LCMXO2280E-4B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 180 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-4B256C – MachXO FPGA, 2,280 Logic Elements, 211 I/O, 256-LFBGA
The LCMXO2280E-4B256C is a MachXO field programmable gate array (FPGA) in a 256-ball LFBGA (caBGA) package designed for surface-mount applications. The device integrates 2,280 logic elements, 21,262+ on-chip RAM bits, and 211 user I/Os to address glue logic, bus bridging, control logic and other embedded control functions in commercial applications.
Built on the MachXO family architecture, the device combines non-volatile configuration, flexible I/O options and memory resources to deliver instant-on and reconfigurable system functions while maintaining a compact 14×14 mm package footprint.
Key Features
- Logic Capacity — 2,280 logic elements (LUT-based architecture) for implementing glue logic, control paths and small to medium FPGA functions.
- On‑chip Memory — 28,262 bits of total RAM available for embedded and distributed memory requirements, useful for FIFOs, state storage and small data buffers.
- High I/O Density — 211 user I/Os to support broad bus interfacing and multiple peripheral connections from a single device.
- Non‑volatile, Instant‑on Architecture — MachXO family features include single‑chip non‑volatile configuration that enables fast power-up without external configuration memory.
- Reconfiguration and Programming — Family-level support for in-field reconfiguration and background programming via JTAG and TransFR™ reconfiguration (TFR) capabilities.
- Flexible I/O Standards — MachXO family sysIO™ buffer support for a wide range of interfaces and standards (family-level feature set).
- Power and Temperature — Operates from 1.14 V to 1.26 V supply range; commercial temperature grade from 0 °C to 85 °C.
- Package and Mounting — 256-ball caBGA (14×14 mm) package, surface-mount mounting type, RoHS compliant.
Typical Applications
- Glue Logic and System Integration — Implement address decoding, bus arbitration and protocol bridging where compact, reconfigurable logic is required.
- Bus Interfacing and Bridging — Use the high I/O count and flexible I/O buffer support to bridge between different bus interfaces and voltage domains.
- Control and Power‑Up Sequencing — Non-volatile instant-on behavior and reprogrammability help manage startup sequencing and field updates.
- User Interface and Peripheral Control — Aggregate multiple peripheral signals and implement control logic for displays, sensors and board-level peripherals.
Unique Advantages
- Instant-on, Single‑Chip Configuration: Non-volatile architecture eliminates the need for external configuration memory for fast power-up and simplified BOM.
- High I/O Count with Compact Package: 211 I/Os in a 256-ball caBGA (14×14 mm) provides dense connectivity in a board-friendly footprint.
- On‑chip Memory for Control Tasks: 28,262 bits of embedded memory support FIFOs, small buffers and runtime state without external RAM.
- In‑field Reconfigurability: Family-level support for background programming and TransFR™ enables system updates with minimal downtime.
- Commercial Temperature and RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and lead‑free/RoHS compliant packaging for broad market use.
Why Choose LCMXO2280E-4B256C?
The LCMXO2280E-4B256C provides a balanced mix of logic capacity, I/O density and embedded memory in a single, non-volatile FPGA package suitable for commercial applications requiring instant-on functionality and in-field update capability. Its combination of 2,280 logic elements, 211 I/Os and 28,262 bits of on-chip RAM makes it well suited for designers consolidating glue logic, interface bridging and control functions onto a single device.
Backed by the MachXO family architecture and supported configuration features, this device is a practical choice for engineers seeking a compact, reconfigurable solution that simplifies system design and reduces external component count.
Request a quote or submit an inquiry to get pricing and availability for the LCMXO2280E-4B256C and to discuss how it can fit into your next design.

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