LCMXO2280E-3TN100I

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 1,471 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O73Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3TN100I – MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

The LCMXO2280E-3TN100I is a MachXO-series field programmable gate array optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic functions. It combines non-volatile instant-on behavior and reconfigurable FPGA architecture to support fast startup and in-field updates without external configuration memory.

With 2,280 logic elements, 73 I/Os in a 100-pin LQFP package, and an operating range from -40 °C to 100 °C, this device targets industrial embedded systems that require compact, reprogrammable logic with integrated on-chip memory and flexible I/O options.

Key Features

  • Logic Capacity — Approximately 2,280 logic elements (LUT4s) for implementing glue logic, control functions and low-to-mid complexity FPGA designs.
  • On‑Chip Memory — Total on-chip RAM of 28,262 bits for small buffers, state storage and lookup tables; the MachXO family supports both embedded block RAM and distributed RAM architectures.
  • I/O and Packaging — 73 user I/Os available in a 100‑LQFP (100‑TQFP, 14×14 mm) package to support a wide range of peripheral and bus connections while keeping a compact footprint.
  • Non‑Volatile, Instant‑On — Single-chip non‑volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
  • Reconfiguration and Security — Infinitely reconfigurable architecture with support for background programming and in-field updates through TransFR reconfiguration and JTAG-based programming.
  • Power and Temperature — Supports core supply voltages between 1.14 V and 1.26 V and operates across an industrial temperature range of -40 °C to 100 °C.
  • Low Power Modes — Sleep mode capability to substantially reduce static current consumption for power-sensitive applications.
  • System Support — Family-level features include up to two analog PLLs, on‑board oscillator, and IEEE 1149.1 boundary scan for system-level integration and testability.
  • Standards‑Flexible I/O — Family supports programmable I/O buffers for common signaling standards (LVCMOS variants, LVTTL, LVDS, PCI and others), providing interface flexibility for diverse peripherals and buses.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Glue Logic and Interface Bridging — Implement bus adapters and protocol translators to connect legacy and modern subsystems without large boards or external PLDs.
  • Power‑Up and Reset Control — Implement deterministic power sequencing and system supervision logic that benefits from instant-on behavior and integrated reconfiguration.
  • Embedded Control and State Machines — Replace discrete logic with programmable state machines and control logic for industrial controllers and instrumentation.
  • Peripheral and Sensor Interfacing — Aggregate and preprocess signals from sensors or peripherals using the device’s flexible I/O and on-chip RAM for buffering.

Unique Advantages

  • Instant system availability: Non-volatile single-chip configuration provides microsecond power-up without external memory, reducing BOM complexity.
  • Field reprogrammability: TransFR and JTAG programming allow in-field updates and background programming for iterative firmware and hardware fixes.
  • Compact integration: 73 I/Os and 2,280 logic elements in a 100‑LQFP package deliver substantial functionality in a small footprint for space-constrained designs.
  • Industrial temperature capability: Rated for -40 °C to 100 °C to meet a broad range of industrial deployment environments.
  • Flexible power options: Core supply compatibility with voltages around 1.14–1.26 V enables integration into modern multi‑rail power architectures.
  • System and test features: Integrated PLLs, onboard oscillator and boundary-scan support ease clocking, timing control and manufacturing test.

Why Choose LCMXO2280E-3TN100I?

The LCMXO2280E-3TN100I positions itself as a compact, non-volatile FPGA solution for industrial embedded designs that need reliable instant-on behavior combined with field reprogrammability. Its mix of around 2,280 logic elements, substantial on-chip RAM, and 73 I/Os in a 100‑LQFP package makes it well suited for integrators replacing discrete logic, implementing bus bridges, or adding flexible control logic without external configuration devices.

This device provides a balance of integration, configurability and system-level support—helpful for design teams seeking to reduce BOM, speed time-to-market, and maintain the ability to update logic in the field while operating across standard industrial temperature ranges.

Request a quote or submit an RFQ to obtain pricing and availability for the LCMXO2280E-3TN100I and discuss your volume, lead-time or delivery requirements.

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