LCMXO2280E-3TN144C

IC FPGA 113 I/O 144TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP

Quantity 851 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O113Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3TN144C – MachXO FPGA, 2280 logic elements, 113 I/O, 144-LQFP

The LCMXO2280E-3TN144C is a MachXO family field programmable gate array (FPGA) in a 144-pin LQFP/TQFP package designed for commercial embedded logic applications. It combines non-volatile configuration and FPGA-style lookup-table logic to address glue logic, bus bridging, power-up control and general control logic requirements.

With 2,280 logic elements and approximately 28 Kbits of on-chip RAM, the device targets designs that need instant-on configuration, flexible I/O and compact single-chip implementation while operating within a commercial temperature range.

Key Features

  • Core Logic  2,280 logic elements (LUT-based) for implementing glue logic, finite-state machines and control functions.
  • On-chip Memory  Approximately 28 Kbits of total on-chip RAM (embedded and distributed) to support small data buffers and control-state storage.
  • I/O Density  113 available I/O pins in the 144-pin package, enabling broad peripheral and bus interfacing in compact PCBs.
  • Non-volatile Instant-On  Family-level single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
  • Reconfiguration & Programming  Supports in-field reconfiguration and background programming capabilities for rapid updates and iterative development.
  • Clocking  Device family supports up to two analog PLLs for clock multiplication, division and phase control.
  • Flexible I/O Standards (family-level)  Programmable I/O buffers support a wide range of interfaces suitable for mixed-signal system designs.
  • Power and Thermal  Supply range specified at 1.14 V to 1.26 V for the device; commercial-grade operation from 0 °C to 85 °C.
  • Package & Mounting  144-pin LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm); surface-mount mounting type for standard assembly processes.
  • Regulatory  RoHS compliant.

Typical Applications

  • Glue Logic and System Control  Implements glue logic and control-state machines to simplify board-level routing and reduce discrete logic count.
  • Bus Bridging and Interfacing  Provides adaptable I/O and reconfigurable logic for bridging between different bus standards or translating signals.
  • Power-Up Sequencing  Handles deterministic power-up control and reset sequencing using on-chip logic and configuration that is immediately available at power-up.
  • Embedded Control Functions  Serves as a compact, single-chip solution for device control, small FIFOs and peripheral management where instant configuration is required.

Unique Advantages

  • Single-chip non-volatile configuration: Eliminates external configuration memory, simplifying BOM and board design.
  • Instant-on capability: Ready-to-run behavior at power-up reduces system initialization time and simplifies system sequencing.
  • Compact, high I/O package: 113 I/Os in a 144-pin surface-mount package enables dense pinouts without a large package footprint.
  • On-chip memory and PLLs: Approximately 28 Kbits of RAM and up to two PLLs support buffering and flexible clocking for control and interface logic.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial embedded products.
  • Design tool ecosystem (family-level): Supported by the MachXO family design flow to simplify synthesis, place-and-route and in-system programming.

Why Choose LCMXO2280E-3TN144C?

The LCMXO2280E-3TN144C positions itself as a compact, non-volatile FPGA solution for commercial embedded designs that require instant-on configuration, flexible I/O and moderate logic and memory resources. Its combination of 2,280 logic elements, approximately 28 Kbits of on-chip RAM, two PLLs and 113 I/Os in a 144-pin surface-mount package makes it well suited for board-level control, bus interfacing and power sequencing tasks.

Choose this part when you need a single-chip, reconfigurable solution that reduces external components, supports in-field updates and operates across standard commercial environments while maintaining RoHS compliance.

Request a quote or submit a quote today to evaluate the LCMXO2280E-3TN144C for your next embedded logic design.

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