LCMXO2280E-3TN100I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP |
|---|---|
| Quantity | 1,471 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3TN100I – MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP
The LCMXO2280E-3TN100I is a MachXO-series field programmable gate array optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic functions. It combines non-volatile instant-on behavior and reconfigurable FPGA architecture to support fast startup and in-field updates without external configuration memory.
With 2,280 logic elements, 73 I/Os in a 100-pin LQFP package, and an operating range from -40 °C to 100 °C, this device targets industrial embedded systems that require compact, reprogrammable logic with integrated on-chip memory and flexible I/O options.
Key Features
- Logic Capacity — Approximately 2,280 logic elements (LUT4s) for implementing glue logic, control functions and low-to-mid complexity FPGA designs.
- On‑Chip Memory — Total on-chip RAM of 28,262 bits for small buffers, state storage and lookup tables; the MachXO family supports both embedded block RAM and distributed RAM architectures.
- I/O and Packaging — 73 user I/Os available in a 100‑LQFP (100‑TQFP, 14×14 mm) package to support a wide range of peripheral and bus connections while keeping a compact footprint.
- Non‑Volatile, Instant‑On — Single-chip non‑volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
- Reconfiguration and Security — Infinitely reconfigurable architecture with support for background programming and in-field updates through TransFR reconfiguration and JTAG-based programming.
- Power and Temperature — Supports core supply voltages between 1.14 V and 1.26 V and operates across an industrial temperature range of -40 °C to 100 °C.
- Low Power Modes — Sleep mode capability to substantially reduce static current consumption for power-sensitive applications.
- System Support — Family-level features include up to two analog PLLs, on‑board oscillator, and IEEE 1149.1 boundary scan for system-level integration and testability.
- Standards‑Flexible I/O — Family supports programmable I/O buffers for common signaling standards (LVCMOS variants, LVTTL, LVDS, PCI and others), providing interface flexibility for diverse peripherals and buses.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- Glue Logic and Interface Bridging — Implement bus adapters and protocol translators to connect legacy and modern subsystems without large boards or external PLDs.
- Power‑Up and Reset Control — Implement deterministic power sequencing and system supervision logic that benefits from instant-on behavior and integrated reconfiguration.
- Embedded Control and State Machines — Replace discrete logic with programmable state machines and control logic for industrial controllers and instrumentation.
- Peripheral and Sensor Interfacing — Aggregate and preprocess signals from sensors or peripherals using the device’s flexible I/O and on-chip RAM for buffering.
Unique Advantages
- Instant system availability: Non-volatile single-chip configuration provides microsecond power-up without external memory, reducing BOM complexity.
- Field reprogrammability: TransFR and JTAG programming allow in-field updates and background programming for iterative firmware and hardware fixes.
- Compact integration: 73 I/Os and 2,280 logic elements in a 100‑LQFP package deliver substantial functionality in a small footprint for space-constrained designs.
- Industrial temperature capability: Rated for -40 °C to 100 °C to meet a broad range of industrial deployment environments.
- Flexible power options: Core supply compatibility with voltages around 1.14–1.26 V enables integration into modern multi‑rail power architectures.
- System and test features: Integrated PLLs, onboard oscillator and boundary-scan support ease clocking, timing control and manufacturing test.
Why Choose LCMXO2280E-3TN100I?
The LCMXO2280E-3TN100I positions itself as a compact, non-volatile FPGA solution for industrial embedded designs that need reliable instant-on behavior combined with field reprogrammability. Its mix of around 2,280 logic elements, substantial on-chip RAM, and 73 I/Os in a 100‑LQFP package makes it well suited for integrators replacing discrete logic, implementing bus bridges, or adding flexible control logic without external configuration devices.
This device provides a balance of integration, configurability and system-level support—helpful for design teams seeking to reduce BOM, speed time-to-market, and maintain the ability to update logic in the field while operating across standard industrial temperature ranges.
Request a quote or submit an RFQ to obtain pricing and availability for the LCMXO2280E-3TN100I and discuss your volume, lead-time or delivery requirements.