LCMXO2280E-3TN144I

The LCMXO2280E-3TN144I is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and system control logic. It combines non-volatile configuration and reconfigurable FPGA-style logic to deliver instant-on behavior in a single, surface-mount device.

With 2,280 logic elements, approximately 28,262 bits of on-chip RAM and 113 I/Os in a 144-pin LQFP package, this device targets industrial applications requiring compact, integrated control and interfacing solutions with wide operating temperature capability.

Key Features

• Logic Density  2,280 logic elements provide capacity for glue logic, state machines and control functions.
• On‑chip Memory  Approximately 28,262 total RAM bits of embedded and distributed memory for FIFOs, small buffers and state storage.
• I/O Count & Flexibility  113 user I/Os with programmable sysIO™ buffer support for a broad set of interface standards including LVCMOS (multiple levels), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS (as supported by MachXO family devices).
• Non‑volatile, Reconfigurable  Single-chip non-volatile configuration enables instant-on without external configuration memory and supports in-field reconfiguration and background programming.
• Low‑Power Modes  Sleep mode provides significant static current reduction for power-sensitive designs (MachXO family sleep mode feature).
• Clocking  Family-level support for up to two analog PLLs for clock multiply/divide and phase shifting (per MachXO family capabilities).
• Power Supply  Specified supply range: 1.14 V to 1.26 V.
• Package & Mounting  144-pin LQFP package (supplier device package: 144‑TQFP, 20 × 20 mm), surface-mount mounting type.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C.
• Standards & System Support  MachXO family includes features such as JTAG programmability, background non-volatile programming and IEEE 1149.1 boundary scan support (family-level).

Typical Applications

• Glue Logic and System Control  Implement control-state machines, reset sequencing and board-level glue logic in a compact, single-chip solution.
• Bus Bridging and Interfacing  Bridge or adapt signals between buses and protocols using flexible I/O standards and plentiful I/O pins.
• Power‑up and Sequencing Control  Power-up control and supervisory logic benefit from the device’s instant-on non-volatile configuration and sleep-mode power reduction.
• Embedded Control and Peripheral Management  Manage sensors, peripherals and user interface logic where moderate logic density and on-chip memory are required.

Unique Advantages

• Single‑chip Non‑volatile Configuration: Eliminates the need for external configuration memory and enables instant-on behavior for faster system availability.
• Balanced Logic-to‑I/O Ratio: 2,280 logic elements paired with 113 I/Os supports high I/O-to-logic designs common in interfacing and glue logic roles.
• Compact, Surface‑mount Package: 144-LQFP (144-TQFP, 20×20 mm) provides a space-efficient solution for board-level integration.
• Industrial Temperature Rating: −40 °C to 100 °C rating aligns with demanding environmental requirements for industrial applications.
• On‑chip Memory Resources: Approximately 28,262 bits of embedded and distributed RAM for buffering, FIFOs and small data structures without external memory.
• Power Management Features: Sleep mode capability from the MachXO family reduces static current for lower power operation when full functionality is not required.

Why Choose LCMXO2280E-3TN144I?

The LCMXO2280E-3TN144I combines MachXO family non-volatile configuration with FPGA-style logic density and flexible I/O in a single, industrial-grade surface-mount package. Its balance of 2,280 logic elements, substantial on-chip RAM and 113 I/Os makes it well suited for designers implementing glue logic, bus interfacing, power-up control and embedded system control where instant-on operation and in-field reconfiguration are valuable.

For teams seeking a compact, reconfigurable, single-chip solution with industrial temperature capability and a broad set of system-level features, this device delivers an integrated platform that simplifies board design and supports reliable long-term operation.

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