LCMXO2280E-4FT256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 652 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-4FT256I – MachXO FPGA, 2,280 logic elements, 211 I/Os, 256‑LBGA

The LCMXO2280E-4FT256I is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile, instant-on configuration with an array of LUT-based logic, embedded RAM and programmable I/O to deliver a compact, reconfigurable system element.

This device targets industrial-grade embedded designs that require up to 2,280 logic elements, 211 I/Os, in-system reconfiguration and on-chip memory, all in a 256‑ball BGA package with a -40 °C to 100 °C operating range.

Key Features

  • Non-volatile, instant-on configuration  Single-chip non-volatile architecture with no external configuration memory required; device powers up in microseconds and provides protection from bitstream interception.
  • Logic capacity  2,280 logic elements (with 285 CLBs) to implement glue logic, control paths and medium-complexity FPGA functions.
  • On-chip memory  Approximately 28 Kbits of total on-chip RAM (distributed and embedded block RAM) for state storage, FIFOs and small data buffers.
  • High I/O density  211 user I/Os supporting a wide range of standards through programmable sysIO buffers (LVCMOS, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, RSDS as supported by the family).
  • Programmable clocking  Up to two analog PLLs for clock multiplication, division and phase adjustment (family-supported feature).
  • Reconfiguration and programming  TransFR™ reconfiguration for in-field logic updates, JTAG programmability and IEEE 1532-compliant in-system programming.
  • Power and thermal  Core supply operating range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C; sleep mode enables significant static current reduction.
  • Package and mounting  Surface-mount 256‑LBGA / 256‑ftBGA (17×17 mm) package for compact board integration; RoHS compliant.
  • System support  Boundary-scan (IEEE 1149.1) and onboard oscillator support for system-level test and clocking needs.

Typical Applications

  • Glue logic and board-level control  Implement glue logic and power-up sequencing to consolidate discrete components and simplify board designs.
  • Bus bridging and interfacing  Bridge between bus standards and perform protocol adaptation using the programmable I/O and on-chip logic.
  • Control and sequencing  Implement system control state machines, watchdogs and startup sequencing with instant-on behavior and on-chip non-volatile configuration.
  • In-field updatable logic  Support field updates and iterative feature deployment using background programming and TransFR reconfiguration.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates external configuration memory for faster system startup and reduced BOM complexity.
  • High I/O-to-logic ratio: 211 I/Os paired with 2,280 logic elements allow efficient implementation of I/O-rich glue and interface functions.
  • Embedded RAM and FIFO support: On-chip memory (≈28 Kbits) supports buffering and state storage without external SRAM.
  • Industrial temperature range: Rated from -40 °C to 100 °C to match demanding board- and system-level thermal environments.
  • Compact BGA footprint: 256‑ball ftBGA (17×17 mm) package enables dense board integration while maintaining high pin count.
  • Standards and test support: Includes IEEE 1149.1 boundary-scan and IEEE 1532-compliant in-system programming for production testability and field updates.

Why Choose LCMXO2280E-4FT256I?

The LCMXO2280E-4FT256I is positioned for designers who need a reliable, non-volatile FPGA that combines instant-on operation, mid-range logic capacity and high I/O density in a compact package. Its on-chip RAM, programmable I/O standards, PLLs and in-field reconfiguration capabilities make it well suited for glue logic, bus interfacing and control tasks in industrial environments.

Supported by MachXO family features such as background programming, TransFR reconfiguration and design tool flow compatibility, this device provides scalability and in-field flexibility while reducing external component count and simplifying system architecture.

Request a quote or submit an inquiry to obtain pricing, availability and technical support for the LCMXO2280E-4FT256I.

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