LCMXO2280E-3T100I

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 431 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O73Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3T100I – MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

The LCMXO2280E-3T100I is a MachXO family FPGA optimized for glue logic, bus bridging/interfacing, power-up control and general control logic. It combines non-volatile, instant-on configuration with FPGA-style LUT-based logic and embedded memory to simplify system design.

As an industrial-grade, surface-mount device in a 100-LQFP (14×14 mm) package, it targets applications that require compact board footprint, predictable power-up behavior, and on-chip reconfiguration capabilities.

Key Features

  • Non-volatile, infinitely reconfigurable — Instant-on architecture with single-chip operation; no external configuration memory required. SRAM and non-volatile memory are programmable through JTAG and support background programming (datasheet).
  • Fast power-up — Powers up in microseconds for rapid system availability (datasheet).
  • In-field reconfiguration (TransFR) — Allows in-field logic updates while the system is operating.
  • Logic density — 2280 logic elements (LUT4s) delivering high I/O-to-logic density for glue logic and control tasks.
  • Embedded and distributed memory — Total on-chip RAM: 28262 bits; includes embedded block RAM (up to 27.6 Kbits) and distributed RAM (up to 7.7 Kbits) as provided in the MachXO family data.
  • Clocking — Two analog sysCLOCK PLLs for clock multiply/divide and phase shifting.
  • Flexible I/O — 73 I/Os on the 100-LQFP package; programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS (family-level features from datasheet).
  • Power and low-power modes — Voltage supply range 1.14 V to 1.26 V; sleep mode enables up to 100× static current reduction (datasheet).
  • Industrial temperature range — Rated for operation from −40°C to 100°C; RoHS compliant.
  • System-level support — IEEE 1149.1 boundary scan, onboard oscillator, IEEE 1532 in-system programming; supported by ispLEVER design tools (datasheet).

Typical Applications

  • Glue Logic — Implement custom combinatorial and sequential logic to simplify routing and reduce external components.
  • Bus Bridging & Interfacing — Bridge differing bus standards and manage protocol translation using the device’s flexible I/O and programmable buffers.
  • Power-up & System Control — Provide deterministic, microsecond-level power-up behavior and implement power sequencing and supervisory logic.
  • General Control Logic — Replace multiple discrete logic devices with a single integrated FPGA for board-area and BOM reduction.

Unique Advantages

  • Single-chip instant-on architecture: Eliminates external configuration memory to simplify BOM and speed system startup.
  • Secure configuration: Non-volatile on-chip configuration removes the external bitstream, reducing exposure to interception.
  • Field-updatable logic: TransFR enables in-field updates without taking the system offline.
  • High integration in compact package: 2280 logic elements and 73 I/Os in a 100-LQFP package reduce board area and component count.
  • Energy-efficient operation: Sleep mode delivers substantial static current reduction for lower standby power.
  • Industrial-rated robustness: −40°C to 100°C operation and RoHS compliance for demanding environments.

Why Choose LCMXO2280E-3T100I?

The LCMXO2280E-3T100I positions MachXO capabilities—non-volatile instant-on configuration, reconfigurable LUT-based logic, embedded RAM and PLLs—into a compact industrial-grade package. It is well suited to engineers who need deterministic power-up behavior, flexible I/O, and the ability to update logic in the field without external configuration devices.

Supported by the MachXO family design ecosystem and ispLEVER tools, this device enables density migration across the family while minimizing board complexity and supporting long-term design maintainability.

Request a quote or submit a quote to evaluate the LCMXO2280E-3T100I for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up