LCMXO2280E-4FT256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 652 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4FT256I – MachXO FPGA, 2,280 logic elements, 211 I/Os, 256‑LBGA
The LCMXO2280E-4FT256I is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile, instant-on configuration with an array of LUT-based logic, embedded RAM and programmable I/O to deliver a compact, reconfigurable system element.
This device targets industrial-grade embedded designs that require up to 2,280 logic elements, 211 I/Os, in-system reconfiguration and on-chip memory, all in a 256‑ball BGA package with a -40 °C to 100 °C operating range.
Key Features
- Non-volatile, instant-on configuration Single-chip non-volatile architecture with no external configuration memory required; device powers up in microseconds and provides protection from bitstream interception.
- Logic capacity 2,280 logic elements (with 285 CLBs) to implement glue logic, control paths and medium-complexity FPGA functions.
- On-chip memory Approximately 28 Kbits of total on-chip RAM (distributed and embedded block RAM) for state storage, FIFOs and small data buffers.
- High I/O density 211 user I/Os supporting a wide range of standards through programmable sysIO buffers (LVCMOS, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, RSDS as supported by the family).
- Programmable clocking Up to two analog PLLs for clock multiplication, division and phase adjustment (family-supported feature).
- Reconfiguration and programming TransFR™ reconfiguration for in-field logic updates, JTAG programmability and IEEE 1532-compliant in-system programming.
- Power and thermal Core supply operating range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C; sleep mode enables significant static current reduction.
- Package and mounting Surface-mount 256‑LBGA / 256‑ftBGA (17×17 mm) package for compact board integration; RoHS compliant.
- System support Boundary-scan (IEEE 1149.1) and onboard oscillator support for system-level test and clocking needs.
Typical Applications
- Glue logic and board-level control Implement glue logic and power-up sequencing to consolidate discrete components and simplify board designs.
- Bus bridging and interfacing Bridge between bus standards and perform protocol adaptation using the programmable I/O and on-chip logic.
- Control and sequencing Implement system control state machines, watchdogs and startup sequencing with instant-on behavior and on-chip non-volatile configuration.
- In-field updatable logic Support field updates and iterative feature deployment using background programming and TransFR reconfiguration.
Unique Advantages
- Instant-on, single-chip configuration: Eliminates external configuration memory for faster system startup and reduced BOM complexity.
- High I/O-to-logic ratio: 211 I/Os paired with 2,280 logic elements allow efficient implementation of I/O-rich glue and interface functions.
- Embedded RAM and FIFO support: On-chip memory (≈28 Kbits) supports buffering and state storage without external SRAM.
- Industrial temperature range: Rated from -40 °C to 100 °C to match demanding board- and system-level thermal environments.
- Compact BGA footprint: 256‑ball ftBGA (17×17 mm) package enables dense board integration while maintaining high pin count.
- Standards and test support: Includes IEEE 1149.1 boundary-scan and IEEE 1532-compliant in-system programming for production testability and field updates.
Why Choose LCMXO2280E-4FT256I?
The LCMXO2280E-4FT256I is positioned for designers who need a reliable, non-volatile FPGA that combines instant-on operation, mid-range logic capacity and high I/O density in a compact package. Its on-chip RAM, programmable I/O standards, PLLs and in-field reconfiguration capabilities make it well suited for glue logic, bus interfacing and control tasks in industrial environments.
Supported by MachXO family features such as background programming, TransFR reconfiguration and design tool flow compatibility, this device provides scalability and in-field flexibility while reducing external component count and simplifying system architecture.
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