LCMXO2280E-4FT324I

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 807 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LBGANumber of I/O271Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4FT324I – MachXO FPGA, 2280 logic elements, 271 I/Os, 324-LBGA

The LCMXO2280E-4FT324I is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. This non-volatile, instant-on device combines a high pin-to-pin I/O count with reconfigurable logic to address applications that require compact integration and flexible in-field updates.

Key architectural attributes include 2,280 logic elements, extensive on-chip memory, support for background and in-system programming, and a high I/O-to-logic density suitable for industrial embedded systems.

Key Features

  • Core Logic – 2,280 logic elements and 285 CLBs (configurable logic blocks) provide the programmable fabric for control and glue-logic functions.
  • On-chip Memory – Total RAM of 28,262 bits on the device; MachXO family devices include embedded block RAM (sysMEM) and distributed RAM with family support up to 27.6 Kbits EBR and up to 7.7 Kbits distributed RAM.
  • I/O Capacity – 271 I/Os on a 324-ball FT/BGA package enable high pin-count interfacing for complex bus and peripheral connections.
  • Non-volatile, Instant-on – Single-chip non-volatile architecture allows immediate operation on power-up without external configuration memory and supports in-system programming and background programming via JTAG.
  • Reconfiguration – TransFR™ (in-field logic update) and SRAM reconfiguration features enable rapid updates to logic while the system operates.
  • Power and Voltage – Operates from a core voltage range of 1.14 V to 1.26 V and includes sleep mode for significant static current reduction.
  • Clock and Timing – MachXO family devices support up to two analog PLLs for clock multiplication, division, and phase shifting.
  • Package & Mounting – Surface-mount 324-LBGA / 324-FTBGA (19×19) package for compact board-level integration.
  • Temperature & Grade – Industrial grade operation from −40 °C to 100 °C to meet embedded system environmental requirements.
  • Standards & Programming – IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming support, plus JTAG programming and an onboard oscillator.
  • Compliance – RoHS compliant packaging.

Typical Applications

  • Glue Logic and System Control – Implement power-up sequencing, reset control, and board-level glue logic using the device’s configurable logic and instant-on capability.
  • Bus Bridging and Interfacing – High I/O count and flexible I/O buffer support make the device suitable for bridging between buses and interfacing multiple peripherals.
  • Embedded Peripheral Control – Use the on-chip RAM and PLLs for local buffering and clocking in control and peripheral-management functions.
  • In-field Updatable Systems – TransFR reconfiguration and in-system programming enable field updates and fast iterative firmware/logic changes without removing the device.

Unique Advantages

  • Highly Integrated Solution: Combines non-volatile configuration, logic fabric and embedded memory on a single chip to reduce BOM and simplify board design.
  • Instant-on Operation: Single-chip non-volatile architecture eliminates the need for external configuration memory and enables immediate availability after power-up.
  • High I/O Density: 271 I/Os in a 324-ball package enable complex connectivity while preserving board area.
  • Flexible Field Updates: TransFR reconfiguration and JTAG-based programming support in-field logic updates with minimal system disruption.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to suit industrial embedded applications.
  • Standards-based Programming & Test: IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming simplify manufacturing test and in-field programming.

Why Choose LCMXO2280E-4FT324I?

The LCMXO2280E-4FT324I positions itself as a compact, non-volatile FPGA solution for embedded and industrial control designs that require immediate power-up, high I/O count and the ability to update logic in the field. Its combination of 2,280 logic elements, substantial on-chip memory, and family-supported PLL and I/O features delivers a balance of integration and flexibility for glue logic, bus interfacing, and system control tasks.

Designers and procurement teams targeting scalable, reconfigurable functionality in industrial environments will find the LCMXO2280E-4FT324I suitable for reducing board complexity while retaining in-system programmability and standards-based testability.

Request a quote or submit an inquiry to purchase the LCMXO2280E-4FT324I and evaluate how this MachXO device fits your next embedded or industrial design.

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