LCMXO2280E-3TN144C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP |
|---|---|
| Quantity | 851 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3TN144C – MachXO FPGA, 2280 logic elements, 113 I/O, 144-LQFP
The LCMXO2280E-3TN144C is a MachXO family field programmable gate array (FPGA) in a 144-pin LQFP/TQFP package designed for commercial embedded logic applications. It combines non-volatile configuration and FPGA-style lookup-table logic to address glue logic, bus bridging, power-up control and general control logic requirements.
With 2,280 logic elements and approximately 28 Kbits of on-chip RAM, the device targets designs that need instant-on configuration, flexible I/O and compact single-chip implementation while operating within a commercial temperature range.
Key Features
- Core Logic 2,280 logic elements (LUT-based) for implementing glue logic, finite-state machines and control functions.
- On-chip Memory Approximately 28 Kbits of total on-chip RAM (embedded and distributed) to support small data buffers and control-state storage.
- I/O Density 113 available I/O pins in the 144-pin package, enabling broad peripheral and bus interfacing in compact PCBs.
- Non-volatile Instant-On Family-level single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
- Reconfiguration & Programming Supports in-field reconfiguration and background programming capabilities for rapid updates and iterative development.
- Clocking Device family supports up to two analog PLLs for clock multiplication, division and phase control.
- Flexible I/O Standards (family-level) Programmable I/O buffers support a wide range of interfaces suitable for mixed-signal system designs.
- Power and Thermal Supply range specified at 1.14 V to 1.26 V for the device; commercial-grade operation from 0 °C to 85 °C.
- Package & Mounting 144-pin LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm); surface-mount mounting type for standard assembly processes.
- Regulatory RoHS compliant.
Typical Applications
- Glue Logic and System Control Implements glue logic and control-state machines to simplify board-level routing and reduce discrete logic count.
- Bus Bridging and Interfacing Provides adaptable I/O and reconfigurable logic for bridging between different bus standards or translating signals.
- Power-Up Sequencing Handles deterministic power-up control and reset sequencing using on-chip logic and configuration that is immediately available at power-up.
- Embedded Control Functions Serves as a compact, single-chip solution for device control, small FIFOs and peripheral management where instant configuration is required.
Unique Advantages
- Single-chip non-volatile configuration: Eliminates external configuration memory, simplifying BOM and board design.
- Instant-on capability: Ready-to-run behavior at power-up reduces system initialization time and simplifies system sequencing.
- Compact, high I/O package: 113 I/Os in a 144-pin surface-mount package enables dense pinouts without a large package footprint.
- On-chip memory and PLLs: Approximately 28 Kbits of RAM and up to two PLLs support buffering and flexible clocking for control and interface logic.
- Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial embedded products.
- Design tool ecosystem (family-level): Supported by the MachXO family design flow to simplify synthesis, place-and-route and in-system programming.
Why Choose LCMXO2280E-3TN144C?
The LCMXO2280E-3TN144C positions itself as a compact, non-volatile FPGA solution for commercial embedded designs that require instant-on configuration, flexible I/O and moderate logic and memory resources. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM, two PLLs and 113 I/Os in a 144-pin surface-mount package makes it well suited for board-level control, bus interfacing and power sequencing tasks.
Choose this part when you need a single-chip, reconfigurable solution that reduces external components, supports in-field updates and operates across standard commercial environments while maintaining RoHS compliance.
Request a quote or submit a quote today to evaluate the LCMXO2280E-3TN144C for your next embedded logic design.

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