LCMXO2280E-4B256I

The LCMXO2280E-4B256I is a MachXO-series non-volatile FPGA device optimized for glue logic, bus bridging and control tasks. Built around a dense logic array with on-chip memory and extensive I/O, it targets embedded and industrial applications that require instant-on configuration, reconfigurability, and compact BGA packaging.

Key Features

• Logic Capacity — 2,280 logic elements for flexible implementation of glue logic, finite-state machines and control functions.
• On‑chip Memory — 28,262 bits of total RAM available for embedded and distributed storage, FIFOs and small buffers.
• I/O Density — 211 user I/Os in a 256-ball LFBGA/CSPBGA package to support broad peripheral and bus interfacing requirements.
• Non‑volatile, Instant‑on — Single‑chip non‑volatile configuration enables power‑up in microseconds without external configuration memory.
• Reconfiguration and Programming — Supports in-field reconfiguration and background programming via JTAG and TransFR reconfiguration mechanisms.
• Power Management — Sleep mode for substantial static current reduction during low‑activity periods.
• Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting.
• Flexible I/O Standards — Programmable sysIO buffers support LVCMOS (3.3/2.5/1.8/1.5/1.2V), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interfaces.
• Package & Mounting — 256‑LFBGA / CSPBGA (256‑caBGA, 14×14 mm footprint) surface‑mount package; RoHS compliant.
• Industrial Temperature Grade — Specified for −40°C to 100°C operation and a supply range of 1.14 V to 1.26 V.
• System Support — IEEE 1149.1 boundary scan, onboard oscillator and IEEE 1532 in‑system programming support.

Typical Applications

• Glue Logic — Implement address decoding, control glue, and signal conditioning to simplify board-level designs.
• Bus Bridging — Translate and bridge between bus standards while preserving compact board area and minimizing external components.
• Bus Interfacing — High I/O count enables broad peripheral connectivity and protocol interfacing in space-constrained systems.
• Power‑up and System Control — Instant-on non‑volatile configuration and sleep mode make it suitable for power sequencing and supervisory control.
• Control Logic — Implement finite-state machines, protocol controllers and custom control functions with fast reconfiguration options.

Unique Advantages

• Instant-on Non‑volatile Architecture: Powers up in microseconds without external configuration memory, reducing system complexity and boot time.
• High I/O to Logic Density: 211 I/Os paired with 2,280 logic elements delivers a compact solution for dense interfacing tasks in a 256‑ball BGA package.
• Field Reconfigurability: Supports background programming and TransFR reconfiguration for in‑field updates while the system operates.
• Low‑power Operation: Sleep mode enables significant static current reduction for energy‑sensitive applications.
• Flexible I/O Standards: Programmable buffers support multiple voltage levels and differential interfaces, simplifying mixed‑signal board designs.
• Industrial Reliability: Specified for −40°C to 100°C operation and RoHS‑compliant packaging for industrial deployments.

Why Choose LCMXO2280E-4B256I?

The LCMXO2280E-4B256I positions itself as a compact, non‑volatile FPGA solution for designers who need instant-on behaviour, strong I/O capability and in-field reconfigurability in an industrial-grade package. Its combination of 2,280 logic elements, 28,262 bits of on-chip RAM and up to 211 I/Os makes it well suited to replace multi-component glue logic and bridging schemes while simplifying BOM and board layout.

Backed by MachXO family support and design tool integration, the device is appropriate for engineers developing control, interface and system supervisory functions that benefit from fast boot, low standby power and the ability to update logic in the field.

Request a quote for LCMXO2280E-4B256I today to evaluate its fit for your next embedded or industrial design.