power-Up and Reset Management — Use instant-on non-volatile configuration and control logic to manage system power sequencing and supervisory functions.
- Field-Upgradable Control Logic — Take advantage of TransFR™ reconfiguration for in-field updates to control firmware without interrupting system operation.
Unique Advantages
- Single-chip, non-volatile configuration: Eliminates external configuration memory and provides instant-on startup to simplify system BOM and boot behavior.
- High I/O-to-logic density: 211 I/Os with 2,280 logic elements allow dense interfacing while retaining ample logic resources for glue and control tasks.
- In-field reprogrammability: Background programming and TransFR reconfiguration let you update logic in deployed systems with minimal disruption.
- Low-power standby capability: Sleep mode provides a large reduction in static current for power-sensitive commercial applications.
- Compact BGA package: 256-ball BGA (256-FTBGA footprint) enables space-efficient PCB layouts for compact products.
- Toolchain support (family-level): MachXO devices are supported by ispLEVER design tools and common synthesis flows for integration into existing development processes.
Why Choose LCMXO2280E-5FT256C?
The LCMXO2280E-5FT256C positions itself as a compact, reprogrammable single-chip solution for commercial designs that require instant-on behavior, flexible I/O and on-chip memory. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM and 211 I/Os in a 256-ball BGA package makes it well suited to replacing discrete glue logic, implementing bus adapters, and handling control functions where space and fast start-up are priorities.
With non-volatile configuration, background programming, and family toolchain support, this MachXO device offers a pragmatic path to reduce BOM complexity while retaining field-update flexibility and predictable thermal/electrical characteristics for commercial temperature-range applications.
Request a quote or submit a pricing inquiry to evaluate the LCMXO2280E-5FT256C for your next design.

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