LCMXO2280E-3M132I

The LCMXO2280E-3M132I is a MachXO family FPGA device offering 2,280 logic elements and approximately 28,262 bits of on-chip RAM in a compact 132-CSPBGA (8×8 mm) package. Designed for industrial-grade embedded control and glue-logic roles, this non-volatile, infinitely reconfigurable device delivers instant-on behavior and single‑chip configuration without external configuration memory.

This device suits use cases such as bus bridging, I/O consolidation, power-up control and system glue logic where fast start-up, secure configuration and flexible I/O are valuable.

Key Features

• Logic Density  Provides 2,280 logic elements (LUT-based architecture) suitable for glue logic, control state machines and moderate combinational/sequential logic integration.
• Embedded Memory  Approximately 28,262 bits of on-chip RAM for distributed and embedded memory needs, including FIFO and small data buffers.
• I/O Capacity & Flexibility  101 user I/Os in the 132-CSPBGA package; MachXO family sysIO™ programmable buffers support a wide range of interface standards (family-level capability).
• Non-Volatile, Instant-On  Single-chip non-volatile configuration enables instant-on power-up in microseconds and eliminates the need for external configuration memory.
• In-Field Reconfiguration  Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates (MachXO family capability).
• Power & Supply  Core voltage range specified at 1.14 V to 1.26 V; includes sleep mode for significant static current reduction (MachXO family feature).
• Packaging & Temperature  132-LFBGA / 132-CSPBGA (8×8 mm) surface-mount package; industrial operating temperature range of −40 °C to 100 °C.
• System Support  Family-level features include IEEE 1149.1 boundary scan, in-system programming and support from MachXO design tools for synthesis and implementation.
• Compliance  RoHS compliant.

Typical Applications

• Glue Logic & Board Control  Consolidate discrete logic and control functions to simplify PCB routing and reduce BOM in embedded systems.
• Bus Bridging & Protocol Conversion  Implement bus interfacing and simple protocol bridging between subsystems with flexible I/O and on-chip memory for buffering.
• Power-Up & Reset Control  Provide deterministic, instant-on sequencing and power-up control logic without external configuration devices.
• Peripheral & Sensor Interfacing  Aggregate and manage multiple digital I/Os and small data buffers for sensor hubs, user interfaces, and peripheral control.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and enables microsecond power-up for faster system availability.
• Non-volatile reconfigurability: Stores configuration on-chip while supporting in-field updates and background programming for maintenance and feature updates.
• Compact, high‑I/O package: 101 I/Os in a 132-CSPBGA (8×8 mm) footprint enable dense I/O integration in space-constrained designs.
• Industrial-grade operation: Rated for −40 °C to 100 °C operation, suitable for demanding embedded environments.
• Robust tool and ecosystem support: MachXO family device support in vendor design tools enables synthesis, placement and timing flows for efficient development.

Why Choose LCMXO2280E-3M132I?

The LCMXO2280E-3M132I is positioned for engineers who need a compact, non-volatile FPGA with instant-on capability, moderate logic density and flexible I/O in an industrial-temperature package. Its single-chip configuration model and in-field reprogramming capabilities reduce system BOM and simplify secure deployment.

For applications requiring deterministic startup, I/O consolidation and on-chip memory for buffering or small data storage, this MachXO device provides a balanced combination of integration, reconfigurability and industrial robustness, backed by MachXO family design tool support.

Request a quote or submit a procurement inquiry to receive pricing and availability for the LCMXO2280E-3M132I.