LCMXO2280E-5B256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 435 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-5B256C – MachXO Field Programmable Gate Array (FPGA) IC, 211 I/Os, 2280 logic elements

The LCMXO2280E-5B256C is a MachXO family FPGA IC offering non-volatile, instant-on programmability in a single-chip solution. Built for glue logic, bus bridging, power-up control and general control logic, this surface-mount device combines flexible I/O, embedded memory and reconfiguration capabilities for commercial electronic applications.

With 2280 logic elements and 211 available I/Os in a 256-ball LFBGA package, the device delivers a compact, integrable building block for system control and interface tasks while operating across a 1.14 V to 1.26 V supply range and a commercial temperature grade of 0°C to 85°C.

Key Features

  • Non-volatile, infinitely reconfigurable logic  Single-chip, instant-on operation with no external configuration memory required and support for background and JTAG programming.
  • Reconfiguration and in-field updates  Supports fast SRAM reconfiguration and TransFR™ reconfiguration for in-field logic updates while systems operate.
  • Logic density  2280 logic elements (LUT4-based) for implementing glue logic, state machines and interface control.
  • On-chip memory  Total on-chip RAM: 28,262 bits (approximately 27.6 Kbits) combining embedded block RAM and distributed RAM for FIFOs and small data buffers.
  • Flexible I/O  211 I/Os with programmable buffer support for a wide range of interfaces and signaling options suitable for system-level interfacing.
  • Clocking  Up to two analog sysCLOCK™ PLLs for clock multiply/divide and phase shifting to support diverse timing requirements.
  • Low-power modes  Sleep mode supports significant static current reduction for power-sensitive applications.
  • Package and mounting  256-LFBGA (256-CABGA, 14×14 mm footprint) surface-mount package suitable for compact board designs; RoHS compliant.
  • Commercial grade operation  Specified for 0°C to 85°C operating temperature range and a supply range of 1.14 V to 1.26 V.

Typical Applications

  • Glue Logic and System Control  Replace discrete glue logic with compact, reprogrammable logic for sequencing, reset and power-up control functions.
  • Bus Bridging and Interface Conversion  Implement bus bridging, protocol adaptation and custom I/O mapping using the device’s high I/O count and flexible buffers.
  • User Interface and Peripheral Control  Centralize LED, button, display and peripheral control logic in a single non-volatile device for instant-on responsiveness.
  • In-field Firmware Updates  Use TransFR™ reconfiguration to update control logic while the system remains operational, reducing downtime.

Unique Advantages

  • Single-chip, secure configuration: Eliminates external configuration memory and bitstream exposure with on-chip non-volatile storage for instant-on operation.
  • High I/O-to-logic ratio: 211 I/Os paired with 2280 logic elements makes it efficient for interface-heavy designs without excessive logic overprovisioning.
  • Integrated memory resources: Approximately 28 Kbits of on-chip RAM supports embedded buffers, FIFOs and small data storage without external RAM.
  • Field reprogrammability: Background programming and in-field reconfiguration enable design updates and feature additions post-deployment.
  • Compact, surface-mount package: 256-ball LFBGA (14×14 mm) delivers high pin count in a compact form factor for space-constrained PCBs.
  • Power-management features: Sleep mode provides large reductions in static current for lower-power standby operation.

Why Choose LCMXO2280E-5B256C?

The LCMXO2280E-5B256C positions itself as a practical, highly integrated FPGA solution for commercial designs that require instant-on behavior, robust I/O capability and in-field reconfiguration. Its combination of 2280 logic elements, substantial on-chip RAM and up to two PLLs make it well suited for glue logic, interface bridging and system control roles where board space and component count are important considerations.

Designed for commercial temperature ranges and delivered in a compact 256-LFBGA package, this MachXO device supports rapid prototyping and long-term design flexibility while minimizing external components and configuration complexity.

Request a quote or submit a sales inquiry to get pricing, availability and lead-time information for LCMXO2280E-5B256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up