LCMXO2280E-4FT324I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 807 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4FT324I – MachXO FPGA, 2280 logic elements, 271 I/Os, 324-LBGA
The LCMXO2280E-4FT324I is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. This non-volatile, instant-on device combines a high pin-to-pin I/O count with reconfigurable logic to address applications that require compact integration and flexible in-field updates.
Key architectural attributes include 2,280 logic elements, extensive on-chip memory, support for background and in-system programming, and a high I/O-to-logic density suitable for industrial embedded systems.
Key Features
- Core Logic – 2,280 logic elements and 285 CLBs (configurable logic blocks) provide the programmable fabric for control and glue-logic functions.
- On-chip Memory – Total RAM of 28,262 bits on the device; MachXO family devices include embedded block RAM (sysMEM) and distributed RAM with family support up to 27.6 Kbits EBR and up to 7.7 Kbits distributed RAM.
- I/O Capacity – 271 I/Os on a 324-ball FT/BGA package enable high pin-count interfacing for complex bus and peripheral connections.
- Non-volatile, Instant-on – Single-chip non-volatile architecture allows immediate operation on power-up without external configuration memory and supports in-system programming and background programming via JTAG.
- Reconfiguration – TransFR™ (in-field logic update) and SRAM reconfiguration features enable rapid updates to logic while the system operates.
- Power and Voltage – Operates from a core voltage range of 1.14 V to 1.26 V and includes sleep mode for significant static current reduction.
- Clock and Timing – MachXO family devices support up to two analog PLLs for clock multiplication, division, and phase shifting.
- Package & Mounting – Surface-mount 324-LBGA / 324-FTBGA (19×19) package for compact board-level integration.
- Temperature & Grade – Industrial grade operation from −40 °C to 100 °C to meet embedded system environmental requirements.
- Standards & Programming – IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming support, plus JTAG programming and an onboard oscillator.
- Compliance – RoHS compliant packaging.
Typical Applications
- Glue Logic and System Control – Implement power-up sequencing, reset control, and board-level glue logic using the device’s configurable logic and instant-on capability.
- Bus Bridging and Interfacing – High I/O count and flexible I/O buffer support make the device suitable for bridging between buses and interfacing multiple peripherals.
- Embedded Peripheral Control – Use the on-chip RAM and PLLs for local buffering and clocking in control and peripheral-management functions.
- In-field Updatable Systems – TransFR reconfiguration and in-system programming enable field updates and fast iterative firmware/logic changes without removing the device.
Unique Advantages
- Highly Integrated Solution: Combines non-volatile configuration, logic fabric and embedded memory on a single chip to reduce BOM and simplify board design.
- Instant-on Operation: Single-chip non-volatile architecture eliminates the need for external configuration memory and enables immediate availability after power-up.
- High I/O Density: 271 I/Os in a 324-ball package enable complex connectivity while preserving board area.
- Flexible Field Updates: TransFR reconfiguration and JTAG-based programming support in-field logic updates with minimal system disruption.
- Industrial Temperature Range: Rated for −40 °C to 100 °C operation to suit industrial embedded applications.
- Standards-based Programming & Test: IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming simplify manufacturing test and in-field programming.
Why Choose LCMXO2280E-4FT324I?
The LCMXO2280E-4FT324I positions itself as a compact, non-volatile FPGA solution for embedded and industrial control designs that require immediate power-up, high I/O count and the ability to update logic in the field. Its combination of 2,280 logic elements, substantial on-chip memory, and family-supported PLL and I/O features delivers a balance of integration and flexibility for glue logic, bus interfacing, and system control tasks.
Designers and procurement teams targeting scalable, reconfigurable functionality in industrial environments will find the LCMXO2280E-4FT324I suitable for reducing board complexity while retaining in-system programmability and standards-based testability.
Request a quote or submit an inquiry to purchase the LCMXO2280E-4FT324I and evaluate how this MachXO device fits your next embedded or industrial design.