LCMXO2280E-4FTN324C

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 527 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O271Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4FTN324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

The LCMXO2280E-4FTN324C is a MachXO family FPGA combining non-volatile configuration with FPGA-style logic and embedded memory. Built for glue logic, bus bridging and control tasks, the device provides a compact, instant-on programmable fabric with high I/O count and integrated memory.

Key architectural highlights include 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM (total RAM bits listed as 28,262), up to 271 I/O pins, and support for background and in-field reconfiguration features documented for the MachXO family.

Key Features

  • Logic Capacity — 2,280 logic elements available for implementing combinational and sequential logic functions.
  • On-chip Memory — Total RAM bits: 28,262 (approximately 27.6 Kbits of embedded block RAM and additional distributed RAM as described for the MachXO family).
  • I/O Density — 271 I/Os in the 324-ball package to support complex interfacing and high pin-count designs.
  • Non-volatile, Instant-on Architecture — MachXO family capabilities include single-chip non-volatile configuration with instant-on behavior and in-field reconfiguration support.
  • Reconfiguration and Programming — Supports background programming and JTAG-based programming; family-level support for TransFR™ reconfiguration and IEEE 1532 in-system programming.
  • Clocking — MachXO family devices include up to two analog PLLs for clock multiply/divide and phase shifting.
  • Power Supply — Specified operating supply range: 1.14 V to 1.26 V.
  • Package and Mounting — 324-LBGA (supplier device package: 324-FTBGA, 19 × 19 mm) for surface-mount assembly.
  • Operating Range and Grade — Commercial grade device with operating temperature range 0 °C to 85 °C.
  • Standards and System Support — Family-level support for IEEE 1149.1 boundary scan and an onboard oscillator as described in the MachXO documentation.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Glue Logic and Board-level Control — Replace discrete combinational logic and simplify PCB routing by consolidating control functions into a single reprogrammable device.
  • Bus Bridging and Interfacing — High I/O count and flexible I/O buffer options in the MachXO family make this device suitable for bus translation and protocol interfacing tasks.
  • Power-up and Reset Control — Non-volatile instant-on behavior and reconfiguration capabilities support robust power sequencing and system initialization functions.
  • Control Logic for Embedded Systems — Use the logic elements and embedded memory for state machines, peripheral control, and real-time control tasks in commercial products.

Unique Advantages

  • Instant-on, Non-volatile Operation: Single-chip non-volatile configuration eliminates dependency on external configuration memory and enables rapid power-up behavior.
  • High I/O-to-Logic Density: 271 I/Os paired with 2,280 logic elements enables dense signal interfacing without sacrificing logic resources.
  • Integrated Memory Resources: Approximately 28.3 Kbits of on-chip RAM (total) supports FIFOs, buffers, and small embedded data storage without external SRAM.
  • Field Update Capability: Support for background programming and TransFR reconfiguration enables in-field updates and incremental logic changes while minimizing system downtime.
  • Compact Surface-Mount Package: 324-ball FTBGA package (19 × 19 mm) provides high pin count in a compact footprint suitable for space-constrained designs.
  • Standards-based System Integration: Boundary-scan support and JTAG programmability simplify board-level testing and production programming workflows.

Why Choose LCMXO2280E-4FTN324C?

The LCMXO2280E-4FTN324C positions itself where CPLD-like instant-on and security meet FPGA-style flexibility: a non-volatile MachXO device with 2,280 logic elements, substantial on-chip RAM, and up to 271 I/Os in a 324-LBGA package. Its combination of reconfiguration features, integrated PLLs, and system-level support makes it well suited for commercial embedded designs that require compact, reprogrammable logic with fast start-up.

This part is a practical choice for engineers and system designers developing board-level glue logic, protocol bridges, or control subsystems that benefit from single-chip non-volatile configuration, flexible I/O, and integrated memory resources. The MachXO family documentation provides further design and programming details to support development and production workflows.

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