LCMXO2280E-4FTN324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 527 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4FTN324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA
The LCMXO2280E-4FTN324C is a MachXO family FPGA combining non-volatile configuration with FPGA-style logic and embedded memory. Built for glue logic, bus bridging and control tasks, the device provides a compact, instant-on programmable fabric with high I/O count and integrated memory.
Key architectural highlights include 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM (total RAM bits listed as 28,262), up to 271 I/O pins, and support for background and in-field reconfiguration features documented for the MachXO family.
Key Features
- Logic Capacity — 2,280 logic elements available for implementing combinational and sequential logic functions.
- On-chip Memory — Total RAM bits: 28,262 (approximately 27.6 Kbits of embedded block RAM and additional distributed RAM as described for the MachXO family).
- I/O Density — 271 I/Os in the 324-ball package to support complex interfacing and high pin-count designs.
- Non-volatile, Instant-on Architecture — MachXO family capabilities include single-chip non-volatile configuration with instant-on behavior and in-field reconfiguration support.
- Reconfiguration and Programming — Supports background programming and JTAG-based programming; family-level support for TransFR™ reconfiguration and IEEE 1532 in-system programming.
- Clocking — MachXO family devices include up to two analog PLLs for clock multiply/divide and phase shifting.
- Power Supply — Specified operating supply range: 1.14 V to 1.26 V.
- Package and Mounting — 324-LBGA (supplier device package: 324-FTBGA, 19 × 19 mm) for surface-mount assembly.
- Operating Range and Grade — Commercial grade device with operating temperature range 0 °C to 85 °C.
- Standards and System Support — Family-level support for IEEE 1149.1 boundary scan and an onboard oscillator as described in the MachXO documentation.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Glue Logic and Board-level Control — Replace discrete combinational logic and simplify PCB routing by consolidating control functions into a single reprogrammable device.
- Bus Bridging and Interfacing — High I/O count and flexible I/O buffer options in the MachXO family make this device suitable for bus translation and protocol interfacing tasks.
- Power-up and Reset Control — Non-volatile instant-on behavior and reconfiguration capabilities support robust power sequencing and system initialization functions.
- Control Logic for Embedded Systems — Use the logic elements and embedded memory for state machines, peripheral control, and real-time control tasks in commercial products.
Unique Advantages
- Instant-on, Non-volatile Operation: Single-chip non-volatile configuration eliminates dependency on external configuration memory and enables rapid power-up behavior.
- High I/O-to-Logic Density: 271 I/Os paired with 2,280 logic elements enables dense signal interfacing without sacrificing logic resources.
- Integrated Memory Resources: Approximately 28.3 Kbits of on-chip RAM (total) supports FIFOs, buffers, and small embedded data storage without external SRAM.
- Field Update Capability: Support for background programming and TransFR reconfiguration enables in-field updates and incremental logic changes while minimizing system downtime.
- Compact Surface-Mount Package: 324-ball FTBGA package (19 × 19 mm) provides high pin count in a compact footprint suitable for space-constrained designs.
- Standards-based System Integration: Boundary-scan support and JTAG programmability simplify board-level testing and production programming workflows.
Why Choose LCMXO2280E-4FTN324C?
The LCMXO2280E-4FTN324C positions itself where CPLD-like instant-on and security meet FPGA-style flexibility: a non-volatile MachXO device with 2,280 logic elements, substantial on-chip RAM, and up to 271 I/Os in a 324-LBGA package. Its combination of reconfiguration features, integrated PLLs, and system-level support makes it well suited for commercial embedded designs that require compact, reprogrammable logic with fast start-up.
This part is a practical choice for engineers and system designers developing board-level glue logic, protocol bridges, or control subsystems that benefit from single-chip non-volatile configuration, flexible I/O, and integrated memory resources. The MachXO family documentation provides further design and programming details to support development and production workflows.
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