LCMXO2280E-4MN132I

The LCMXO2280E-4MN132I is a MachXO family field programmable gate array (FPGA) IC featuring non-volatile on-chip configuration and a fabric optimized for glue logic and low-to-mid density control functions. It combines instant-on operation and single-chip configuration with a mix of embedded memory and flexible I/O to address bus interfacing, power-up sequencing, control logic and in-field updates.

Targeted at industrial applications, this device provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM and 101 user I/Os in a compact 132-ball CSPBGA package, with an operating range suited to industrial temperature environments.

Key Features

• Core Logic – 2,280 logic elements for implementing glue logic, control functions and mid-density FPGA designs.
• On-chip Memory – Approximately 28,262 bits of total on-chip RAM, including embedded block RAM and distributed RAM resources for FIFOs and small data buffers.
• I/O & Package – 101 general-purpose I/Os in a 132-ball LFBGA / 132-CSPBGA (8×8 mm) package, enabling compact board integration.
• Non-volatile, Instant-on Configuration – Single-chip, non-volatile configuration memory with instant-on capability and no external configuration memory required.
• Reconfiguration & In-field Updates – Supports fast SRAM reconfiguration and TransFR™ reconfiguration for in-field logic updates while the system operates; JTAG programmability and background programming are supported.
• Low-power Modes – Sleep mode support to reduce static current by up to 100× for power-sensitive use cases.
• Clocking – Up to two analog PLLs (family feature) for clock multiply/divide and phase shifting where needed.
• Flexible I/O Buffering – Programmable sysIO buffer family support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Electrical & Environmental – Voltage supply range 1.14 V to 1.26 V and industrial operating temperature range −40 °C to 100 °C. RoHS compliant packaging.

Typical Applications

• Glue Logic and System Integration – Implement bus bridging, signal multiplexing and control glue logic without external configuration memory.
• Power-up and Reset Control – Manage board-level power sequencing and reset state machines with instant-on capability.
• Bus Interfacing – Provide protocol bridging and I/O adaptation across multiple voltage domains using flexible I/O buffers.
• In-field FPGA Updates – Deploy and update control logic in the field using TransFR reconfiguration and JTAG-programmable non-volatile memory.

Unique Advantages

• Instant-on Single-chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and reducing board area.
• Compact, High I/O Density Package: 101 I/Os in a 132-ball CSPBGA (8×8 mm) package enables dense I/O routing in space-constrained designs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, suitable for a broad range of industrial environments.
• On-chip Memory Resources: Approximately 28,262 bits of on-chip RAM provide local buffering and small FIFO capability without external RAM.
• Power-saving Sleep Mode: Sleep mode reduces static current up to 100× for lower standby power consumption.
• In-field Updates and Security: Non-volatile configuration with background programming and JTAG access supports secure, field-updatable designs.

Why Choose LCMXO2280E-4MN132I?

The LCMXO2280E-4MN132I combines non-volatile instant-on configuration, a mid-density logic fabric and flexible I/O in a compact industrial-grade package. It is well suited to applications that need reliable, single-chip control logic, bus interfacing and in-field reconfiguration with minimal external components.

For engineers and designers seeking a compact FPGA solution that balances logic capacity, on-chip memory and I/O versatility while supporting industrial temperature requirements and low-power modes, this MachXO device offers a practical platform with proven architectural features.

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