LCMXO2280E-5FT256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 1,930 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-5FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

The LCMXO2280E-5FT256C is a MachXO family FPGA device designed for glue logic, bus interfacing, control logic and power-up control applications. It combines a non-volatile, instant-on architecture with reconfigurable FPGA-style logic to deliver single-chip system integration without external configuration memory.

This device provides 2,280 logic elements, 28,262 bits of on-chip RAM, and 211 I/O pins in a 256-ball BGA package, making it suitable for compact commercial designs that require fast start-up, flexible I/O, and background reconfiguration capability.

Key Features

  • Logic Capacity — 2,280 logic elements (LUT-based architecture) for implementing glue logic, bus bridges and control functions.
  • On-chip Memory — Total RAM of 28,262 bits (approximately 27.6 Kbits) including embedded and distributed memory resources for state storage and FIFOs.
  • I/O Density — 211 user I/O pins to support a wide range of interfaces and board-level connectivity in the 256-ball package.
  • Non-volatile, Instant-on — Single-chip non-volatile architecture provides microsecond power-up and eliminates the need for external configuration memory.
  • Background Reconfiguration and TFR — Supports in-field reconfiguration and background programming of non-volatile memory; TransFR™ Reconfiguration enables updates while the system operates.
  • Low-power Modes — Sleep mode supports substantial static current reduction to minimize standby power.
  • Programmable Clocking — MachXO family devices include up to two PLLs for clock multiply/divide and phase control (family-level feature applicable to this device).
  • Package & Mounting — 256-ball LBGA (supplier package 256-FTBGA, 17×17 mm); surface-mount mounting for compact PCB integration.
  • Power & Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
  • Compliance — RoHS-compliant packaging.

Typical Applications

  • Glue Logic and Board-Level Control — Replace discrete logic with reconfigurable on-chip logic for address decoding, control state machines and timing management.
  • Bus Bridging and Interfacing — Implement protocol adaptation and signal routing where multiple I/O standards and dense pin counts are required.
  • Power-Up and Reset Management — Use instant-on non-volatile configuration and control logic to manage system power sequencing and supervisory functions.
  • Field-Upgradable Control Logic — Take advantage of TransFR™ reconfiguration for in-field updates to control firmware without interrupting system operation.

Unique Advantages

  • Single-chip, non-volatile configuration: Eliminates external configuration memory and provides instant-on startup to simplify system BOM and boot behavior.
  • High I/O-to-logic density: 211 I/Os with 2,280 logic elements allow dense interfacing while retaining ample logic resources for glue and control tasks.
  • In-field reprogrammability: Background programming and TransFR reconfiguration let you update logic in deployed systems with minimal disruption.
  • Low-power standby capability: Sleep mode provides a large reduction in static current for power-sensitive commercial applications.
  • Compact BGA package: 256-ball BGA (256-FTBGA footprint) enables space-efficient PCB layouts for compact products.
  • Toolchain support (family-level): MachXO devices are supported by ispLEVER design tools and common synthesis flows for integration into existing development processes.

Why Choose LCMXO2280E-5FT256C?

The LCMXO2280E-5FT256C positions itself as a compact, reprogrammable single-chip solution for commercial designs that require instant-on behavior, flexible I/O and on-chip memory. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM and 211 I/Os in a 256-ball BGA package makes it well suited to replacing discrete glue logic, implementing bus adapters, and handling control functions where space and fast start-up are priorities.

With non-volatile configuration, background programming, and family toolchain support, this MachXO device offers a pragmatic path to reduce BOM complexity while retaining field-update flexibility and predictable thermal/electrical characteristics for commercial temperature-range applications.

Request a quote or submit a pricing inquiry to evaluate the LCMXO2280E-5FT256C for your next design.

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