LCMXO2280E-5FTN324C

The LCMXO2280E-5FTN324C is a MachXO family field-programmable gate array (FPGA) in a 324-ball BGA package optimized for glue logic, bus bridging/interfacing, power-up control and general control logic. It combines non-volatile, instant-on operation with a dense I/O to logic ratio, making it suitable for commercial embedded designs that require fast start-up and flexible in-system reconfiguration.

Key architectural highlights include 2,280 logic elements, 28,262 bits of on‑chip RAM, support for up to 271 I/Os in the 324-ball ftBGA (19×19 mm) package, and family-level features such as non-volatile configuration, sleep mode, and reconfiguration capabilities.

Key Features

• Logic Capacity — 2,280 logic elements (LUT-based architecture) for implementing glue logic, control paths and moderate-complexity FPGA functions.
• I/O Density — Up to 271 I/Os available in the 324-ball ftBGA (19×19 mm) package, enabling wide external connectivity and board-level integration.
• On‑chip Memory — Total on-chip RAM of 28,262 bits, comprised of embedded block RAM and distributed RAM to support FIFOs, small buffers and control-state storage.
• Non‑volatile, Instant‑on — Single-chip non-volatile architecture with instant-on behavior and no external configuration memory required (MachXO family characteristic).
• Reconfiguration and Sleep — Supports in-field reconfiguration (TransFR™) and a sleep mode that can reduce static current by up to 100× for power-sensitive applications.
• Flexible I/O Standards — Programmable I/O buffers support a range of interfaces and standards used across embedded systems (examples documented for the MachXO family include multiple LVCMOS levels, LVTTL, PCI, LVDS and other differential I/O flavors).
• Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting (MachXO family capability).
• Package and Mounting — 324-ball ftBGA / 324-LBGA package; surface-mount device for compact board designs.
• Supply and Temperature — Core supply documented at 1.14 V to 1.26 V; commercial operating range 0 °C to 85 °C.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic and Glue Reduction — Replace multiple discrete logic devices with a single FPGA to simplify board routing and reduce BOM in embedded control systems.
• Bus Bridging and Interfacing — Implement custom bus bridges, protocol translation and high pin-count interface logic using the device’s large I/O complement.
• Power‑up and System Control — Instant-on, non-volatile configuration and sleep-mode support make the device well-suited for power sequencing, reset control and board-level supervision.
• In‑field Logic Updates — Use TransFR™ reconfiguration for background or in-system updates to control logic while the rest of the system remains operational.

Unique Advantages

• Highly integrated single-chip solution: Non-volatile configuration and on-chip RAM eliminate the need for external configuration memory and simplify system design.
• Fast start-up: Instant-on architecture enables microsecond-scale boot behavior for applications requiring immediate availability after power-up.
• Scalable I/O and logic density: 271 I/Os paired with 2,280 logic elements provide a high I/O-to-logic ratio for complex interfacing tasks without excessive logic overhead.
• Low-power operational modes: Sleep mode capability supports large reductions in static current for energy-conscious designs.
• Flexible clocking and timing: Up to two PLLs allow local clock management including multiply/divide and phase adjustments for board-level timing control.
• Commercial-grade reliability and compliance: Designed for commercial temperature ranges (0 °C to 85 °C) with RoHS-compliant packaging for standard embedded products.

Why Choose LCMXO2280E-5FTN324C?

The LCMXO2280E-5FTN324C positions itself as a compact, non-volatile FPGA option for commercial embedded designs that need immediate start-up, in-field reconfiguration and a high number of I/Os. With 2,280 logic elements, 28,262 bits of on-chip RAM, and package options supporting 271 I/Os, it is well-suited for engineers replacing discrete glue logic, implementing bus interfaces, or adding system control and power-up sequencing.

Backed by MachXO family architecture and development flow, this device offers predictable integration into existing toolchains and migration paths across family densities, helping teams scale designs while maintaining a common architecture and board-level footprint.

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